年別の研究成果
年別の研究成果
検索結果
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2013
A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide
Fujita, M., Anzai, N., Sakamaki, K. & Kariya, Y., 2013 1月 1.研究成果: Paper › 査読
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2004
Fatigue life enhancement of low silver content Sn-Ag-Cu flip-chip interconnects by Ni addition
Kariya, Y., Hosoi, T., Kimura, T., Terashima, S., Tanaka, M. & Suga, T., 2004 9月 20, p. 103-108. 6 p.研究成果: Paper › 査読
4 被引用数 (Scopus)