Yoshiharu Kariya

2022

Class I Creep Deformation of Sn-Ag-Cu Containing Solid Solution Elements and Its Effect on Thermal Fatigue Life of Solder Joints

Moriuchi, M., Kariya, Y., Kondo, M. & Kanda, Y., 2022, In: Materials Transactions. 63, 6, p. 805-812 8 p.

研究成果: Article › 査読

Open Access

Fatigue Life Prediction of Die-Attach Joint in Power Semiconductors Subjected to Biaxial Stress by High-Speed Thermal Cycling

Kanai, H., Kariya, Y., Sugimoto, H., Abe, Y., Yokoyama, Y., Ochi, K., Hanada, R. & Soda, S., 2022, In: Materials Transactions. 63, 6, p. 759-765 7 p.

研究成果: Article › 査読

Open Access

2021

Thermal fatigue life prediction of BGA solder joints using a creep constitutive equation incorporating microstructural coarsening effect

Morooka, K. & Kariya, Y., 2021 2月 1, In: Materials Transactions. 62, 2, p. 205-212 8 p.

研究成果: Article › 査読

Open Access

2 被引用数 (Scopus)

2020

Fatigue Crack Networks in the Die-Attach Joint of a Power Semiconductor Module During Power Cycling Testing and Effects of Test Parameters on the Joint Fatigue Life

Hosoya, K., Kariya, Y., Sugimoto, H. & Takahashi, K., 2020 10月 1, In: Journal of Electronic Materials. 49, 10, p. 6175-6186 12 p.

研究成果: Article › 査読

4 被引用数 (Scopus)

Novel fatigue crack propagation analysis of solder joint using singularity of strain energy density in the crack tip near field

Nakajima, Y., Kariya, Y. & Ono, K., 2020 10月 23, In: Materials Transactions. 61, 12, p. 2412-2418 7 p.

研究成果: Article › 査読

Reliability simulation with the finite element analysis (Fea) of redistribution layer in fan-out wafer level packaging

Okada, Y., Fujii, A., Ono, K. & Kariya, Y., 2020, In: Journal of Photopolymer Science and Technology. 33, 2, p. 171-176 6 p.

研究成果: Article › 査読

Open Access

1 被引用数 (Scopus)

2019

Evaluation of fatigue crack propagation behavior of pressurized sintered Ag nanoparticles and its application to thermal fatigue life prediction of sintered joint

Sato, T., Kariya, Y., Takahashi, H., Nakamura, T. & Aiko, Y., 2019, In: Materials Transactions. 60, 6, p. 850-857 8 p.

研究成果: Article › 査読

5 被引用数 (Scopus)

Evaluation of fatigue crack propagation of Sn5.0Sb/Cu joint using inelastic strain energy density

Nakajima, Y., Ono, K. & Kariya, Y., 2019, In: Materials Transactions. 60, 6, p. 876-881 6 p.

研究成果: Article › 査読

5 被引用数 (Scopus)

Influence of silica filler addition on fatigue crack propagation rate of underfill resin

Ishibashi, J., Kariya, Y., Satoh, T., Enomoto, T. & Yamaguchi, H., 2019, In: Materials Transactions. 60, 6, p. 902-908 7 p.

研究成果: Article › 査読

1 被引用数 (Scopus)

Measurements and FEM analyses of strain distribution in small Sn specimens with few crystal grains

Sasaki, T., Yanase, A., Okumura, D., Kariya, Y., Koganemaru, M. & Ikeda, T., 2019, In: Materials Transactions. 60, 6, p. 868-875 8 p.

研究成果: Article › 査読

1 被引用数 (Scopus)

2018

Effect of sintering temperature on fatigue crack propagation rate of sintered Ag nanoparticles

Kimura, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2018, In: Materials Transactions. 59, 4, p. 612-619 8 p.

研究成果: Article › 査読

11 被引用数 (Scopus)

Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via

Watanabe, K., Kariya, Y., Yajima, N., Obinata, K., Hiroshima, Y., Kikuchi, S., Matsui, A. & Shimizu, H., 2018 3月, In: Microelectronics Reliability. 82, p. 20-27 8 p.

研究成果: Article › 査読

9 被引用数 (Scopus)

2017

Influence of Temperature on Plastic Deformation Behavior and Mechanism of Bismuth Single Crystals

Yanaka, Y., Kariya, Y., Watanabe, H. & Hokazono, H., 2017 10月 3, (Accepted/In press) In: Journal of Electronic Materials. p. 1-10 10 p.

研究成果: Article › 査読

1 被引用数 (Scopus)

Low-Cycle Fatigue Life and Fatigue Crack Propagation of Sintered Ag Nanoparticles

Shioda, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2017 2月 1, In: Journal of Electronic Materials. 46, 2, p. 1155-1162 8 p.

研究成果: Article › 査読

26 被引用数 (Scopus)

2016

Effect of strain rate and temperature on micro fatigue crack propagation of Bi-Sn eutectic alloy

Taniguchi, M. & Kariya, Y., 2016 1月 1, In: Materials Transactions. 57, 6, p. 853-859 7 p.

