年別の研究成果
年別の研究成果
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2021
Thermal fatigue life prediction of BGA solder joints using a creep constitutive equation incorporating microstructural coarsening effect
Morooka, K. & Kariya, Y., 2021 2月 1, In: Materials Transactions. 62, 2, p. 205-212 8 p.研究成果: Article › 査読
2 被引用数 (Scopus) -
2020
Fatigue Crack Networks in the Die-Attach Joint of a Power Semiconductor Module During Power Cycling Testing and Effects of Test Parameters on the Joint Fatigue Life
Hosoya, K., Kariya, Y., Sugimoto, H. & Takahashi, K., 2020 10月 1, In: Journal of Electronic Materials. 49, 10, p. 6175-6186 12 p.研究成果: Article › 査読
3 被引用数 (Scopus) -
Novel fatigue crack propagation analysis of solder joint using singularity of strain energy density in the crack tip near field
Nakajima, Y., Kariya, Y. & Ono, K., 2020 10月 23, In: Materials Transactions. 61, 12, p. 2412-2418 7 p.研究成果: Article › 査読
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Reliability simulation with the finite element analysis (Fea) of redistribution layer in fan-out wafer level packaging
Okada, Y., Fujii, A., Ono, K. & Kariya, Y., 2020, In: Journal of Photopolymer Science and Technology. 33, 2, p. 171-176 6 p.研究成果: Article › 査読
Open Access -
2019
Evaluation of fatigue crack propagation behavior of pressurized sintered Ag nanoparticles and its application to thermal fatigue life prediction of sintered joint
Sato, T., Kariya, Y., Takahashi, H., Nakamura, T. & Aiko, Y., 2019, In: Materials Transactions. 60, 6, p. 850-857 8 p.研究成果: Article › 査読
4 被引用数 (Scopus) -
Evaluation of fatigue crack propagation of Sn5.0Sb/Cu joint using inelastic strain energy density
Nakajima, Y., Ono, K. & Kariya, Y., 2019, In: Materials Transactions. 60, 6, p. 876-881 6 p.研究成果: Article › 査読
3 被引用数 (Scopus) -
Influence of silica filler addition on fatigue crack propagation rate of underfill resin
Ishibashi, J., Kariya, Y., Satoh, T., Enomoto, T. & Yamaguchi, H., 2019, In: Materials Transactions. 60, 6, p. 902-908 7 p.研究成果: Article › 査読
1 被引用数 (Scopus) -
Measurements and FEM analyses of strain distribution in small Sn specimens with few crystal grains
Sasaki, T., Yanase, A., Okumura, D., Kariya, Y., Koganemaru, M. & Ikeda, T., 2019, In: Materials Transactions. 60, 6, p. 868-875 8 p.研究成果: Article › 査読
1 被引用数 (Scopus) -
2018
Effect of sintering temperature on fatigue crack propagation rate of sintered Ag nanoparticles
Kimura, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2018, In: Materials Transactions. 59, 4, p. 612-619 8 p.研究成果: Article › 査読
8 被引用数 (Scopus) -
Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via
Watanabe, K., Kariya, Y., Yajima, N., Obinata, K., Hiroshima, Y., Kikuchi, S., Matsui, A. & Shimizu, H., 2018 3月, In: Microelectronics Reliability. 82, p. 20-27 8 p.研究成果: Article › 査読
7 被引用数 (Scopus) -
2017
Influence of Temperature on Plastic Deformation Behavior and Mechanism of Bismuth Single Crystals
Yanaka, Y., Kariya, Y., Watanabe, H. & Hokazono, H., 2017 10月 3, (Accepted/In press) In: Journal of Electronic Materials. p. 1-10 10 p.研究成果: Article › 査読
1 被引用数 (Scopus) -
Low-Cycle Fatigue Life and Fatigue Crack Propagation of Sintered Ag Nanoparticles
Shioda, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2017 2月 1, In: Journal of Electronic Materials. 46, 2, p. 1155-1162 8 p.研究成果: Article › 査読
23 被引用数 (Scopus) -
2016
Effect of strain rate and temperature on micro fatigue crack propagation of Bi-Sn eutectic alloy
Taniguchi, M. & Kariya, Y., 2016 1月 1, In: Materials Transactions. 57, 6, p. 853-859 7 p.研究成果: Article › 査読
2 被引用数 (Scopus) -
Plastic deformation behavior and mechanism of bismuth single crystals in principal axes
Yanaka, Y., Kariya, Y., Watanabe, H. & Hokazono, H., 2016, In: Materials Transactions. 57, 6, p. 819-823 5 p.研究成果: Article › 査読
9 被引用数 (Scopus) -
Thermal fatigue life evaluation of epoxy resin/Si joint under mineral oil condition
Takahashi, H. & Kariya, Y., 2016, In: Materials Transactions. 57, 6, p. 805-809 5 p.研究成果: Article › 査読
1 被引用数 (Scopus) -
