A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide

Mitsuru Fujita, Nobuhiro Anzai, Kazutoshi Sakamaki, Yoshiharu Kariya

研究成果: Paper

抜粋

Buffer function of polyimide layer by drop test is discussed. The drop impact was calculated with a finite element analysis. It was found the factors of polyimide thickness and modulus have contributions to stress responses.

元の言語English
DOI
出版物ステータスPublished - 2013 1 1
イベント2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013 - Kyoto, Japan
継続期間: 2013 11 112013 11 13

Conference

Conference2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013
Japan
Kyoto
期間13/11/1113/11/13

    フィンガープリント

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

これを引用

Fujita, M., Anzai, N., Sakamaki, K., & Kariya, Y. (2013). A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide. 論文発表場所 2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013, Kyoto, Japan. https://doi.org/10.1109/ICSJ.2013.6756126