抄録
Buffer function of polyimide layer by drop test is discussed. The drop impact was calculated with a finite element analysis. It was found the factors of polyimide thickness and modulus have contributions to stress responses.
本文言語 | English |
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DOI | |
出版ステータス | Published - 2013 1月 1 |
イベント | 2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013 - Kyoto, Japan 継続期間: 2013 11月 11 → 2013 11月 13 |
Conference
Conference | 2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013 |
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国/地域 | Japan |
City | Kyoto |
Period | 13/11/11 → 13/11/13 |
ASJC Scopus subject areas
- 電子工学および電気工学