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出版年

  • 2020
  • 2019
  • 2018
  • 2017
  • 2016

著者

  • Yoshiharu Kariya
2019

Deformation Behavior of Pressurized Sintered Ag Nanoparticles in Discrete Type Power Semiconductor Device

Nagata, K., Kariya, Y. & Horie, S., 2019 5, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735247. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

2016

Low-Cycle Fatigue Life and Fatigue Crack Propagation of Sintered Ag Nanoparticles

Shioda, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2016 11 7, (Accepted/In press) : : Journal of Electronic Materials. p. 1-8 8 p.

研究成果: Article

15 引用 (Scopus)
2019

Influence of silica filler addition on fatigue crack propagation rate of underfill resin

Ishibashi, J., Kariya, Y., Satoh, T., Enomoto, T. & Yamaguchi, H., 2019 1 1, : : Materials Transactions. 60, 6, p. 902-908 7 p.

研究成果: Article

2016

Preface

Kariya, Y. & Shohji, I., 2016, : : Materials Transactions. 57, 6, p. 796 1 p.

研究成果: Editorial

2019

Fatigue Life Prediction of BGA Solder Joint with Consideration of Microstructural Coarsening

Moroka, K. & Kariya, Y., 2019 5, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735151. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

1 引用 (Scopus)
2016
1 引用 (Scopus)
2019

Fracture Analysis of Vertical Direction Crack in Die Attach Joint for Power Semiconductor Device

Sugimoto, H., Kariya, Y., Hanada, R., Fukumoto, A., Ito, Y. & Soda, S., 2019 5, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735334. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

1 引用 (Scopus)
2018

Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via

Watanabe, K., Kariya, Y., Yajima, N., Obinata, K., Hiroshima, Y., Kikuchi, S., Matsui, A. & Shimizu, H., 2018 3, : : Microelectronics Reliability. 82, p. 20-27 8 p.

研究成果: Article

4 引用 (Scopus)
2020
2016

Plastic deformation behavior and mechanism of bismuth single crystals in principal axes

Yanaka, Y., Kariya, Y., Watanabe, H. & Hokazono, H., 2016, : : Materials Transactions. 57, 6, p. 819-823 5 p.

研究成果: Article

7 引用 (Scopus)
2019

Cure Shrinkage Behavior Analysis in Ultraviolet Curable Adhesive using Finite Element Method

Sato, Y. & Kariya, Y., 2019 5, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735106. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

2 引用 (Scopus)
2 引用 (Scopus)
2019

Measurements and FEM analyses of strain distribution in small Sn specimens with few crystal grains

Sasaki, T., Yanase, A., Okumura, D., Kariya, Y., Koganemaru, M. & Ikeda, T., 2019 1 1, : : Materials Transactions. 60, 6, p. 868-875 8 p.

研究成果: Article

2017

Influence of Temperature on Plastic Deformation Behavior and Mechanism of Bismuth Single Crystals

Yanaka, Y., Kariya, Y., Watanabe, H. & Hokazono, H., 2017 10 3, (Accepted/In press) : : Journal of Electronic Materials. p. 1-10 10 p.

研究成果: Article

1 引用 (Scopus)
2018

Effect of sintering temperature on fatigue crack propagation rate of sintered Ag nanoparticles

Kimura, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2018 1 1, : : Materials Transactions. 59, 4, p. 612-619 8 p.

研究成果: Article

2 引用 (Scopus)
2019

High Temperature Fatigue Crack Propagation Characteristics of Pressureless Sintered Silver Nanoparticles

Osaki, K., Kariya, Y., Mizumura, N. & Sasaki, K., 2019 5, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735315. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

1 引用 (Scopus)

Evaluation of Adhesive Fracture Energy of Polyimide Interlayer Dielectric Film for Redistribution Layer of Semiconductor Package

Ono, K. & Kariya, Y., 2019 5, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735249. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

2017

Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via

Watanabe, K., Yajima, N., Kariya, Y., Hiroshima, Y., Kikuchi, S., Matsui, A. & Shimizu, H., 2017 6 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 1 p. 7947481

研究成果: Conference contribution

2016

Higher thermal cycling reliability of power semiconductor module for power converters

Morozumi, A., Hokazono, H., Nishimura, Y., Kariya, Y., Mochizuki, E. & Takahashi, Y., 2016 6 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 405-410 6 p. 7486857

研究成果: Conference contribution

1 引用 (Scopus)
2020
公開
2017

Temperature dependence of fatigue crack propagation rate of pressureless sintered Ag nanoparticles

Kimura, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2017 6 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 1 p. 7947482. (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017).

研究成果: Conference contribution