A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide

Mitsuru Fujita; Nobuhiro Anzai; Kazutoshi Sakamaki; Yoshiharu Kariya

doi:10.1109/ICSJ.2013.6756126

A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide

Mitsuru Fujita, Nobuhiro Anzai, Kazutoshi Sakamaki, Yoshiharu Kariya

研究成果: Paper › 査読

抄録

Buffer function of polyimide layer by drop test is discussed. The drop impact was calculated with a finite element analysis. It was found the factors of polyimide thickness and modulus have contributions to stress responses.

本文言語	English
DOI	https://doi.org/10.1109/ICSJ.2013.6756126
出版ステータス	Published - 2013 1月 1
イベント	2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013 - Kyoto, Japan 継続期間: 2013 11月 11 → 2013 11月 13

Conference

Conference	2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013
国/地域	Japan
City	Kyoto
Period	13/11/11 → 13/11/13

ASJC Scopus subject areas

電子工学および電気工学

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10.1109/ICSJ.2013.6756126

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abstract = "Buffer function of polyimide layer by drop test is discussed. The drop impact was calculated with a finite element analysis. It was found the factors of polyimide thickness and modulus have contributions to stress responses.",

keywords = "Drop Test, Finite Element Analysis, Polyimide",

author = "Mitsuru Fujita and Nobuhiro Anzai and Kazutoshi Sakamaki and Yoshiharu Kariya",

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AU - Fujita, Mitsuru

AU - Anzai, Nobuhiro

AU - Sakamaki, Kazutoshi

AU - Kariya, Yoshiharu

PY - 2013/1/1

Y1 - 2013/1/1

N2 - Buffer function of polyimide layer by drop test is discussed. The drop impact was calculated with a finite element analysis. It was found the factors of polyimide thickness and modulus have contributions to stress responses.

AB - Buffer function of polyimide layer by drop test is discussed. The drop impact was calculated with a finite element analysis. It was found the factors of polyimide thickness and modulus have contributions to stress responses.

KW - Drop Test

KW - Finite Element Analysis

KW - Polyimide

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U2 - 10.1109/ICSJ.2013.6756126

DO - 10.1109/ICSJ.2013.6756126

M3 - Paper

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T2 - 2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013

Y2 - 11 November 2013 through 13 November 2013

ER -

A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide

抄録

Conference

ASJC Scopus subject areas

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