TY - GEN
T1 - A face-to-face chip stacking 7kV RMS digital isolator for automotive and industrial motor drive applications
AU - Uchida, Shinichi
AU - Kaeriyama, Shunichi
AU - Nagase, Hirokazu
AU - Takeda, Koichi
AU - Nakashiba, Yasutaka
AU - Maeda, Tadashi
AU - Ishihara, Kaoru
PY - 2014/1/1
Y1 - 2014/1/1
N2 - A face-to-face chip stacking isolator structure, which makes it easy to enhance the insulation voltage, is proposed. Transmitter (Tx) and receiver (Rx) chips, each of which has a coil, are stacked and communicate through a magnetic coupling of the coils. The die attach film sandwiched by the two chips not only bonds the chips but also enhances the insulation voltage by taking advantage of its thickness. With test chips, the breakdown voltage of 7kV RMS is demonstrated and >20-year lifetime with a working voltage of 1.5kV is estimated by extrapolation of time-dependent dielectric breakdown results.
AB - A face-to-face chip stacking isolator structure, which makes it easy to enhance the insulation voltage, is proposed. Transmitter (Tx) and receiver (Rx) chips, each of which has a coil, are stacked and communicate through a magnetic coupling of the coils. The die attach film sandwiched by the two chips not only bonds the chips but also enhances the insulation voltage by taking advantage of its thickness. With test chips, the breakdown voltage of 7kV RMS is demonstrated and >20-year lifetime with a working voltage of 1.5kV is estimated by extrapolation of time-dependent dielectric breakdown results.
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U2 - 10.1109/ISPSD.2014.6856071
DO - 10.1109/ISPSD.2014.6856071
M3 - Conference contribution
AN - SCOPUS:84905465553
SN - 9781479929177
T3 - Proceedings of the International Symposium on Power Semiconductor Devices and ICs
SP - 442
EP - 445
BT - Proceedings of the 26th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2014
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 26th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2014
Y2 - 15 June 2014 through 19 June 2014
ER -