A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide

Mitsuru Fujita, Nobuhiro Anzai, Kazutoshi Sakamaki, Yoshiharu Kariya

研究成果査読

抄録

Buffer function of polyimide layer by drop test is discussed. The drop impact was calculated with a finite element analysis. It was found the factors of polyimide thickness and modulus have contributions to stress responses.

本文言語English
DOI
出版ステータスPublished - 2013 1 1
イベント2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013 - Kyoto, Japan
継続期間: 2013 11 112013 11 13

Conference

Conference2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013
国/地域Japan
CityKyoto
Period13/11/1113/11/13

ASJC Scopus subject areas

  • 電子工学および電気工学

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