3-Dimensional elastic-plastic finite element analysis of stress-induced voiding in Cu damascene interconnects of ultra-large-scale integrated circuits
Takehiro Saitoh, Masaya Kawano, Kazuyoshi Ueno
研究成果: Article › 査読
Takehiro Saitoh, Masaya Kawano, Kazuyoshi Ueno
研究成果: Article › 査読