苅谷 義治

研究成果

年別の研究成果 1993 1998 1999 2001 2003 2004 2005 2008 2010 2012 2016 2019 2022

• 103 Article
• 23 Conference contribution
• 3 Editorial
• 2 Paper
• 1 その他
  • 1 Conference article

年別の研究成果

年別の研究成果

検索結果

• Article

  Allotropic transformation of tin in Sn-0.5mass%Cu Lead-free Solder

  Karriya, Y., Williams, N., Gagg, C., Plumbridge, W. J. & Kariya, Y., 2001 6月 1, In: JOM. 53, p. 39-41

  研究成果: Article › 査読

• Allotropic transformation study and phase mapping in tin-copper lead free solder for electronics assembly

  Kariya, Y., Williams, N., Gagg, C. & Plumbridge, W. J., 2000 6月 1, In: Default journal.

  研究成果: Article › 査読

• Anisotropic Mechanical Properties of Sn-rich Lead-free Solder

  Kariya, Y., 2008 5月 1, In: Default journal.

  研究成果: Article › 査読

• Assessment of Low-Cycle Fatigue Life of Sn-3.5mass%Ag-X (X=Bi or Cu) Alloy by Strain Range Partitioning Approach

  Kariya, Y., Morihata, T. & Otsuka, M., 2001 9月 1, In: Journal of Electronic Materials. 30, p. 1184-1189

  研究成果: Article › 査読

  44 被引用数 (Scopus)

• Assessment of low-cycle fatigue life of Sn-3.5mass%Ag-X (X = Bi or Cu) alloy by strain range partitioning approach

  Kariya, Y., Morihata, T., Hazawa, E. & Otsuka, M., 2001 9月, In: Journal of Electronic Materials. 30, 9, p. 1184-1189 6 p.

  研究成果: Article › 査読

  • fatigue life 100%
  • Creep 64%
  • Alloy 52%
  • Strain 52%
  • Fatigue of materials 51%
  44 被引用数 (Scopus)

• Basic study on Disassembly of Electronic Components by Allotropic Transformation of Sn

  Takahashi, K. & Kariya, Y., 2011 12月 1, In: Proc. Of International Conference on Electronics Materials and Packaging. EMAP2011

  研究成果: Article › 査読

• Basic Study on Disassembly Technique of Solder Joint Using Allotropic Transformation of Tin

  Hirano, Y. & Kariya, Y. HK. UY., 2009 12月 1, In: EcoDesign2009. 6, p. 1233-1236

  研究成果: Article › 査読

• Class I Creep Deformation of Sn-Ag-Cu Containing Solid Solution Elements and Its Effect on Thermal Fatigue Life of Solder Joints

  Moriuchi, M., Kariya, Y., Kondo, M. & Kanda, Y., 2022, In: Materials Transactions. 63, 6, p. 805-812 8 p.

  研究成果: Article › 査読

  Open Access

  • Thermal Fatigue 100%
  • thermal fatigue 84%
  • fatigue life 78%
  • Solder 72%
  • Thermal fatigue 71%
  2 被引用数 (Scopus)

• Current Soldering Technology and Reliability Issue in Lead-Free Solder for Electronic Assembly

  Kariya, Y. & Otsuka, M., 2000, In: Yosetsu Gakkai Shi/Journal of the Japan Welding Society. 69, 2, p. 108-112 5 p.

  研究成果: Article › 査読
  2 被引用数 (Scopus)

• Development of lead free solder alloy for flip chip application

  Kariya, Y., 2003 12月 1, In: Default journal.

  研究成果: Article › 査読

• Disassembly Technique of Solder Joint Using Allotropic Transformation of Tin

  Hirano, Y. & Kariya, Y., 2010 3月 19, In: Default journal.

