検索結果
2022
Moriuchi, M. ,
Kariya, Y. ,
Kondo, M. &
Kanda, Y. ,
2022 ,
In: Materials Transactions. 63 ,
6 ,
p. 805-812 8 p. 研究成果: Article › 査読
Thermal Fatigue
100%
thermal fatigue
84%
fatigue life
78%
Solder
72%
Thermal fatigue
71%
Kanai, H. ,
Kariya, Y. ,
Sugimoto, H. ,
Abe, Y. ,
Yokoyama, Y. ,
Ochi, K. ,
Hanada, R. &
Soda, S. ,
2022 ,
In: Materials Transactions. 63 ,
6 ,
p. 759-765 7 p. 研究成果: Article › 査読
fatigue life
100%
Thermal Cycling
94%
Solder
92%
Thermal cycling
85%
Semiconductor materials
66%
2021
Thermal Fatigue
100%
thermal fatigue
84%
fatigue life
78%
Ball grid arrays
75%
Solder
72%
2020
Hosoya, K. ,
Kariya, Y. ,
Sugimoto, H. &
Takahashi, K. ,
2020 10月 1 ,
In: Journal of Electronic Materials. 49 ,
10 ,
p. 6175-6186 12 p. 研究成果: Article › 査読
fatigue life
100%
Semiconductor materials
66%
cracks
57%
Semiconductor
56%
Fatigue of materials
51%
Crack Propagation
100%
Strain Energy
91%
Solder
88%
solders
79%
crack propagation
77%
Okada, Y. ,
Fujii, A. ,
Ono, K. &
Kariya, Y. ,
2020 ,
In: Journal of Photopolymer Science and Technology. 33 ,
2 ,
p. 171-176 6 p. 研究成果: Article › 査読
Fans
100%
Packaging
96%
Polymers
78%
Simulation
67%
Finite element method
66%
2019
Sato, T. ,
Kariya, Y. ,
Takahashi, H. ,
Nakamura, T. &
Aiko, Y. ,
2019 ,
In: Materials Transactions. 60 ,
6 ,
p. 850-857 8 p. 研究成果: Article › 査読
Thermal Fatigue
100%
Silver nanoparticles
84%
thermal fatigue
84%
Crack Propagation
81%
fatigue life
78%
Crack Propagation
100%
Strain Energy
91%
crack propagation
77%
Strain energy
76%
Fatigue crack propagation
73%
Ishibashi, J. ,
Kariya, Y. ,
Satoh, T. ,
Enomoto, T. &
Yamaguchi, H. ,
2019 ,
In: Materials Transactions. 60 ,
6 ,
p. 902-908 7 p. 研究成果: Article › 査読
Crack Propagation
100%
crack propagation
77%
Silica
73%
Fatigue crack propagation
73%
resins
71%
Sasaki, T. ,
Yanase, A. ,
Okumura, D. ,
Kariya, Y. ,
Koganemaru, M. &
Ikeda, T. ,
2019 ,
In: Materials Transactions. 60 ,
6 ,
p. 868-875 8 p. 研究成果: Article › 査読
strain distribution
100%
Crystals
84%
Strain
59%
Strain Hardening
59%
Finite element method
52%
2018
Kimura, R. ,
Kariya, Y. ,
Mizumura, N. &
Sasaki, K. ,
2018 ,
In: Materials Transactions. 59 ,
4 ,
p. 612-619 8 p. 研究成果: Article › 査読
Silver nanoparticles
100%
Crack Propagation
96%
crack propagation
74%
Fatigue crack propagation
70%
Sintering
65%
Watanabe, K. ,
Kariya, Y. ,
Yajima, N. ,
Obinata, K. ,
Hiroshima, Y. ,
Kikuchi, S. ,
Matsui, A. &
Shimizu, H. ,
2018 3月 ,
In: Microelectronics Reliability. 82 ,
p. 20-27 8 p. 研究成果: Article › 査読
Thermal Fatigue
100%
thermal fatigue
84%
fatigue life
78%
Thermal fatigue
71%
Fatigue testing
69%
2017
Bismuth
100%
Plastic Deformation
93%
Shear Stress
89%
Single crystals
86%
bismuth
73%
Shioda, R. ,
Kariya, Y. ,
Mizumura, N. &
Sasaki, K. ,
2017 2月 1 ,
