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• Thermal and mechanical coupling in granular modeling for metal injection molding

  Iwai, T., Aizawa, T. & Kihara, J., 1994 4月, In: Journal of Materials Processing Tech.. 42, 2, p. 175-185 11 p.

  研究成果: Article › 査読
  8 被引用数 (Scopus)

• Thermal and mechanical coupling in granular modeling for metal injection molding.

  Iwai, T., Aizawa, T. & Kihara, J., 1800, In: J. Materials Processing Technology.. 42 (1994), p. 175-185

  研究成果: Article › 査読

• Thermal and mechanical properties of high T_c bulk superconductors and their applications

  Noto, K., Oka, T., Yokoyama, K., Katagiri, K., Fujishiro, H., Okada, H., Nakazawa, H., Muralidhar, M. & Murakami, M., 2003 10月, In: Physica C: Superconductivity and its applications. 392-396, PART 1, p. 677-683 7 p.

  研究成果: Conference article › 査読
  16 被引用数 (Scopus)

• Thermal and microstructural analysis of the Y-Ba-Cu-O/Ag equilibrium around the critical composition YBa₂Cu₃O_x/Ag 35 mass%

  Costa, G. A. & Mele, P., 2001, In: Journal of Thermal Analysis and Calorimetry. 66, 1, p. 17-25 9 p.

  研究成果: Conference article › 査読
  2 被引用数 (Scopus)

• Thermal and x-ray analyses of high temperature superconductor YBa2Cu3O6.74

  Kikuchi, M., Syono, Y., Tokiwa, A., Oh-Ishi, K., Arai, H., Hiraga, K., Kobayashi, N. & Sasaoka, T., 1987 6月, In: Japanese Journal of Applied Physics. 26, 6A, p. 1066-1099 34 p.

  研究成果: Article › 査読
  56 被引用数 (Scopus)

• Thermal annealing behavior of defects induced by ion implantation in thermally grown SiO₂ films

  Seol, K. S., Karasawa, T., Ohki, Y., Nishikawa, H. & Takiyama, M., 1997 6月, In: Microelectronic Engineering. 36, 1-4, p. 193-195 3 p.

  研究成果: Article › 査読
  6 被引用数 (Scopus)

• Thermal annealing behavior of defects induced by ion implantation in thermally grown SiO2 films

  Seol, K. S., Karasawa, T., Ohki, Y., Nishikawa, H. & Takiyama, M., 1997 1月 1, In: Microelectrons Engineering. 36, p. 193-195

  研究成果: Article › 査読

  6 被引用数 (Scopus)

• Thermal annealing effects on Ni/Au based Schottky contacts on n-GaN and AlGaN/GaN with insertion of high work function metal

  Miura, N., Nanjo, T., Suita, M., Oishi, T., Abe, Y., Ozeki, T., Ishikawa, H., Egawa, T. & Jimbo, T., 2004 5月 1, In: Solid-State Electronics. 48, 5, p. 689-695 7 p.

  研究成果: Article › 査読
  151 被引用数 (Scopus)

• Thermal-assisted back-extraction of inert platinum group metals from [Hbet][Tf₂N] ionic liquid phase to oxalic acid aqueous solution

  Kono, S., Arai, T. & Takao, K., 2021, In: Journal of Nuclear Science and Technology. 58, 8, p. 941-946 6 p.

  研究成果: Article › 査読
  1 被引用数 (Scopus)

• Thermal behavior and field-trapping property of melt-textured superconducting bulk magnets activated by quasi-static magnetic fields

  Oka, T., Yokoyama, K., Fujishiro, H. & Noto, K., 2009, In: Journal of Physics: Conference Series. 150, 5, 052195.

  研究成果: Article › 査読

  Open Access
  2 被引用数 (Scopus)

• Thermal Characterization of Resin Die-bond Defects for VLSI Packages

  Y.Yamaji, Y. Y., Y.Tsuboi, Y. T., O.Yamagata, O. Y., H.Nakayoshi, H. N., M.Nii, M. N., T.Sudo, T. S. & Sudo, T., 1994 12月 5, In: The 2nd VLSI Packaging Workshop of Japan,. p. 123-126

  研究成果: Article › 査読

• Thermal Comfort and Productivity - Evaluation of Workplace Environment

  Akimoto, T., 2008 7月 1, In: International Symposium on the Interaction between Human and Building Environment (Seoul, Korea).

