苅谷 義治

研究成果

年別の研究成果 1993 2021

• 1543 被引用数
• 21 h-index
• 101 Article
• 20 Conference contribution
• 3 Editorial
• 2 Paper
• 1 その他
  • 1 Conference article

年別の研究成果

年別の研究成果

検索結果

• 2021

  Thermal fatigue life prediction of BGA solder joints using a creep constitutive equation incorporating microstructural coarsening effect

  Morooka, K. & Kariya, Y., 2021 2 1, In: Materials Transactions. 62, 2, p. 205-212 8 p.

  研究成果: Article › 査読

  • thermal fatigue
  • fatigue life
  • Ball grid arrays
  • Thermal fatigue
  • Coarsening
• 2020

  Fatigue Crack Networks in the Die-Attach Joint of a Power Semiconductor Module During Power Cycling Testing and Effects of Test Parameters on the Joint Fatigue Life

  Hosoya, K., Kariya, Y., Sugimoto, H. & Takahashi, K., 2020 10 1, In: Journal of Electronic Materials. 49, 10, p. 6175-6186 12 p.

  研究成果: Article › 査読

  • fatigue life
  • Semiconductor materials
  • cracks
  • Fatigue of materials
  • Cracks
  1 被引用数 (Scopus)

• Novel fatigue crack propagation analysis of solder joint using singularity of strain energy density in the crack tip near field

  Nakajima, Y., Kariya, Y. & Ono, K., 2020 10 23, In: Materials Transactions. 61, 12, p. 2412-2418 7 p.

  研究成果: Article › 査読

  • solders
  • crack propagation
  • Strain energy
  • crack tips
  • Fatigue crack propagation

• Reliability simulation with the finite element analysis (Fea) of redistribution layer in fan-out wafer level packaging

  Okada, Y., Fujii, A., Ono, K. & Kariya, Y., 2020, In: Journal of Photopolymer Science and Technology. 33, 2, p. 171-176 6 p.

  研究成果: Article › 査読

  Open Access

  • Fans
  • Polymers
  • Packaging
  • Finite element method
  • Energy release rate
• 2019

  Evaluation of fatigue crack propagation behavior of pressurized sintered Ag nanoparticles and its application to thermal fatigue life prediction of sintered joint

  Sato, T., Kariya, Y., Takahashi, H., Nakamura, T. & Aiko, Y., 2019, In: Materials Transactions. 60, 6, p. 850-857 8 p.

  研究成果: Article › 査読

  • Silver nanoparticles
  • thermal fatigue
  • fatigue life
  • Thermal fatigue
  • crack propagation
  3 被引用数 (Scopus)

• Evaluation of fatigue crack propagation of Sn5.0Sb/Cu joint using inelastic strain energy density

  Nakajima, Y., Ono, K. & Kariya, Y., 2019, In: Materials Transactions. 60, 6, p. 876-881 6 p.

  研究成果: Article › 査読

  • crack propagation
  • Strain energy
  • Fatigue crack propagation
  • flux density
  • evaluation
  2 被引用数 (Scopus)

• Influence of silica filler addition on fatigue crack propagation rate of underfill resin

  Ishibashi, J., Kariya, Y., Satoh, T., Enomoto, T. & Yamaguchi, H., 2019, In: Materials Transactions. 60, 6, p. 902-908 7 p.

  研究成果: Article › 査読

  • Silicon Dioxide
  • crack propagation
  • Silica
  • Fatigue crack propagation
  • resins

• Measurements and FEM analyses of strain distribution in small Sn specimens with few crystal grains

  Sasaki, T., Yanase, A., Okumura, D., Kariya, Y., Koganemaru, M. & Ikeda, T., 2019, In: Materials Transactions. 60, 6, p. 868-875 8 p.

  研究成果: Article › 査読

  • strain distribution
  • Crystals
  • Finite element method
  • crystals
  • Crystal orientation
• 2018

  Effect of sintering temperature on fatigue crack propagation rate of sintered Ag nanoparticles

  Kimura, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2018, In: Materials Transactions. 59, 4, p. 612-619 8 p.

  研究成果: Article › 査読

  • Silver nanoparticles
  • crack propagation
  • Fatigue crack propagation
  • Sintering
  • sintering
  5 被引用数 (Scopus)

• Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via

  Watanabe, K., Kariya, Y., Yajima, N., Obinata, K., Hiroshima, Y., Kikuchi, S., Matsui, A. & Shimizu, H., 2018 3, In: Microelectronics Reliability. 82, p. 20-27 8 p.