In: Journal of Electronic Materials. 46 ,
2 ,
p. 1155-1162 8 p. 研究成果: Article › 査読
Silver nanoparticles
100%
Crack Propagation
96%
fatigue life
92%
Crack Initiation
89%
crack propagation
74%
2016
Crack Propagation
100%
eutectic alloys
90%
crack propagation
77%
Eutectics
75%
Fatigue crack propagation
73%
Yanaka, Y. ,
Kariya, Y. ,
Watanabe, H. &
Hokazono, H. ,
2016 ,
In: Materials Transactions. 57 ,
6 ,
p. 819-823 5 p. 研究成果: Article › 査読
Bismuth
100%
Plastic Deformation
93%
Single crystals
86%
bismuth
73%
Plastic deformation
66%
Thermal Fatigue
100%
thermal fatigue
84%
mineral oils
82%
fatigue life
78%
Mineral oils
72%
2013
Sato, T. ,
Kariya, Y. ,
Fukui, K. ,
Matsuoka, H. &
Yano, M. ,
2013 ,
In: Journal of Japan Institute of Electronics Packaging. 16 ,
4 ,
p. 293-299 7 p. 研究成果: Article › 査読
Eutectics
100%
Strain rate
87%
Fatigue of materials
65%
Temperature
37%
Grain boundary sliding
34%
2012
Strain Hardening
100%
Coarsening
87%
strain hardening
80%
Intermetallic Compound
76%
Intermetallics
76%
creep properties
100%
Stress Relaxation
96%
Solder
89%
Creep
88%
Stress relaxation
86%
Strain Energy
100%
Thermal Fatigue
67%
Single crystals
60%
Strain energy
56%
Single Crystalline Solid
55%
Strain Hardening
100%
Ductility
84%
strain hardening
80%
solders
80%
Strain hardening
73%
2011
2010
fatigue life
100%
Solder
92%
solders
83%
Soldering alloys
73%
waveforms
65%
Kariya, Y. ,
Kanda, Y. ,
Iguchi, K. &
Furusawa, H. ,
2010 10月 ,
In: Materials Transactions. 51 ,
10 ,
p. 1779-1784 6 p. 研究成果: Article › 査読
Adhesive joints
100%
dwell
96%
fatigue life
84%
adhesives
77%
Fatigue of materials
54%
2009
K, Y. ,
a, A. ,
Zama, K. ,
Kariya, Y. ,
Mikami, T. ,
Kobayashi, T. ,
Enomoto, T. &
Hirata, K. ,
2009 7月 1 ,
In: ASME-InterPACK. p. 755-759 研究成果: Article › 査読
Suganuma, K. ,
Shindo, D. ,
Ohtsuka, K. &
Kariya, Y. ,
2009 1月 ,
In: Journal of Japan Institute of Electronics Packaging. 12 ,
1 ,
p. 79-85 7 p. 研究成果: Article › 査読
2008
Shohji, I. ,
Osawa, T. ,
Matsuki, T. ,
Yasuda, K. ,
Takemoto, T. &
Kariya, Y. ,
2008 3月 1 ,
In: Smart Processing Technology, High Temperature Society of Japan. p. 99-102 研究成果: Article › 査読
fatigue life
100%
Solder
92%
solders
83%
Soldering alloys
73%
Fatigue of materials
51%
Shohji, I. ,
Osawa, T. ,
Matsuki, T. ,
Kariya, Y. ,
Yasuda, K. &
Takemoto, T. ,
2008 5月 1 ,
In: Materials Transactions. 49 ,
5 ,
p. 1175-1179 5 p. 研究成果: Article › 査読
Lead-free solders
100%
tensile properties
90%
solders
90%
Eutectics
85%
Tensile properties
82%
2007
Solder
100%
Eutectics
85%
Soldering alloys
79%
Grain boundary sliding
71%
Alloy
56%
2006
2005
Kariya, Y. ,
Niimi, T. ,
Suga, T. &
Otsuka, M. ,
2005 11月 ,
In: Materials Transactions. 46 ,
11 ,
p. 2309-2315 7 p. 研究成果: Article › 査読
fatigue life
100%
Alloy
91%
Fatigue of materials
90%
Solder
46%
solders
41%