年別の研究成果
年別の研究成果
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Article
Allotropic transformation of tin in Sn-0.5mass%Cu Lead-free Solder
Karriya, Y., Williams, N., Gagg, C., Plumbridge, W. J. & Kariya, Y., 2001 6月 1, In: JOM. 53, p. 39-41研究成果: Article › 査読
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Allotropic transformation study and phase mapping in tin-copper lead free solder for electronics assembly
Kariya, Y., Williams, N., Gagg, C. & Plumbridge, W. J., 2000 6月 1, In: Default journal.研究成果: Article › 査読
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Anisotropic Mechanical Properties of Sn-rich Lead-free Solder
Kariya, Y., 2008 5月 1, In: Default journal.研究成果: Article › 査読
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Assessment of Low-Cycle Fatigue Life of Sn-3.5mass%Ag-X (X=Bi or Cu) Alloy by Strain Range Partitioning Approach
Kariya, Y., Morihata, T. & Otsuka, M., 2001 9月 1, In: Journal of Electronic Materials. 30, p. 1184-1189研究成果: Article › 査読
44 被引用数 (Scopus) -
Assessment of low-cycle fatigue life of Sn-3.5mass%Ag-X (X = Bi or Cu) alloy by strain range partitioning approach
Kariya, Y., Morihata, T., Hazawa, E. & Otsuka, M., 2001 9月, In: Journal of Electronic Materials. 30, 9, p. 1184-1189 6 p.研究成果: Article › 査読
44 被引用数 (Scopus) -
Basic study on Disassembly of Electronic Components by Allotropic Transformation of Sn
Takahashi, K. & Kariya, Y., 2011 12月 1, In: Proc. Of International Conference on Electronics Materials and Packaging. EMAP2011研究成果: Article › 査読
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Basic Study on Disassembly Technique of Solder Joint Using Allotropic Transformation of Tin
Hirano, Y. & Kariya, Y. HK. UY., 2009 12月 1, In: EcoDesign2009. 6, p. 1233-1236研究成果: Article › 査読
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Current Soldering Technology and Reliability Issue in Lead-Free Solder for Electronic Assembly
Kariya, Y. & Otsuka, M., 2000, In: Yosetsu Gakkai Shi/Journal of the Japan Welding Society. 69, 2, p. 108-112 5 p.研究成果: Article › 査読
2 被引用数 (Scopus) -
Development of lead free solder alloy for flip chip application
Kariya, Y., 2003 12月 1, In: Default journal.研究成果: Article › 査読
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Disassembly Technique of Solder Joint Using Allotropic Transformation of Tin
Hirano, Y. & Kariya, Y., 2010 3月 19, In: Default journal.研究成果: Article › 査読
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Effect of Additional Element (Bi and Cu) on the Thermal Fatigue Strength of QFP/Sn-3.5Ag Solder Joint
Kariya, Y., Hirata, Y., Warashina, K. & Otsuka, M., 1999 12月 1, In: American Society of Mechanical Engineers, EEP. 26 3, p. 173-180 8 p.研究成果: Article › 査読
1 被引用数 (Scopus) -
Effect of Aging on Tensile Properties of Low-Melting Lead-Free Solders Evaluated by Micro Size Specimen
Shohji, I., Osawa, T., Matsuki, T., Yasuda, K., Takemoto, T. & Kariya, Y., 2008 3月 1, In: Smart Processing Technology, High Temperature Society of Japan. p. 99-102研究成果: Article › 査読
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Effect of Bismuth and Copper on the Creep Properties of Sn-3.5Ag Solder Alloy
Atsumi, K., Kariya, Y. & Ostuka, M., 1999 2月 1, In: Default journal.研究成果: Article › 査読
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Effect of bismuth on the isothermal fatigue properties of Sn-3.5mass%Ag solder alloy
Kariya, Y. & Otsuka, M., 1998 7月, In: Journal of Electronic Materials. 27, 7, p. 866-870 5 p.研究成果: Article › 査読
82 被引用数 (Scopus) -
Effect of Bismuth on the Isoｔhermal Fatigue Properties of Sn-3.5mass%Ag Solder Alloy
Kariya, Y. & Otsuka, M., 1998 7月 1, In: Proc. Internatinal Symposium on Microstructures and Mechanical Properties of New Engineering Materials. p. 171-176研究成果: Article › 査読
82 被引用数 (Scopus) -
Effect of hold time on low cycle fatigue life of micro solder joint
Kanda, Y., Kariya, Y. & Mochizuki, Y., 2008 7月, In: Materials Transactions. 49, 7, p. 1524-1530 7 p.研究成果: Article › 査読
16 被引用数 (Scopus) -