  研究成果: Article › 査読

  • thermal fatigue
  • fatigue life
  • Thermal fatigue
  • Fatigue testing
  • fatigue tests
  6 被引用数 (Scopus)
• 2017

  Influence of Temperature on Plastic Deformation Behavior and Mechanism of Bismuth Single Crystals

  Yanaka, Y., Kariya, Y., Watanabe, H. & Hokazono, H., 2017 10 3, (Accepted/In press) In: Journal of Electronic Materials. p. 1-10 10 p.

  研究成果: Article › 査読

  • Bismuth
  • Single crystals
  • bismuth
  • Plastic deformation
  • plastic deformation
  1 被引用数 (Scopus)

• Low-Cycle Fatigue Life and Fatigue Crack Propagation of Sintered Ag Nanoparticles

  Shioda, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2017 2 1, In: Journal of Electronic Materials. 46, 2, p. 1155-1162 8 p.

  研究成果: Article › 査読

  • Silver nanoparticles
  • fatigue life
  • crack propagation
  • Fatigue crack propagation
  • crack initiation
  17 被引用数 (Scopus)
• 2016

  Effect of strain rate and temperature on micro fatigue crack propagation of Bi-Sn eutectic alloy

  Taniguchi, M. & Kariya, Y., 2016 1 1, In: Materials Transactions. 57, 6, p. 853-859 7 p.

  研究成果: Article › 査読

  • eutectic alloys
  • crack propagation
  • Eutectics
  • Fatigue crack propagation
  • Strain rate
  2 被引用数 (Scopus)

• Plastic deformation behavior and mechanism of bismuth single crystals in principal axes

  Yanaka, Y., Kariya, Y., Watanabe, H. & Hokazono, H., 2016, In: Materials Transactions. 57, 6, p. 819-823 5 p.

  研究成果: Article › 査読

  • Bismuth
  • Single crystals
  • bismuth
  • Plastic deformation
  • plastic deformation
  8 被引用数 (Scopus)

• Thermal fatigue life evaluation of epoxy resin/Si joint under mineral oil condition

  Takahashi, H. & Kariya, Y., 2016, In: Materials Transactions. 57, 6, p. 805-809 5 p.

  研究成果: Article › 査読

  • thermal fatigue
  • mineral oils
  • Epoxy Resins
  • fatigue life
  • Mineral oils
  1 被引用数 (Scopus)
• 2013

  Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy

  Sato, T., Kariya, Y., Fukui, K., Matsuoka, H. & Yano, M., 2013, In: Journal of Japan Institute of Electronics Packaging. 16, 4, p. 293-299 7 p.

  研究成果: Article › 査読

  • Eutectics
  • Strain rate
  • Fatigue of materials
  • Temperature
  • Grain boundary sliding
  3 被引用数 (Scopus)
• 2012

  Effect of Strain-Enhanced Microstructural Coarsening on the Cyclic Strain-Hardening Exponent of SnAgCu Joint

  K, Y., a, A., Tasaka, Y. KT. & Kariya, Y., 2012 12 1, In: Materials Transactions. 53, p. 2072-2077

  研究成果: Article › 査読

• Effect of strain-enhanced microstructural coarsening on the cyclic strain-hardening exponent of Sn-Ag-Cu joints

  Kanda, Y., Kariya, Y. & Tasaka, T., 2012, In: Materials Transactions. 53, 12, p. 2072-2077 6 p.

  研究成果: Article › 査読

  • Coarsening
  • strain hardening
  • Intermetallics
  • Strain hardening
  • intermetallics
  9 被引用数 (Scopus)

• Evaluation of creep properties for Sn-Ag-Cu micro solder joint by multi-temperature stress relaxation test

  Kanda, Y. & Kariya, Y., 2012 7 1, In: Microelectronics Reliability. 52, 7, p. 1435-1440 6 p.

  研究成果: Article › 査読

  • creep properties
  • Stress relaxation
  • solders
  • stress relaxation
  • Soldering alloys
  21 被引用数 (Scopus)

• Influence of Crystallographic Orientation on Fatigue Reliability of beta-Sn and beta-Sn Micro-joint

  Kariya, Y., TAJIMA, Y. KS. & YAMADA, S., 2012 8 29, In: Materials Transactions. 53

  研究成果: Article › 査読

• Influence of crystallographic orientation on fatigue reliability of β-Sn and β-Sn micro-joint

  Kariya, Y., Tajima, S. & Yamada, S., 2012, In: Materials Transactions. 53, 12, p. 2067-2071 5 p.