研究成果: Article › 査読

2 被引用数 (Scopus)

Plastic deformation behavior and mechanism of bismuth single crystals in principal axes

Yanaka, Y., Kariya, Y., Watanabe, H. & Hokazono, H., 2016, In: Materials Transactions. 57, 6, p. 819-823 5 p.

研究成果: Article › 査読

9 被引用数 (Scopus)

Thermal fatigue life evaluation of epoxy resin/Si joint under mineral oil condition

Takahashi, H. & Kariya, Y., 2016, In: Materials Transactions. 57, 6, p. 805-809 5 p.

研究成果: Article › 査読

1 被引用数 (Scopus)

2013

Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy

Sato, T., Kariya, Y., Fukui, K., Matsuoka, H. & Yano, M., 2013, In: Journal of Japan Institute of Electronics Packaging. 16, 4, p. 293-299 7 p.

研究成果: Article › 査読

4 被引用数 (Scopus)

2012

Effect of Strain-Enhanced Microstructural Coarsening on the Cyclic Strain-Hardening Exponent of SnAgCu Joint

K, Y., a, A., Tasaka, Y. KT. & Kariya, Y., 2012 12月 1, In: Materials Transactions. 53, p. 2072-2077

研究成果: Article › 査読

Effect of strain-enhanced microstructural coarsening on the cyclic strain-hardening exponent of Sn-Ag-Cu joints

Kanda, Y., Kariya, Y. & Tasaka, T., 2012, In: Materials Transactions. 53, 12, p. 2072-2077 6 p.

研究成果: Article › 査読

10 被引用数 (Scopus)

Evaluation of creep properties for Sn-Ag-Cu micro solder joint by multi-temperature stress relaxation test

Kanda, Y. & Kariya, Y., 2012 7月 1, In: Microelectronics Reliability. 52, 7, p. 1435-1440 6 p.

研究成果: Article › 査読

25 被引用数 (Scopus)

Influence of Crystallographic Orientation on Fatigue Reliability of beta-Sn and beta-Sn Micro-joint

Kariya, Y., TAJIMA, Y. KS. & YAMADA, S., 2012 8月 29, In: Materials Transactions. 53

研究成果: Article › 査読

Influence of crystallographic orientation on fatigue reliability of β-Sn and β-Sn micro-joint

Kariya, Y., Tajima, S. & Yamada, S., 2012, In: Materials Transactions. 53, 12, p. 2067-2071 5 p.

研究成果: Article › 査読

12 被引用数 (Scopus)

Influence of cyclic strain-hardening exponent on fatigue ductility exponent for a Sn-Ag-Cu micro-solder joint

Kanda, Y., Kariya, Y. & Oto, Y., 2012 3月, In: Journal of Electronic Materials. 41, 3, p. 580-587 8 p.

研究成果: Article › 査読

25 被引用数 (Scopus)

Mechanical reliability of isotropic conductive adhesive

Kariya, Y., 2012 8月, In: Journal of Japan Institute of Electronics Packaging. 15, 5, p. 340-343 4 p.

研究成果: Article › 査読

2011

Basic study on Disassembly of Electronic Components by Allotropic Transformation of Sn

Takahashi, K. & Kariya, Y., 2011 12月 1, In: Proc. Of International Conference on Electronics Materials and Packaging. EMAP2011

研究成果: Article › 査読

Microstructure and Fatigue Damage of Eutectic Bi-Sn Alloy at High Temperature

Sato, T., K, Y., a, A. & Kariya, Y., 2011 12月 1, In: Proc. Of International Conference on Electronics Materials and Packaging. EMAP2011

研究成果: Article › 査読

Thermal Fatigue Life Prediction Model and Acceleration Factor for Sn-Ag-Cu Solder Joint

K, Y., a, A. & Kariya, Y., 2011 12月 1, In: Proc. Of International Conference on Electronics Materials and Packaging. EMAP2011

研究成果: Article › 査読

2010

Disassembly Technique of Solder Joint Using Allotropic Transformation of Tin

Hirano, Y. & Kariya, Y., 2010 3月 19, In: Default journal.

研究成果: Article › 査読

Influence of asymmetrical waveform on low-cycle fatigue life of micro solder joint

Kanda, Y. & Kariya, Y., 2010 2月 1, In: Journal of Electronic Materials. 39, 2, p. 238-245 8 p.

研究成果: Article › 査読

16 被引用数 (Scopus)

Influence of Inelastic Constitutive Equation on Fatigue Life Prediction of Sn-Ag-Cu Micro Solder Joint

K, Y., a, A., Zama, K. & Kariya, Y., 2010 5月 1, In: Proc. of ICEP2010. p. 1-6

研究成果: Article › 査読

Influence of temperature and dwelling time on low-cycle fatigue characteristic of isotropic conductive adhesive joint

Kariya, Y., Kanda, Y., Iguchi, K. & Furusawa, H., 2010 10月, In: Materials Transactions. 51, 10, p. 1779-1784 6 p.