Effect of Silver Content on Thermal Fatigue Life of Sn-xAg-0.5Cu Flip Chip Interconnects
Terashima, S., Kariya, Y., Hosoi, T. & Tanaka, M., 2003 12月 1, In: Journal of Electronic Materials. 32, p. 1527-1533研究成果: Article › 査読
159 被引用数 (Scopus) -
Effect of Silver Content on Thermal Fatigue Life of Sn-xAg-0.5Cu Flip-Chip Interconnects
Terashima, S., Kariya, Y., Hosoi, T. & Tanaka, M., 2003 12月, In: Journal of Electronic Materials. 32, 12, p. 1527-1533 7 p.研究成果: Article › 査読
159 被引用数 (Scopus) -
Effect of silver content on the shear fatigue properties of Sn-Ag-Cu Flip Chip Interconnects
Kariya, Y., Hosoi, T., Terashima, S., Tanaka, M. & Otsuka, M., 2004 4月 1, In: Journal of Electronic Materials. 33, p. 321-328研究成果: Article › 査読
81 被引用数 (Scopus) -
Effect of Silver Content on the Shear Fatigue Properties of Sn-Ag-Cu Flip-Chip Interconnects
Kariya, Y., Hosoi, T., Terashima, S., Tanaka, M. & Otsuka, M., 2004 4月, In: Journal of Electronic Materials. 33, 4, p. 321-328 8 p.研究成果: Article › 査読
81 被引用数 (Scopus) -
Effect of sintering temperature on fatigue crack propagation rate of sintered Ag nanoparticles
Kimura, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2018, In: Materials Transactions. 59, 4, p. 612-619 8 p.研究成果: Article › 査読
8 被引用数 (Scopus) -
Effect of Solidification Speed on the Isothermal Fatigue properties of Sn-3.5mass%Ag Solder Alloy
Kariya, Y., Oguchi, Y., Kawamata, H. & Otsuka, M., 1997 10月 1, In: Proc. of Fifth Japan International SAMPE Symposium. 5, p. 1673-1678研究成果: Article › 査読
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Effect of specimen size and aging on tensile properties of Sn-Ag-Cu lead-free solders
Shohji, I., Osawa, T., Matsuki, T., Kariya, Y., Yasuda, K. & Takemoto, T., 2008 5月 1, In: Materials Transactions. 49, 5, p. 1175-1179 5 p.研究成果: Article › 査読
20 被引用数 (Scopus) -
Effect of Strain-Enhanced Microstructural Coarsening on the Cyclic Strain-Hardening Exponent of SnAgCu Joint
K, Y., a, A., Tasaka, Y. KT. & Kariya, Y., 2012 12月 1, In: Materials Transactions. 53, p. 2072-2077研究成果: Article › 査読
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Effect of strain-enhanced microstructural coarsening on the cyclic strain-hardening exponent of Sn-Ag-Cu joints
Kanda, Y., Kariya, Y. & Tasaka, T., 2012, In: Materials Transactions. 53, 12, p. 2072-2077 6 p.研究成果: Article › 査読
10 被引用数 (Scopus) -
Effect of Strain Rate and Hold Time on the Isothermal Fatigue Life of Sn-3.5Ag-X(Bi,Cu,In) Solder Alloys
Kariya, Y. & Otsuka, M., 1999 3月 1, In: Default journal.研究成果: Article › 査読
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Effect of strain rate and temperature on micro fatigue crack propagation of Bi-Sn eutectic alloy
Taniguchi, M. & Kariya, Y., 2016 1月 1, In: Materials Transactions. 57, 6, p. 853-859 7 p.研究成果: Article › 査読
2 被引用数 (Scopus) -
Effect of Stress Relaxation on Low Cycle Fatigue Life of Pb-free Solder Joints
Kariya, Y. & Suga, T., 2004 3月 1, In: Proc. of 1st Eco Design Symposium in CHINA. 1, p. 111-116研究成果: Article › 査読
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Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy
Sato, T., Kariya, Y., Fukui, K., Matsuoka, H. & Yano, M., 2013, In: Journal of Japan Institute of Electronics Packaging. 16, 4, p. 293-299 7 p.研究成果: Article › 査読
3 被引用数 (Scopus) -
Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X=Bi and Cu) solder joints
Kariya, Y., Hirata, Y. & Otsuka, M., 1999 3月 1, In: Default journal.研究成果: Article › 査読
59 被引用数 (Scopus) -
Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X = Bi and Cu) solder joints
Kariya, Y., Hirata, Y. & Otsuka, M., 1999 11月, In: Journal of Electronic Materials. 28, 11, p. 1263-1269 7 p.研究成果: Article › 査読
59 被引用数 (Scopus) -
Effect of Visco-elasticity on Reliability Analysis of Flip-Chip Package
K, Y., a, A., Zama, K., Kariya, Y., Mikami, T., Kobayashi, T., Enomoto, T. & Hirata, K., 2009 7月 1, In: ASME-InterPACK. p. 755-759研究成果: Article › 査読
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Evaluation of creep properties for Sn-Ag-Cu micro solder joint by multi-temperature stress relaxation test