2013
Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy
Sato, T., Kariya, Y., Fukui, K., Matsuoka, H. & Yano, M., 2013, In: Journal of Japan Institute of Electronics Packaging. 16, 4, p. 293-299 7 p.研究成果: Article › 査読
3 被引用数 (Scopus) -
2012
Effect of Strain-Enhanced Microstructural Coarsening on the Cyclic Strain-Hardening Exponent of SnAgCu Joint
K, Y., a, A., Tasaka, Y. KT. & Kariya, Y., 2012 12月 1, In: Materials Transactions. 53, p. 2072-2077研究成果: Article › 査読
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Effect of strain-enhanced microstructural coarsening on the cyclic strain-hardening exponent of Sn-Ag-Cu joints
Kanda, Y., Kariya, Y. & Tasaka, T., 2012, In: Materials Transactions. 53, 12, p. 2072-2077 6 p.研究成果: Article › 査読
9 被引用数 (Scopus) -
Evaluation of creep properties for Sn-Ag-Cu micro solder joint by multi-temperature stress relaxation test
Kanda, Y. & Kariya, Y., 2012 7月 1, In: Microelectronics Reliability. 52, 7, p. 1435-1440 6 p.研究成果: Article › 査読
25 被引用数 (Scopus) -
Influence of Crystallographic Orientation on Fatigue Reliability of beta-Sn and beta-Sn Micro-joint
Kariya, Y., TAJIMA, Y. KS. & YAMADA, S., 2012 8月 29, In: Materials Transactions. 53研究成果: Article › 査読
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Influence of crystallographic orientation on fatigue reliability of β-Sn and β-Sn micro-joint
Kariya, Y., Tajima, S. & Yamada, S., 2012, In: Materials Transactions. 53, 12, p. 2067-2071 5 p.研究成果: Article › 査読
11 被引用数 (Scopus) -
Influence of cyclic strain-hardening exponent on fatigue ductility exponent for a Sn-Ag-Cu micro-solder joint
Kanda, Y., Kariya, Y. & Oto, Y., 2012 3月, In: Journal of Electronic Materials. 41, 3, p. 580-587 8 p.研究成果: Article › 査読
24 被引用数 (Scopus) -
Mechanical reliability of isotropic conductive adhesive
Kariya, Y., 2012 8月, In: Journal of Japan Institute of Electronics Packaging. 15, 5, p. 340-343 4 p.研究成果: Article › 査読
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2011
Basic study on Disassembly of Electronic Components by Allotropic Transformation of Sn
Takahashi, K. & Kariya, Y., 2011 12月 1, In: Proc. Of International Conference on Electronics Materials and Packaging. EMAP2011研究成果: Article › 査読
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Microstructure and Fatigue Damage of Eutectic Bi-Sn Alloy at High Temperature
Sato, T., K, Y., a, A. & Kariya, Y., 2011 12月 1, In: Proc. Of International Conference on Electronics Materials and Packaging. EMAP2011研究成果: Article › 査読
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Thermal Fatigue Life Prediction Model and Acceleration Factor for Sn-Ag-Cu Solder Joint
K, Y., a, A. & Kariya, Y., 2011 12月 1, In: Proc. Of International Conference on Electronics Materials and Packaging. EMAP2011研究成果: Article › 査読
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2010
Disassembly Technique of Solder Joint Using Allotropic Transformation of Tin
Hirano, Y. & Kariya, Y., 2010 3月 19, In: Default journal.研究成果: Article › 査読
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Influence of asymmetrical waveform on low-cycle fatigue life of micro solder joint
Kanda, Y. & Kariya, Y., 2010 2月 1, In: Journal of Electronic Materials. 39, 2, p. 238-245 8 p.研究成果: Article › 査読
16 被引用数 (Scopus) -
Influence of Inelastic Constitutive Equation on Fatigue Life Prediction of Sn-Ag-Cu Micro Solder Joint
K, Y., a, A., Zama, K. & Kariya, Y., 2010 5月 1, In: Proc. of ICEP2010. p. 1-6研究成果: Article › 査読
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Influence of temperature and dwelling time on low-cycle fatigue characteristic of isotropic conductive adhesive joint
Kariya, Y., Kanda, Y., Iguchi, K. & Furusawa, H., 2010 10月, In: Materials Transactions. 51, 10, p. 1779-1784 6 p.研究成果: Article › 査読
12 被引用数 (Scopus) -
2009
Basic Study on Disassembly Technique of Solder Joint Using Allotropic Transformation of Tin
Hirano, Y. & Kariya, Y. HK. UY., 2009 12月 1, In: EcoDesign2009. 6, p. 1233-1236研究成果: Article › 査読