研究成果: Article › 査読

12 被引用数 (Scopus)

2009

Basic Study on Disassembly Technique of Solder Joint Using Allotropic Transformation of Tin

Hirano, Y. & Kariya, Y. HK. UY., 2009 12月 1, In: EcoDesign2009. 6, p. 1233-1236

研究成果: Article › 査読

Effect of Visco-elasticity on Reliability Analysis of Flip-Chip Package

K, Y., a, A., Zama, K., Kariya, Y., Mikami, T., Kobayashi, T., Enomoto, T. & Hirata, K., 2009 7月 1, In: ASME-InterPACK. p. 755-759

研究成果: Article › 査読

IEC 6237-1-5 Surface mounting technology, Environmental and endurance test methods for surface mount solder joint, Part 1-5:Mechanical shear fatigue test

Kariya, Y., 2009 2月 1, In: IEC International Standard. p. 1-41

研究成果: Article › 査読

Trends of conductive adhesives in electronics

Suganuma, K., Shindo, D., Ohtsuka, K. & Kariya, Y., 2009 1月, In: Journal of Japan Institute of Electronics Packaging. 12, 1, p. 79-85 7 p.

研究成果: Article › 査読

3 被引用数 (Scopus)

2008

Anisotropic Mechanical Properties of Sn-rich Lead-free Solder

Kariya, Y., 2008 5月 1, In: Default journal.

研究成果: Article › 査読

Effect of Aging on Tensile Properties of Low-Melting Lead-Free Solders Evaluated by Micro Size Specimen

Shohji, I., Osawa, T., Matsuki, T., Yasuda, K., Takemoto, T. & Kariya, Y., 2008 3月 1, In: Smart Processing Technology, High Temperature Society of Japan. p. 99-102

研究成果: Article › 査読

Effect of hold time on low cycle fatigue life of micro solder joint

Kanda, Y., Kariya, Y. & Mochizuki, Y., 2008 7月, In: Materials Transactions. 49, 7, p. 1524-1530 7 p.

研究成果: Article › 査読

16 被引用数 (Scopus)

Effect of specimen size and aging on tensile properties of Sn-Ag-Cu lead-free solders

Shohji, I., Osawa, T., Matsuki, T., Kariya, Y., Yasuda, K. & Takemoto, T., 2008 5月 1, In: Materials Transactions. 49, 5, p. 1175-1179 5 p.

研究成果: Article › 査読

20 被引用数 (Scopus)

IEC 62137-1-4 (Cyclic bending test)

Kariya, Y., 2008 3月 1, In: Default journal.

研究成果: Article › 査読

Mechanical characteristics of lead-free solder alloys in small volume

Kariya, Y., 2008 8月, In: Journal of Japan Institute of Electronics Packaging. 11, 5, p. 368-374 7 p.

研究成果: Article › 査読

2007

Low-cycle fatigue properties of eutectic solders at high temperatures

Kariya, Y. & Suga, T., 2007 5月 1, In: Fatigue and Fracture of Engineering Materials and Structures. 30, 5, p. 413-419 7 p.

研究成果: Article › 査読

21 被引用数 (Scopus)

Mechanical Properties

Kariya, Y., 2007, In: Yosetsu Gakkai Shi/Journal of the Japan Welding Society. 76, 2, p. 109-113 5 p.

研究成果: Article › 査読

Mechanical Properties of Lead-free Solder in Small Volume

Kariya, Y., 2007 5月 1, In: Default journal.

研究成果: Article › 査読

2006

Mechanical Reliability of Solders in Small Volume

Kariya, Y., 2006, In: Journal of Japan Institute of Electronics Packaging. 9, 3, p. 138-142 5 p.

研究成果: Article › 査読

2 被引用数 (Scopus)

2005

Isothermal Fatigue Properties of Lead-Free Solder Alloy Evaliated Miniature Size Specimen

Kariya, Y., Niimi, T. & Suga, T., 2005 7月 1, In: Default journal.

研究成果: Article › 査読

Isothermal Fatigue Properties of Lead-Free Solder Alloy Evaluated by Miniature Size Specimen

Kariya, Y., Niimi, T. & Suga, T., 2005 7月 1, In: Proc. of The 7th International Conference on ECOMATERIALS.

研究成果: Article › 査読

Isothermal fatigue properties of Sn-Ag-Cu alloy evaluated by micro size specimen

Kariya, Y., Niimi, T., Suga, T. & Otsuka, M., 2005 11月, In: Materials Transactions. 46, 11, p. 2309-2315 7 p.

研究成果: Article › 査読

47 被引用数 (Scopus)

Isothermal Fatigue Properties of Sn-Ag-Cu Alloy Evalulated by Micro Size Specimen

Kariya, Y., Niimi, T., Suga, T. & Otsuka, M., 2005 11月 15, In: Materials Transactions. 46, p. 2309-2315

研究成果: Article › 査読

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