A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide

Mitsuru Fujita, Nobuhiro Anzai, Kazutoshi Sakamaki, Yoshiharu Kariya

研究成果: Conference contribution

抄録

Buffer function of polyimide layer by drop test is discussed. The drop impact was calculated with a finite element analysis. It was found the factors of polyimide thickness and modulus have contributions to stress responses.

元の言語English
ホスト出版物のタイトルICSJ 2013 - IEEE CPMT Symposium Japan
出版者IEEE Computer Society
DOI
出版物ステータスPublished - 2013
イベント2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013 - Kyoto
継続期間: 2013 11 11 → 2013 11 13

Other

Other2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013
市Kyoto
期間13/11/11 → 13/11/13

Fingerprint

Polyimides
Finite element method

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

これを引用

Fujita, M., Anzai, N., Sakamaki, K., & Kariya, Y. (2013). A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide. ： ICSJ 2013 - IEEE CPMT Symposium Japan [6756126] IEEE Computer Society. https://doi.org/10.1109/ICSJ.2013.6756126

A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide. / Fujita, Mitsuru; Anzai, Nobuhiro; Sakamaki, Kazutoshi; Kariya, Yoshiharu.

ICSJ 2013 - IEEE CPMT Symposium Japan. IEEE Computer Society, 2013. 6756126.

研究成果: Conference contribution

Fujita, M, Anzai, N, Sakamaki, K & Kariya, Y 2013, A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide. ： ICSJ 2013 - IEEE CPMT Symposium Japan., 6756126, IEEE Computer Society, 2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013, Kyoto, 13/11/11. https://doi.org/10.1109/ICSJ.2013.6756126
Fujita M, Anzai N, Sakamaki K, Kariya Y. A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide. ： ICSJ 2013 - IEEE CPMT Symposium Japan. IEEE Computer Society. 2013. 6756126 https://doi.org/10.1109/ICSJ.2013.6756126
Fujita, Mitsuru ; Anzai, Nobuhiro ; Sakamaki, Kazutoshi ; Kariya, Yoshiharu. / A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide. ICSJ 2013 - IEEE CPMT Symposium Japan. IEEE Computer Society, 2013.
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