A face-to-face chip stacking 7kV RMS digital isolator for automotive and industrial motor drive applications

Shinichi Uchida, Shunichi Kaeriyama, Hirokazu Nagase, Koichi Takeda, Yasutaka Nakashiba, Tadashi Maeda, Kaoru Ishihara

研究成果: Conference contribution

9 被引用数 (Scopus)

抄録

A face-to-face chip stacking isolator structure, which makes it easy to enhance the insulation voltage, is proposed. Transmitter (Tx) and receiver (Rx) chips, each of which has a coil, are stacked and communicate through a magnetic coupling of the coils. The die attach film sandwiched by the two chips not only bonds the chips but also enhances the insulation voltage by taking advantage of its thickness. With test chips, the breakdown voltage of 7kV RMS is demonstrated and >20-year lifetime with a working voltage of 1.5kV is estimated by extrapolation of time-dependent dielectric breakdown results.

本文言語English
ホスト出版物のタイトルProceedings of the 26th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2014
出版社Institute of Electrical and Electronics Engineers Inc.
ページ442-445
ページ数4
ISBN(印刷版)9781479929177
DOI
出版ステータスPublished - 2014 1 1
外部発表はい
イベント26th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2014 - Waikoloa, HI, United States
継続期間: 2014 6 152014 6 19

出版物シリーズ

名前Proceedings of the International Symposium on Power Semiconductor Devices and ICs
ISSN(印刷版)1063-6854

Other

Other26th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2014
国/地域United States
CityWaikoloa, HI
Period14/6/1514/6/19

ASJC Scopus subject areas

  • 工学(全般)

フィンガープリント

「A face-to-face chip stacking 7kV RMS digital isolator for automotive and industrial motor drive applications」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル