抄録
A face-to-face chip stacking isolator structure, which makes it easy to enhance the insulation voltage, is proposed. Transmitter (Tx) and receiver (Rx) chips, each of which has a coil, are stacked and communicate through a magnetic coupling of the coils. The die attach film sandwiched by the two chips not only bonds the chips but also enhances the insulation voltage by taking advantage of its thickness. With test chips, the breakdown voltage of 7kV RMS is demonstrated and >20-year lifetime with a working voltage of 1.5kV is estimated by extrapolation of time-dependent dielectric breakdown results.
| 元の言語 | English |
|---|---|
| ホスト出版物のタイトル | Proceedings of the International Symposium on Power Semiconductor Devices and ICs |
| 出版者 | Institute of Electrical and Electronics Engineers Inc. |
| ページ | 442-445 |
| ページ数 | 4 |
| ISBN（印刷物） | 9781479929177 |
| DOI | |
| 出版物ステータス | Published - 2014 |
| 外部発表 | Yes |
| イベント | 26th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2014 - Waikoloa, HI, United States 継続期間: 2014 6 15 → 2014 6 19 |
Other
| Other | 26th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2014 |
|---|---|
| 国 | United States |
| 市 | Waikoloa, HI |
| 期間 | 14/6/15 → 14/6/19 |
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ASJC Scopus subject areas
- Engineering(all)
これを引用
A face-to-face chip stacking 7kV RMS digital isolator for automotive and industrial motor drive applications. / Uchida, Shinichi; Kaeriyama, Shunichi; Nagase, Hirokazu; Takeda, Koichi; Nakashiba, Yasutaka; Maeda, Tadashi; Ishihara, Kaoru.
Proceedings of the International Symposium on Power Semiconductor Devices and ICs. Institute of Electrical and Electronics Engineers Inc., 2014. p. 442-445 6856071.研究成果: Conference contribution
}
TY - GEN
T1 - A face-to-face chip stacking 7kV RMS digital isolator for automotive and industrial motor drive applications
AU - Uchida, Shinichi
AU - Kaeriyama, Shunichi
AU - Nagase, Hirokazu
AU - Takeda, Koichi
AU - Nakashiba, Yasutaka
AU - Maeda, Tadashi
AU - Ishihara, Kaoru
PY - 2014
Y1 - 2014
N2 - A face-to-face chip stacking isolator structure, which makes it easy to enhance the insulation voltage, is proposed. Transmitter (Tx) and receiver (Rx) chips, each of which has a coil, are stacked and communicate through a magnetic coupling of the coils. The die attach film sandwiched by the two chips not only bonds the chips but also enhances the insulation voltage by taking advantage of its thickness. With test chips, the breakdown voltage of 7kV RMS is demonstrated and >20-year lifetime with a working voltage of 1.5kV is estimated by extrapolation of time-dependent dielectric breakdown results.
AB - A face-to-face chip stacking isolator structure, which makes it easy to enhance the insulation voltage, is proposed. Transmitter (Tx) and receiver (Rx) chips, each of which has a coil, are stacked and communicate through a magnetic coupling of the coils. The die attach film sandwiched by the two chips not only bonds the chips but also enhances the insulation voltage by taking advantage of its thickness. With test chips, the breakdown voltage of 7kV RMS is demonstrated and >20-year lifetime with a working voltage of 1.5kV is estimated by extrapolation of time-dependent dielectric breakdown results.
UR - http://www.scopus.com/inward/record.url?scp=84905465553&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84905465553&partnerID=8YFLogxK
U2 - 10.1109/ISPSD.2014.6856071
DO - 10.1109/ISPSD.2014.6856071
M3 - Conference contribution
AN - SCOPUS:84905465553
SN - 9781479929177
SP - 442
EP - 445
BT - Proceedings of the International Symposium on Power Semiconductor Devices and ICs
PB - Institute of Electrical and Electronics Engineers Inc.
ER -