Kanda, Y. & Kariya, Y., 2012 7月 1, In: Microelectronics Reliability. 52, 7, p. 1435-1440 6 p.研究成果: Article › 査読
25 被引用数 (Scopus) -
Evaluation of fatigue crack propagation behavior of pressurized sintered Ag nanoparticles and its application to thermal fatigue life prediction of sintered joint
Sato, T., Kariya, Y., Takahashi, H., Nakamura, T. & Aiko, Y., 2019, In: Materials Transactions. 60, 6, p. 850-857 8 p.研究成果: Article › 査読
4 被引用数 (Scopus) -
Evaluation of fatigue crack propagation of Sn5.0Sb/Cu joint using inelastic strain energy density
Nakajima, Y., Ono, K. & Kariya, Y., 2019, In: Materials Transactions. 60, 6, p. 876-881 6 p.研究成果: Article › 査読
3 被引用数 (Scopus) -
Evaluation of Wetting Properties for Sn-Ag-X System Solder by modified Wetting Balance Technique
Nakamura, K., Kariya, Y. & Otsuka, M., 1999 2月 1, In: Default journal.研究成果: Article › 査読
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Fatigue Crack Networks in the Die-Attach Joint of a Power Semiconductor Module During Power Cycling Testing and Effects of Test Parameters on the Joint Fatigue Life
Hosoya, K., Kariya, Y., Sugimoto, H. & Takahashi, K., 2020 10月 1, In: Journal of Electronic Materials. 49, 10, p. 6175-6186 12 p.研究成果: Article › 査読
4 被引用数 (Scopus) -
Fatigue Life Enhancement of Low Silver Content Sn-Ag-Cu Flip-Chip Interconnects by Small Amount of Ni Addition
Kariya, Y., Kimura, T., Terashiama, S., Tanaka, M. & Suga, T., 2003 10月 1, In: Default journal.研究成果: Article › 査読
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Improvement on thermal fatigue properties of Sn-1.2Ag-0.5Cu flip chip interconnects by nickel addition
Terashima, S., Kariya, Y. & Tanaka, M., 2004 3月, In: Materials Transactions. 45, 3, p. 673-680 8 p.研究成果: Article › 査読
Open Access30 被引用数 (Scopus) -
Improvement on thermal fatigue properties of Sn-1.2Ag-0.5Cu flip chip interconnects by nickel addition
Terashima, S., Kariya, Y. & Tanaka, M., 2004 3月 1, In: METARIALS TRANSACTIONS. 45, p. 673-680研究成果: Article › 査読
30 被引用数 (Scopus) -
Influence of asymmetrical waveform on low-cycle fatigue life of micro solder joint
Kanda, Y. & Kariya, Y., 2010 2月 1, In: Journal of Electronic Materials. 39, 2, p. 238-245 8 p.研究成果: Article › 査読
16 被引用数 (Scopus) -
Influence of Crystallographic Orientation on Fatigue Reliability of beta-Sn and beta-Sn Micro-joint
Kariya, Y., TAJIMA, Y. KS. & YAMADA, S., 2012 8月 29, In: Materials Transactions. 53研究成果: Article › 査読
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Influence of crystallographic orientation on fatigue reliability of β-Sn and β-Sn micro-joint
Kariya, Y., Tajima, S. & Yamada, S., 2012, In: Materials Transactions. 53, 12, p. 2067-2071 5 p.研究成果: Article › 査読
12 被引用数 (Scopus) -
Influence of cyclic strain-hardening exponent on fatigue ductility exponent for a Sn-Ag-Cu micro-solder joint
Kanda, Y., Kariya, Y. & Oto, Y., 2012 3月, In: Journal of Electronic Materials. 41, 3, p. 580-587 8 p.研究成果: Article › 査読
24 被引用数 (Scopus) -
Influence of Inelastic Constitutive Equation on Fatigue Life Prediction of Sn-Ag-Cu Micro Solder Joint
K, Y., a, A., Zama, K. & Kariya, Y., 2010 5月 1, In: Proc. of ICEP2010. p. 1-6研究成果: Article › 査読
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Influence of silica filler addition on fatigue crack propagation rate of underfill resin
Ishibashi, J., Kariya, Y., Satoh, T., Enomoto, T. & Yamaguchi, H., 2019, In: Materials Transactions. 60, 6, p. 902-908 7 p.研究成果: Article › 査読
1 被引用数 (Scopus) -
Influence of temperature and dwelling time on low-cycle fatigue characteristic of isotropic conductive adhesive joint
Kariya, Y., Kanda, Y., Iguchi, K. & Furusawa, H., 2010 10月, In: Materials Transactions. 51, 10, p. 1779-1784 6 p.研究成果: Article › 査読
12 被引用数 (Scopus) -
Influence of Temperature on Plastic Deformation Behavior and Mechanism of Bismuth Single Crystals
Yanaka, Y., Kariya, Y., Watanabe, H. & Hokazono, H., 2017 10月 3, (Accepted/In press) In: Journal of Electronic Materials. p. 1-10 10 p.研究成果: Article › 査読
1 被引用数 (Scopus)