  研究成果: Article › 査読

• Effect of Additional Element (Bi and Cu) on the Thermal Fatigue Strength of QFP/Sn-3.5Ag Solder Joint

  Kariya, Y., Hirata, Y., Warashina, K. & Otsuka, M., 1999 12月 1, In: American Society of Mechanical Engineers, EEP. 26 3, p. 173-180 8 p.

  研究成果: Article › 査読

  • Thermal fatigue 100%
  • Soldering alloys 79%
  • Bismuth 54%
  • Fatigue damage 28%
  • Fatigue of materials 27%
  1 被引用数 (Scopus)

• Effect of Aging on Tensile Properties of Low-Melting Lead-Free Solders Evaluated by Micro Size Specimen

  Shohji, I., Osawa, T., Matsuki, T., Yasuda, K., Takemoto, T. & Kariya, Y., 2008 3月 1, In: Smart Processing Technology, High Temperature Society of Japan. p. 99-102

  研究成果: Article › 査読

• Effect of Bismuth and Copper on the Creep Properties of Sn-3.5Ag Solder Alloy

  Atsumi, K., Kariya, Y. & Ostuka, M., 1999 2月 1, In: Default journal.

  研究成果: Article › 査読

• Effect of bismuth on the isothermal fatigue properties of Sn-3.5mass%Ag solder alloy

  Kariya, Y. & Otsuka, M., 1998 7月, In: Journal of Electronic Materials. 27, 7, p. 866-870 5 p.

  研究成果: Article › 査読

  • Bismuth 100%
  • fatigue life 99%
  • Solder 92%
  • solders 83%
  • bismuth 73%
  83 被引用数 (Scopus)

• Effect of Bismuth on the Isoｔhermal Fatigue Properties of Sn-3.5mass%Ag Solder Alloy

  Kariya, Y. & Otsuka, M., 1998 7月 1, In: Proc. Internatinal Symposium on Microstructures and Mechanical Properties of New Engineering Materials. p. 171-176

  研究成果: Article › 査読

  83 被引用数 (Scopus)

• Effect of hold time on low cycle fatigue life of micro solder joint

  Kanda, Y., Kariya, Y. & Mochizuki, Y., 2008 7月, In: Materials Transactions. 49, 7, p. 1524-1530 7 p.

  研究成果: Article › 査読

  • fatigue life 100%
  • Solder 92%
  • solders 83%
  • Soldering alloys 73%
  • Fatigue of materials 51%
  16 被引用数 (Scopus)

• Effect of Silver Content on Thermal Fatigue Life of Sn-xAg-0.5Cu Flip Chip Interconnects

  Terashima, S., Kariya, Y., Hosoi, T. & Tanaka, M., 2003 12月 1, In: Journal of Electronic Materials. 32, p. 1527-1533

  研究成果: Article › 査読

  163 被引用数 (Scopus)

• Effect of Silver Content on Thermal Fatigue Life of Sn-xAg-0.5Cu Flip-Chip Interconnects

  Terashima, S., Kariya, Y., Hosoi, T. & Tanaka, M., 2003 12月, In: Journal of Electronic Materials. 32, 12, p. 1527-1533 7 p.

  研究成果: Article › 査読

  • Thermal Fatigue 100%
  • thermal fatigue 84%
  • fatigue life 78%
  • Thermal fatigue 71%
  • Silver 63%
  163 被引用数 (Scopus)

• Effect of silver content on the shear fatigue properties of Sn-Ag-Cu Flip Chip Interconnects

  Kariya, Y., Hosoi, T., Terashima, S., Tanaka, M. & Otsuka, M., 2004 4月 1, In: Journal of Electronic Materials. 33, p. 321-328

  研究成果: Article › 査読

  84 被引用数 (Scopus)

• Effect of Silver Content on the Shear Fatigue Properties of Sn-Ag-Cu Flip-Chip Interconnects

  Kariya, Y., Hosoi, T., Terashima, S., Tanaka, M. & Otsuka, M., 2004 4月, In: Journal of Electronic Materials. 33, 4, p. 321-328 8 p.

