3D SOKUIKI sensor module by roundly swinging mechanism and SCIP-3D command system

Mitsuhiro Matsumoto, Tomoaki Yoshida, Toshihiro Mori, Shinichi Yuta

研究成果: Article

4 引用 (Scopus)

抄録

This paper describes a 3D SOKUIKI sensor module by roundly swinging mechanism and SCIP (Sensor Communication Interface Protocol)-3D command system for taking 3D reflecting points information in real space. We developed a 3D SOKUIKI sensor module, in which the body of the twodimensional SOKUIKI sensor is moved by roundly swinging mechanism. The sensor module has the communication interface based on SCIP-3D, which is a command language for 3D SOKUIKI sensor defined by the authors' group. We desighed and implemented a minimal set of commands which is named "SCIP-3D mini" for our sensor module. We studied system architecture of the sensor module to implement SCIP-3D interface. We designed and made up hardware and software of the system to control the sensor. We took actual reflecting points in real space experimentally in various environment by using the developed sensor module. The results have shown the usefulness on the real-time environmental measurements.

元の言語English
ページ(範囲)3314-3323
ページ数10
ジャーナルNihon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C
75
発行部数760
出版物ステータスPublished - 2009 12
外部発表Yes

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Communication
Sensors
Hardware

ASJC Scopus subject areas

  • Mechanical Engineering
  • Mechanics of Materials
  • Industrial and Manufacturing Engineering

これを引用

3D SOKUIKI sensor module by roundly swinging mechanism and SCIP-3D command system. / Matsumoto, Mitsuhiro; Yoshida, Tomoaki; Mori, Toshihiro; Yuta, Shinichi.

:: Nihon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C, 巻 75, 番号 760, 12.2009, p. 3314-3323.

研究成果: Article

Matsumoto, Mitsuhiro ; Yoshida, Tomoaki ; Mori, Toshihiro ; Yuta, Shinichi. / 3D SOKUIKI sensor module by roundly swinging mechanism and SCIP-3D command system. :: Nihon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C. 2009 ; 巻 75, 番号 760. pp. 3314-3323.
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