年単位の研究成果
研究成果
2013
A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide
Fujita, M., Anzai, N., Sakamaki, K. & Kariya, Y., 2013 1 1.研究成果: Paper
2004
Fatigue life enhancement of low silver content Sn-Ag-Cu flip-chip interconnects by Ni addition
Kariya, Y., Hosoi, T., Kimura, T., Terashima, S., Tanaka, M. & Suga, T., 2004 9 20, p. 103-108. 6 p.研究成果: Paper
4
引用
（Scopus）