  研究成果: Article › 査読

  • Solder 100%
  • solders 90%
  • Silver 88%
  • Soldering alloys 79%
  • Shear 74%
  84 被引用数 (Scopus)

• Effect of sintering temperature on fatigue crack propagation rate of sintered Ag nanoparticles

  Kimura, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2018, In: Materials Transactions. 59, 4, p. 612-619 8 p.

  研究成果: Article › 査読

  • Silver nanoparticles 100%
  • Crack Propagation 96%
  • crack propagation 74%
  • Fatigue crack propagation 70%
  • Sintering 65%
  12 被引用数 (Scopus)

• Effect of Solidification Speed on the Isothermal Fatigue properties of Sn-3.5mass%Ag Solder Alloy

  Kariya, Y., Oguchi, Y., Kawamata, H. & Otsuka, M., 1997 10月 1, In: Proc. of Fifth Japan International SAMPE Symposium. 5, p. 1673-1678

  研究成果: Article › 査読

• Effect of specimen size and aging on tensile properties of Sn-Ag-Cu lead-free solders

  Shohji, I., Osawa, T., Matsuki, T., Kariya, Y., Yasuda, K. & Takemoto, T., 2008 5月 1, In: Materials Transactions. 49, 5, p. 1175-1179 5 p.

  研究成果: Article › 査読

  • Lead-free solders 100%
  • tensile properties 90%
  • solders 90%
  • Eutectics 85%
  • Tensile properties 82%
  20 被引用数 (Scopus)

• Effect of Strain-Enhanced Microstructural Coarsening on the Cyclic Strain-Hardening Exponent of SnAgCu Joint

  K, Y., a, A., Tasaka, Y. KT. & Kariya, Y., 2012 12月 1, In: Materials Transactions. 53, p. 2072-2077

  研究成果: Article › 査読

• Effect of strain-enhanced microstructural coarsening on the cyclic strain-hardening exponent of Sn-Ag-Cu joints

  Kanda, Y., Kariya, Y. & Tasaka, T., 2012, In: Materials Transactions. 53, 12, p. 2072-2077 6 p.

  研究成果: Article › 査読

  • Strain Hardening 100%
  • Coarsening 87%
  • strain hardening 80%
  • Intermetallic Compound 76%
  • Intermetallics 76%
  10 被引用数 (Scopus)

• Effect of Strain Rate and Hold Time on the Isothermal Fatigue Life of Sn-3.5Ag-X(Bi,Cu,In) Solder Alloys

  Kariya, Y. & Otsuka, M., 1999 3月 1, In: Default journal.

  研究成果: Article › 査読

• Effect of strain rate and temperature on micro fatigue crack propagation of Bi-Sn eutectic alloy

  Taniguchi, M. & Kariya, Y., 2016 1月 1, In: Materials Transactions. 57, 6, p. 853-859 7 p.

  研究成果: Article › 査読

  • Crack Propagation 100%
  • eutectic alloys 90%
  • crack propagation 77%
  • Eutectics 75%
  • Fatigue crack propagation 73%
  2 被引用数 (Scopus)

• Effect of Stress Relaxation on Low Cycle Fatigue Life of Pb-free Solder Joints

  Kariya, Y. & Suga, T., 2004 3月 1, In: Proc. of 1st Eco Design Symposium in CHINA. 1, p. 111-116

  研究成果: Article › 査読

• Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy

  Sato, T., Kariya, Y., Fukui, K., Matsuoka, H. & Yano, M., 2013, In: Journal of Japan Institute of Electronics Packaging. 16, 4, p. 293-299 7 p.

  研究成果: Article › 査読

  • Eutectics 100%
  • Strain rate 87%
  • Fatigue of materials 65%
  • Temperature 37%
  • Grain boundary sliding 34%
  4 被引用数 (Scopus)

• Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X=Bi and Cu) solder joints

  Kariya, Y., Hirata, Y. & Otsuka, M., 1999 3月 1, In: Default journal.