  研究成果: Article › 査読

• Thermal comfort and productivity - Evaluation of workplace environment in a task conditioned office

  Akimoto, T., Tanabe, S. I., Yanai, T. & Sasaki, M., 2010 1月, In: Building and Environment. 45, 1, p. 45-50 6 p.

  研究成果: Article › 査読
  113 被引用数 (Scopus)

• Thermal comfort and productivity in offices under mandatory electricity savings after great east Japan earthquake

  Tanabe, S. I., Iwahashi, YUK. & Tsushima, S., 2012.

  研究成果: Paper › 査読
  4 被引用数 (Scopus)

• Thermal comfort and productivity in offices under mandatory electricity savings after the Great East Japan earthquake

  Tanabe, S. I., Iwahashi, Y., Tsushima, S. & Nishihara, N., 2013 2月 1, In: Architectural Science Review. 56, 1, p. 4-13 10 p.

  研究成果: Article › 査読
  54 被引用数 (Scopus)

• Thermal Comfort and Productivity with Three Different Task Conditioning Systems

  T.Akimoto, T. A., Tanabe, S., Amai, H., Genma, T. & Akimoto, T., 2005 10月 1, In: Default journal.

  研究成果: Article › 査読

• Thermal Comfort for Pedestrians in the Street in Japanese Cities in Summer

  MIURA.Masao, MIURA. M. & Miura, M., 1994 9月 17, In: Proceedings of 14th EAROPH World Planning Congress 1994 in BEIJING. p. 398-402

  研究成果: Article › 査読

• Thermal Comfort in Japanese Cities in Summer

  MIURA, M., 1993 9月 28, In: Congress Report of IFHP International Congress 1993 in Helsinki.

  研究成果: Article › 査読

• Thermal comfort in transitional metabolism based on subjective experiments with ceiling supply task conditioning system

  Akimoto, T., Ohta, H., Hashimoto, S., Nishino, A., Chikamoto, T. & Nakamura, S., 2011 12月 1, 12th International Conference on Indoor Air Quality and Climate 2011. p. 2652-2653 2 p. (12th International Conference on Indoor Air Quality and Climate 2011; vol. 4).

  研究成果: Conference contribution

• Thermal conductivity across the metal-insulator transition in the single-crystalline hyperkagome antiferromagnet Na3+xIr3 O8

  Fauqué, B., Xu, X., Bangura, A. F., Hunter, E. C., Yamamoto, A., Behnia, K., Carrington, A., Takagi, H., Hussey, N. E. & Perry, R. S., 2015 2月 25, In: Physical Review B - Condensed Matter and Materials Physics. 91, 7, 075129.

  研究成果: Article › 査読
  11 被引用数 (Scopus)

• Thermal conductivity and structural instability in La- and Cu-site-substituted La2CuO4

  Sera, M., Maki, M., Hiroi, M., Kobayashi, N., Suzuki, T. & Fukase, T., 1995, In: Physical Review B. 52, 2, p. R735-R738

  研究成果: Article › 査読
  13 被引用数 (Scopus)

• Thermal conductivity and themoelectric power of DyBaCuO bulk superconductor

  Fujishiro, H., Nariki, S., Murakami, M. & Saito, M., 2007 10月 21, In: 5th International Workshop on Processing and Applications of Superconducting (RE)BCO Large Grain Materials. p. 21PP03

  研究成果: Article › 査読

• Thermal conductivity and thermoelectric power of DyBaCuO bulk superconductors

  Fujishiro, H., Nariki, S. & Murakami, M., 2006 7月, In: Superconductor Science and Technology. 19, 7, p. S447-S450

  研究成果: Article › 査読
  12 被引用数 (Scopus)

• Thermal conductivity and thermoelectric power of DyBaCuO superconductors

  Fujishiro, H., Nariki, S., Murakami, M. & Saito, M., 2006 7月 1, In: Superconductor Science and Technology. 19, p. S447-S450

  研究成果: Article › 査読

• Thermal conductivity of Er-Ba-Cu-O and Ho-Ba-Cu-O superconducting bulks

  Naito, T., Fujishiro, H., Iida, K., Nariki, S. & Murakami, M., 2008 8月 1, In: Superconductor Science and Technology. 21, 8, 085001.

