A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide

Mitsuru Fujita; Nobuhiro Anzai; Kazutoshi Sakamaki; Yoshiharu Kariya

doi:10.1109/ICSJ.2013.6756126

A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide

Mitsuru Fujita, Nobuhiro Anzai, Kazutoshi Sakamaki, Yoshiharu Kariya

研究成果: Paper › 査読

抄録

Buffer function of polyimide layer by drop test is discussed. The drop impact was calculated with a finite element analysis. It was found the factors of polyimide thickness and modulus have contributions to stress responses.

本文言語	English
DOI	https://doi.org/10.1109/ICSJ.2013.6756126
出版ステータス	Published - 2013 1 1
イベント	2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013 - Kyoto, Japan 継続期間: 2013 11 11 → 2013 11 13

Conference

Conference	2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013
Country	Japan
City	Kyoto
Period	13/11/11 → 13/11/13

ASJC Scopus subject areas

Electrical and Electronic Engineering

文献へのアクセス

10.1109/ICSJ.2013.6756126

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引用スタイル

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abstract = "Buffer function of polyimide layer by drop test is discussed. The drop impact was calculated with a finite element analysis. It was found the factors of polyimide thickness and modulus have contributions to stress responses.",

keywords = "Drop Test, Finite Element Analysis, Polyimide",

author = "Mitsuru Fujita and Nobuhiro Anzai and Kazutoshi Sakamaki and Yoshiharu Kariya",

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AU - Kariya, Yoshiharu

PY - 2013/1/1

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N2 - Buffer function of polyimide layer by drop test is discussed. The drop impact was calculated with a finite element analysis. It was found the factors of polyimide thickness and modulus have contributions to stress responses.

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KW - Drop Test

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