Buffer function of polyimide layer by drop test is discussed. The drop impact was calculated with a finite element analysis. It was found the factors of polyimide thickness and modulus have contributions to stress responses.
|出版ステータス||Published - 2013 1 1|
|イベント||2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013 - Kyoto, Japan|
継続期間: 2013 11 11 → 2013 11 13
|Conference||2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013|
|Period||13/11/11 → 13/11/13|
ASJC Scopus subject areas
- Electrical and Electronic Engineering