  研究成果: Article › 査読

  • Single crystals
  • Strain energy
  • Fatigue of materials
  • fatigue life
  • Thermal fatigue
  10 被引用数 (Scopus)

• Influence of cyclic strain-hardening exponent on fatigue ductility exponent for a Sn-Ag-Cu micro-solder joint

  Kanda, Y., Kariya, Y. & Oto, Y., 2012 3, In: Journal of Electronic Materials. 41, 3, p. 580-587 8 p.

  研究成果: Article › 査読

  • strain hardening
  • solders
  • Strain hardening
  • ductility
  • Soldering alloys
  24 被引用数 (Scopus)

• Mechanical reliability of isotropic conductive adhesive

  Kariya, Y., 2012 8, In: Journal of Japan Institute of Electronics Packaging. 15, 5, p. 340-343 4 p.

  研究成果: Article › 査読
• 2011

  Basic study on Disassembly of Electronic Components by Allotropic Transformation of Sn

  Takahashi, K. & Kariya, Y., 2011 12 1, In: Proc. Of International Conference on Electronics Materials and Packaging. EMAP2011

  研究成果: Article › 査読

• Microstructure and Fatigue Damage of Eutectic Bi-Sn Alloy at High Temperature

  Sato, T., K, Y., a, A. & Kariya, Y., 2011 12 1, In: Proc. Of International Conference on Electronics Materials and Packaging. EMAP2011

  研究成果: Article › 査読

• Thermal Fatigue Life Prediction Model and Acceleration Factor for Sn-Ag-Cu Solder Joint

  K, Y., a, A. & Kariya, Y., 2011 12 1, In: Proc. Of International Conference on Electronics Materials and Packaging. EMAP2011

  研究成果: Article › 査読
• 2010

  Disassembly Technique of Solder Joint Using Allotropic Transformation of Tin

  Hirano, Y. & Kariya, Y., 2010 3 19, In: Default journal.

  研究成果: Article › 査読

• Influence of asymmetrical waveform on low-cycle fatigue life of micro solder joint

  Kanda, Y. & Kariya, Y., 2010 2 1, In: Journal of Electronic Materials. 39, 2, p. 238-245 8 p.

  研究成果: Article › 査読

  • fatigue life
  • solders
  • Soldering alloys
  • waveforms
  • Fatigue of materials
  16 被引用数 (Scopus)

• Influence of Inelastic Constitutive Equation on Fatigue Life Prediction of Sn-Ag-Cu Micro Solder Joint

  K, Y., a, A., Zama, K. & Kariya, Y., 2010 5 1, In: Proc. of ICEP2010. p. 1-6

  研究成果: Article › 査読

• Influence of temperature and dwelling time on low-cycle fatigue characteristic of isotropic conductive adhesive joint

  Kariya, Y., Kanda, Y., Iguchi, K. & Furusawa, H., 2010 10, In: Materials Transactions. 51, 10, p. 1779-1784 6 p.

  研究成果: Article › 査読

  • Adhesive joints
  • dwell
  • fatigue life
  • adhesives
  • Fatigue of materials
  12 被引用数 (Scopus)
• 2009

  Basic Study on Disassembly Technique of Solder Joint Using Allotropic Transformation of Tin

  Hirano, Y. & Kariya, Y. HK. UY., 2009 12 1, In: EcoDesign2009. 6, p. 1233-1236

  研究成果: Article › 査読

• Effect of Visco-elasticity on Reliability Analysis of Flip-Chip Package

  K, Y., a, A., Zama, K., Kariya, Y., Mikami, T., Kobayashi, T., Enomoto, T. & Hirata, K., 2009 7 1, In: ASME-InterPACK. p. 755-759

  研究成果: Article › 査読

• IEC 6237-1-5 Surface mounting technology, Environmental and endurance test methods for surface mount solder joint, Part 1-5:Mechanical shear fatigue test

  Kariya, Y., 2009 2 1, In: IEC International Standard. p. 1-41

  研究成果: Article › 査読

• Trends of conductive adhesives in electronics

  Suganuma, K., Shindo, D., Ohtsuka, K. & Kariya, Y., 2009 1, In: Journal of Japan Institute of Electronics Packaging. 12, 1, p. 79-85 7 p.

  研究成果: Article › 査読
  2 被引用数 (Scopus)
• 2008

  Anisotropic Mechanical Properties of Sn-rich Lead-free Solder

  Kariya, Y., 2008 5 1, In: Default journal.

  研究成果: Article › 査読

• Effect of Aging on Tensile Properties of Low-Melting Lead-Free Solders Evaluated by Micro Size Specimen

  Shohji, I., Osawa, T., Matsuki, T., Yasuda, K., Takemoto, T. & Kariya, Y., 2008 3 1, In: Smart Processing Technology, High Temperature Society of Japan. p. 99-102

  研究成果: Article › 査読

• Effect of hold time on low cycle fatigue life of micro solder joint

  Kanda, Y., Kariya, Y. & Mochizuki, Y., 2008 7, In: Materials Transactions. 49, 7, p. 1524-1530 7 p.

  研究成果: Article › 査読

  • fatigue life
  • solders
  • Soldering alloys
  • Fatigue of materials
  • cycles
  16 被引用数 (Scopus)

• Effect of specimen size and aging on tensile properties of Sn-Ag-Cu lead-free solders

  Shohji, I., Osawa, T., Matsuki, T., Kariya, Y., Yasuda, K. & Takemoto, T., 2008 5 1, In: Materials Transactions. 49, 5, p. 1175-1179 5 p.

  研究成果: Article › 査読

  • Lead-free solders
  • tensile properties
  • solders
  • Eutectics
  • Tensile properties
  19 被引用数 (Scopus)

• IEC 62137-1-4 (Cyclic bending test)

  Kariya, Y., 2008 3 1, In: Default journal.

  研究成果: Article › 査読

• Mechanical characteristics of lead-free solder alloys in small volume

  Kariya, Y., 2008 8, In: Journal of Japan Institute of Electronics Packaging. 11, 5, p. 368-374 7 p.

  研究成果: Article › 査読
• 2007

  Low-cycle fatigue properties of eutectic solders at high temperatures

  Kariya, Y. & Suga, T., 2007 5 1, In: Fatigue and Fracture of Engineering Materials and Structures. 30, 5, p. 413-419 7 p.

  研究成果: Article › 査読

  • Eutectics
  • Soldering alloys
  • Grain boundary sliding
  • Fatigue of materials
  • Temperature
  20 被引用数 (Scopus)

• Mechanical Properties

  Kariya, Y., 2007, In: Yosetsu Gakkai Shi/Journal of the Japan Welding Society. 76, 2, p. 109-113 5 p.

  研究成果: Article › 査読

• Mechanical Properties of Lead-free Solder in Small Volume

  Kariya, Y., 2007 5 1, In: Default journal.

  研究成果: Article › 査読
• 2006

  Mechanical Reliability of Solders in Small Volume

  Kariya, Y., 2006, In: Journal of Japan Institute of Electronics Packaging. 9, 3, p. 138-142 5 p.

  研究成果: Article › 査読
  2 被引用数 (Scopus)
• 2005

  Isothermal Fatigue Properties of Lead-Free Solder Alloy Evaliated Miniature Size Specimen

  Kariya, Y., Niimi, T. & Suga, T., 2005 7 1, In: Default journal.

  研究成果: Article › 査読

• Isothermal Fatigue Properties of Lead-Free Solder Alloy Evaluated by Miniature Size Specimen

  Kariya, Y., Niimi, T. & Suga, T., 2005 7 1, In: Proc. of The 7th International Conference on ECOMATERIALS.

  研究成果: Article › 査読

• Isothermal fatigue properties of Sn-Ag-Cu alloy evaluated by micro size specimen

  Kariya, Y., Niimi, T., Suga, T. & Otsuka, M., 2005 11 1, In: Materials Transactions. 46, 11, p. 2309-2315 7 p.

  研究成果: Article › 査読

  • fatigue life
  • Fatigue of materials
  • solders
  • Soldering alloys
  • cracks
  45 被引用数 (Scopus)

• Isothermal Fatigue Properties of Sn-Ag-Cu Alloy Evalulated by Micro Size Specimen

  Kariya, Y., Niimi, T., Suga, T. & Otsuka, M., 2005 11 15, In: Materials Transactions. 46, p. 2309-2315

  研究成果: Article › 査読

• Low Cycle Fatigue Properties of Solder Alloys Evaluated by Micro Bulk　Specimen

  Kariya, Y., Niimi, T. & Suga, T., 2005 7 1, In: Default journal.

  研究成果: Article › 査読

• Low Cycle Fatigue Propreties of Solder Alloys Evaluated by Micro Bulk Specimen

  Kariya, Y., Niimi, T. & Suga, T., 2005 7 20, In: Proceedings of ASME International Electeronics Packing Technical Conference. 73165, p. 1-6

  研究成果: Article › 査読