  研究成果: Article › 査読
  1 被引用数 (Scopus)

• Thermal conductivity of superconducting joint of Y-Ba-Cu-O bulk materials

  Satoh, T., Iida, K., Yoshioka, J., Sakai, N., Murakami, M. & Noto, K., 2003 10月, In: Physica C: Superconductivity and its applications. 392-396, PART 1, p. 669-672 4 p.

  研究成果: Conference article › 査読

• Thermal cyclic properties of ti-pd-pt-zr high-temperature shape memory alloys

  Tasaki, W., Shimojo, M. & Yamabe-Mitarai, Y., 2019 11月, In: Crystals. 9, 11, 595.

  研究成果: Article › 査読

  Open Access
  3 被引用数 (Scopus)

• Thermal decomposition of ammonia borane at high pressures

  Nyĺn, J., Sato, T., Soignard, E., Yarger, J. L., Stoyanov, E. & Häussermann, U., 2009, In: Journal of Chemical Physics. 131, 10, 104506.

  研究成果: Article › 査読
  49 被引用数 (Scopus)

• Thermal design for wick recirculation of AMTEC cells

  Tanaka, K., 1997, In: KAGAKU KOGAKU RONBUNSHU. 23, 2, 1 p.

  研究成果: Article › 査読

  Open Access
  2 被引用数 (Scopus)

• Thermal designing on a small-sized AMTEC cell

  Tanaka, K., Fuji, T. & Honda, T., 2002, In: Proceedings of the Intersociety Energy Conversion Engineering Conference. p. 394-399 6 p.

  研究成果: Conference article › 査読
  3 被引用数 (Scopus)

• Thermal Designing on Wick Return AMTEC Cells

  Tanaka, K., Williams, R. M., Underwood, M. L., Ryan, M. A. & Nakamura, A., 1993 6月 1, In: Default journal. p. 731-735

  研究成果: Article › 査読

• Thermal Effects of Brillouin Gain Spectra in Singlemode Fibers

  Kurashima, T., Horiguchi, T. & Tateda, M., 1990 10月, In: IEEE Photonics Technology Letters. 2, 10, p. 718-720 3 p.

  研究成果: Article › 査読
  70 被引用数 (Scopus)

• Thermal effects on the Brillouin frequency shift in jacketed optical silica fibers

  Kurashima, T., Horiguchi, T. & Tateda, M., 1990 5月 1, In: Appl. Opt.. 29, p. 2219-2222

  研究成果: Article › 査読

  184 被引用数 (Scopus)

• Thermal efficiency evaluation of HI synthesis/concentration procedures in the thermochemical water splitting IS process

  Kasahara, S., Kubo, S., Onuki, K. & Nomura, M., 2004 5月, In: International Journal of Hydrogen Energy. 29, 6, p. 579-587 9 p.

  研究成果: Article › 査読
  85 被引用数 (Scopus)

• Thermal Efficiency of the IS Process for Thermochemical Hydrogen Production Using the HTGR

  Kasahara, S., Hwang, G-J., Choi, H-S., Onuki, K. & Nomura, M., 2003 9月 15, In: International Conference on Global Environment and Advanced Nuclear Plants. p. 1038-1038

  研究成果: Article › 査読

• Thermal-expansion-type Microactuator for Endoscopic Surgery.

  N, K., R., T., K., T. & Kabei, N., 1997 1月 1, In: Default journal.

  研究成果: Article › 査読

• Thermal-expansion-type microactuator using paraffin as expansive material (Basic performance of a prototype linear actuator)

  Kabei, N., Kosuda, M., Kagamibuchi, H., Tashiro, R., Mizuno, H., Ueda, Y. & Tsuchiya, K., 1996, In: Nippon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C. 62, 604, p. 4624-4629 6 p.

  研究成果: Article › 査読

  Open Access
  2 被引用数 (Scopus)

• Thermal Fatigue Damage of Quad Flat Pack Leads and Sn-3.5Ag-X(x=Bi and Cu) Solder Joints

  Warashina, K., Kariya, Y., Hirata, Y. & Otsuka, M., 1999 2月 1, In: Default journal.