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Effect of Visco-elasticity on Reliability Analysis of Flip-Chip Package
K, Y., a, A., Zama, K., Kariya, Y., Mikami, T., Kobayashi, T., Enomoto, T. & Hirata, K., 2009 7月 1, In: ASME-InterPACK. p. 755-759研究成果: Article › 査読
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Trends of conductive adhesives in electronics
Suganuma, K., Shindo, D., Ohtsuka, K. & Kariya, Y., 2009 1月, In: Journal of Japan Institute of Electronics Packaging. 12, 1, p. 79-85 7 p.研究成果: Article › 査読
3 被引用数 (Scopus) -
2008
Anisotropic Mechanical Properties of Sn-rich Lead-free Solder
Kariya, Y., 2008 5月 1, In: Default journal.研究成果: Article › 査読
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Effect of Aging on Tensile Properties of Low-Melting Lead-Free Solders Evaluated by Micro Size Specimen
Shohji, I., Osawa, T., Matsuki, T., Yasuda, K., Takemoto, T. & Kariya, Y., 2008 3月 1, In: Smart Processing Technology, High Temperature Society of Japan. p. 99-102研究成果: Article › 査読
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Effect of hold time on low cycle fatigue life of micro solder joint
Kanda, Y., Kariya, Y. & Mochizuki, Y., 2008 7月, In: Materials Transactions. 49, 7, p. 1524-1530 7 p.研究成果: Article › 査読
16 被引用数 (Scopus) -
Effect of specimen size and aging on tensile properties of Sn-Ag-Cu lead-free solders
Shohji, I., Osawa, T., Matsuki, T., Kariya, Y., Yasuda, K. & Takemoto, T., 2008 5月 1, In: Materials Transactions. 49, 5, p. 1175-1179 5 p.研究成果: Article › 査読
19 被引用数 (Scopus) -
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Mechanical characteristics of lead-free solder alloys in small volume
Kariya, Y., 2008 8月, In: Journal of Japan Institute of Electronics Packaging. 11, 5, p. 368-374 7 p.研究成果: Article › 査読
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2007
Low-cycle fatigue properties of eutectic solders at high temperatures
Kariya, Y. & Suga, T., 2007 5月 1, In: Fatigue and Fracture of Engineering Materials and Structures. 30, 5, p. 413-419 7 p.研究成果: Article › 査読
20 被引用数 (Scopus) -
Mechanical Properties
Kariya, Y., 2007, In: Yosetsu Gakkai Shi/Journal of the Japan Welding Society. 76, 2, p. 109-113 5 p.研究成果: Article › 査読
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Mechanical Properties of Lead-free Solder in Small Volume
Kariya, Y., 2007 5月 1, In: Default journal.研究成果: Article › 査読
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2006
Mechanical Reliability of Solders in Small Volume
Kariya, Y., 2006, In: Journal of Japan Institute of Electronics Packaging. 9, 3, p. 138-142 5 p.研究成果: Article › 査読
2 被引用数 (Scopus) -
2005
Isothermal Fatigue Properties of Lead-Free Solder Alloy Evaliated Miniature Size Specimen
Kariya, Y., Niimi, T. & Suga, T., 2005 7月 1, In: Default journal.研究成果: Article › 査読
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Isothermal Fatigue Properties of Lead-Free Solder Alloy Evaluated by Miniature Size Specimen
Kariya, Y., Niimi, T. & Suga, T., 2005 7月 1, In: Proc. of The 7th International Conference on ECOMATERIALS.研究成果: Article › 査読
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Isothermal fatigue properties of Sn-Ag-Cu alloy evaluated by micro size specimen
Kariya, Y., Niimi, T., Suga, T. & Otsuka, M., 2005 11月, In: Materials Transactions. 46, 11, p. 2309-2315 7 p.研究成果: Article › 査読
46 被引用数 (Scopus) -
Isothermal Fatigue Properties of Sn-Ag-Cu Alloy Evalulated by Micro Size Specimen
Kariya, Y., Niimi, T., Suga, T. & Otsuka, M., 2005 11月 15, In: Materials Transactions. 46, p. 2309-2315研究成果: Article › 査読
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Low Cycle Fatigue Properties of Solder Alloys Evaluated by Micro Bulk Specimen
Kariya, Y., Niimi, T. & Suga, T., 2005 7月 1, In: Default journal.研究成果: Article › 査読
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Low Cycle Fatigue Propreties of Solder Alloys Evaluated by Micro Bulk Specimen
Kariya, Y., Niimi, T. & Suga, T., 2005 7月 20, In: Proceedings of ASME International Electeronics Packing Technical Conference. 73165, p. 1-6研究成果: Article › 査読