  研究成果: Article › 査読

  59 被引用数 (Scopus)

• Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X = Bi and Cu) solder joints

  Kariya, Y., Hirata, Y. & Otsuka, M., 1999 11月, In: Journal of Electronic Materials. 28, 11, p. 1263-1269 7 p.

  研究成果: Article › 査読

  • Solder 100%
  • Thermal Fatigue 92%
  • solders 90%
  • Strength of materials 84%
  • Soldering alloys 79%
  59 被引用数 (Scopus)

• Effect of Visco-elasticity on Reliability Analysis of Flip-Chip Package

  K, Y., a, A., Zama, K., Kariya, Y., Mikami, T., Kobayashi, T., Enomoto, T. & Hirata, K., 2009 7月 1, In: ASME-InterPACK. p. 755-759

  研究成果: Article › 査読

• Evaluation of creep properties for Sn-Ag-Cu micro solder joint by multi-temperature stress relaxation test

  Kanda, Y. & Kariya, Y., 2012 7月 1, In: Microelectronics Reliability. 52, 7, p. 1435-1440 6 p.

  研究成果: Article › 査読

  • creep properties 100%
  • Stress Relaxation 96%
  • Solder 89%
  • Creep 88%
  • Stress relaxation 86%
  25 被引用数 (Scopus)

• Evaluation of fatigue crack propagation behavior of pressurized sintered Ag nanoparticles and its application to thermal fatigue life prediction of sintered joint

  Sato, T., Kariya, Y., Takahashi, H., Nakamura, T. & Aiko, Y., 2019, In: Materials Transactions. 60, 6, p. 850-857 8 p.

  研究成果: Article › 査読

  • Thermal Fatigue 100%
  • Silver nanoparticles 84%
  • thermal fatigue 84%
  • Crack Propagation 81%
  • fatigue life 78%
  5 被引用数 (Scopus)

• Evaluation of fatigue crack propagation of Sn5.0Sb/Cu joint using inelastic strain energy density

  Nakajima, Y., Ono, K. & Kariya, Y., 2019, In: Materials Transactions. 60, 6, p. 876-881 6 p.

  研究成果: Article › 査読

  • Crack Propagation 100%
  • Strain Energy 91%
  • crack propagation 77%
  • Strain energy 76%
  • Fatigue crack propagation 73%
  5 被引用数 (Scopus)

• Evaluation of Wetting Properties for Sn-Ag-X System Solder by modified Wetting Balance Technique

  Nakamura, K., Kariya, Y. & Otsuka, M., 1999 2月 1, In: Default journal.

  研究成果: Article › 査読

• Fatigue Crack Networks in the Die-Attach Joint of a Power Semiconductor Module During Power Cycling Testing and Effects of Test Parameters on the Joint Fatigue Life

  Hosoya, K., Kariya, Y., Sugimoto, H. & Takahashi, K., 2020 10月 1, In: Journal of Electronic Materials. 49, 10, p. 6175-6186 12 p.

  研究成果: Article › 査読

  • fatigue life 100%
  • Semiconductor materials 66%
  • cracks 57%
  • Semiconductor 56%
  • Fatigue of materials 51%
  5 被引用数 (Scopus)

• Fatigue Life Enhancement of Low Silver Content Sn-Ag-Cu Flip-Chip Interconnects by Small Amount of Ni Addition

  Kariya, Y., Kimura, T., Terashiama, S., Tanaka, M. & Suga, T., 2003 10月 1, In: Default journal.

  研究成果: Article › 査読

• Fatigue Life Prediction of Die-Attach Joint in Power Semiconductors Subjected to Biaxial Stress by High-Speed Thermal Cycling

  Kanai, H., Kariya, Y., Sugimoto, H., Abe, Y., Yokoyama, Y., Ochi, K., Hanada, R. & Soda, S., 2022, In: Materials Transactions. 63, 6, p. 759-765 7 p.