  研究成果: Article › 査読

• Thermal fatigue damage of quad flat pack leads and Sn-3.5Ag-X (X=Bi and Cu) solder joints

  Warashina, K., Kariya, Y., Hirata, Y. & Otsuka, M., 1999, Proceedings - 1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999. Suga, T., Yoshikawa, H., Umeda, Y., Kimura, F. & Yamamoto, R. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 626-631 6 p. 747688. (Proceedings - 1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999).

  研究成果: Conference contribution
  3 被引用数 (Scopus)

• Thermal fatigue life evaluation of CSP joints by mechanical fatigue testing

  Kanda, Y., Zama, K., Kariya, Y., Oota, H., Kikuchi, S., Yamabe, H. & Nakamura, K., 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. 5501291. (2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010).

  研究成果: Conference contribution
  3 被引用数 (Scopus)

• Thermal fatigue life evaluation of epoxy resin/Si joint under mineral oil condition

  Takahashi, H. & Kariya, Y., 2016, In: Materials Transactions. 57, 6, p. 805-809 5 p.

  研究成果: Article › 査読
  1 被引用数 (Scopus)

• Thermal Fatigue Life of Eutectic Solder Bumps for Flip-chip Interconnection,

  K.Doi, K. D., N.Hirano, N. H., M.Mukai, M. M., T.Okada, T. O., Y.Hiruta, Y. H., T.Sudo, T. S. & Sudo, T., 1993 12月 5, In: The 2nd VLSI Packaging Workshop,. p. 103-104

  研究成果: Article › 査読

• Thermal Fatigue Life Prediction Model and Acceleration Factor for Sn-Ag-Cu Solder Joint

  K, Y., a, A. & Kariya, Y., 2011 12月 1, In: Proc. Of International Conference on Electronics Materials and Packaging. EMAP2011

  研究成果: Article › 査読

• Thermal fatigue life prediction of BGA solder joints using a creep constitutive equation incorporating microstructural coarsening effect

  Morooka, K. & Kariya, Y., 2021 2月 1, In: Materials Transactions. 62, 2, p. 205-212 8 p.

  研究成果: Article › 査読
  2 被引用数 (Scopus)

• Thermal imaging of objects with unknown emissivities

  Yamada, J. & Kurosaki, Y., 1995 12月 1, Fundamentals of Radiation. Cheung, F. B., Hassan, Y. A. & Singh, A. (eds.). 13 ed. (American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD; vol. 315, no. 13).

  研究成果: Chapter

• Thermal imaging system applying two-color thermometry

  Yamada, J. & Kurosaki, Y., 1998, 7th AIAA/ASME Joint Thermophysics and Heat Transfer Conference. American Institute of Aeronautics and Astronautics Inc, AIAA, AIAA-98-2462

  研究成果: Conference contribution
  1 被引用数 (Scopus)

• Thermalization of boosted charged AdS black holes by an ionic lattice

  Ishibashi, A. & Maeda, K., 2013 9月 25, In: Physical Review D - Particles, Fields, Gravitation and Cosmology. 88, 6, 066009.

  研究成果: Article › 査読
  3 被引用数 (Scopus)

• Thermally stable photoaligned p-cyanoazobenzene moieties in polymer thin films

  Ichimura, K., Kidowaki, M. & Fujiwara, T., 1999 1月, In: Macromolecular Symposia. 137, p. 129-136 8 p.

  研究成果: Article › 査読
  10 被引用数 (Scopus)

• Thermally stable photoaligned p-cyanoazobenzene moieties in polymer thin films

  Ichimura, K., Kidowaki, M. & Fujiwara, T., 1998 8月 1, In: American Chemical Society, Polymer Preprints, Division of Polymer Chemistry. 39, 2, p. 304-305 2 p.

  研究成果: Conference article › 査読
  3 被引用数 (Scopus)

• Thermal Management with Self-Rewetting Fluid

  Abe, Y., Iwasaki, A., Tanaka, K. & Nakamura, A., 2005 3月 1, In: Microgravity Science and Thechnology. 16, p. 148-152

  研究成果: Article › 査読

  29 被引用数 (Scopus)