  研究成果: Article › 査読

  Open Access

  • fatigue life 100%
  • Thermal Cycling 94%
  • Solder 92%
  • Thermal cycling 85%
  • Semiconductor materials 66%

• IEC 62137-1-4 (Cyclic bending test)

  Kariya, Y., 2008 3月 1, In: Default journal.

  研究成果: Article › 査読

• IEC 6237-1-5 Surface mounting technology, Environmental and endurance test methods for surface mount solder joint, Part 1-5:Mechanical shear fatigue test

  Kariya, Y., 2009 2月 1, In: IEC International Standard. p. 1-41

  研究成果: Article › 査読

• Improvement on thermal fatigue properties of Sn-1.2Ag-0.5Cu flip chip interconnects by nickel addition

  Terashima, S., Kariya, Y. & Tanaka, M., 2004 3月, In: Materials Transactions. 45, 3, p. 673-680 8 p.

  研究成果: Article › 査読

  Open Access

  • Thermal Fatigue 100%
  • thermal fatigue 84%
  • Thermal fatigue 71%
  • Solder 60%
  • solders 54%
  30 被引用数 (Scopus)

• Improvement on thermal fatigue properties of Sn-1.2Ag-0.5Cu flip chip interconnects by nickel addition

  Terashima, S., Kariya, Y. & Tanaka, M., 2004 3月 1, In: METARIALS TRANSACTIONS. 45, p. 673-680

  研究成果: Article › 査読

  30 被引用数 (Scopus)

• Influence of asymmetrical waveform on low-cycle fatigue life of micro solder joint

  Kanda, Y. & Kariya, Y., 2010 2月 1, In: Journal of Electronic Materials. 39, 2, p. 238-245 8 p.

  研究成果: Article › 査読

  • fatigue life 100%
  • Solder 92%
  • solders 83%
  • Soldering alloys 73%
  • waveforms 65%
  16 被引用数 (Scopus)

• Influence of Crystallographic Orientation on Fatigue Reliability of beta-Sn and beta-Sn Micro-joint

  Kariya, Y., TAJIMA, Y. KS. & YAMADA, S., 2012 8月 29, In: Materials Transactions. 53

  研究成果: Article › 査読

• Influence of crystallographic orientation on fatigue reliability of β-Sn and β-Sn micro-joint

  Kariya, Y., Tajima, S. & Yamada, S., 2012, In: Materials Transactions. 53, 12, p. 2067-2071 5 p.

  研究成果: Article › 査読

  • Strain Energy 100%
  • Thermal Fatigue 67%
  • Single crystals 60%
  • Strain energy 56%
  • Single Crystalline Solid 55%
  12 被引用数 (Scopus)

• Influence of cyclic strain-hardening exponent on fatigue ductility exponent for a Sn-Ag-Cu micro-solder joint

  Kanda, Y., Kariya, Y. & Oto, Y., 2012 3月, In: Journal of Electronic Materials. 41, 3, p. 580-587 8 p.

  研究成果: Article › 査読

  • Strain Hardening 100%
  • Ductility 84%
  • strain hardening 80%
  • solders 80%
  • Strain hardening 73%
  25 被引用数 (Scopus)

• Influence of Inelastic Constitutive Equation on Fatigue Life Prediction of Sn-Ag-Cu Micro Solder Joint

  K, Y., a, A., Zama, K. & Kariya, Y., 2010 5月 1, In: Proc. of ICEP2010. p. 1-6

  研究成果: Article › 査読

• Influence of silica filler addition on fatigue crack propagation rate of underfill resin

  Ishibashi, J., Kariya, Y., Satoh, T., Enomoto, T. & Yamaguchi, H., 2019, In: Materials Transactions. 60, 6, p. 902-908 7 p.

  研究成果: Article › 査読

  • Crack Propagation 100%
  • crack propagation 77%
  • Silica 73%
  • Fatigue crack propagation 73%
  • resins 71%
  1 被引用数 (Scopus)