A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide

Mitsuru Fujita; Nobuhiro Anzai; Kazutoshi Sakamaki; Yoshiharu Kariya

doi:10.1109/ICSJ.2013.6756126

A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide

Mitsuru Fujita, Nobuhiro Anzai, Kazutoshi Sakamaki, Yoshiharu Kariya

研究成果: Paper

抜粋

Buffer function of polyimide layer by drop test is discussed. The drop impact was calculated with a finite element analysis. It was found the factors of polyimide thickness and modulus have contributions to stress responses.

元の言語	English
DOI	https://doi.org/10.1109/ICSJ.2013.6756126
出版物ステータス	Published - 2013 1 1
イベント	2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013 - Kyoto, Japan 継続期間: 2013 11 11 → 2013 11 13

Conference

Conference	2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013
国	Japan
市	Kyoto
期間	13/11/11 → 13/11/13

フィンガープリント

ASJC Scopus subject areas

Electrical and Electronic Engineering

これを引用

Fujita, M., Anzai, N., Sakamaki, K., & Kariya, Y. (2013). A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide. 論文発表場所 2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013, Kyoto, Japan. https://doi.org/10.1109/ICSJ.2013.6756126

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abstract = "Buffer function of polyimide layer by drop test is discussed. The drop impact was calculated with a finite element analysis. It was found the factors of polyimide thickness and modulus have contributions to stress responses.",

keywords = "Drop Test, Finite Element Analysis, Polyimide",

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AU - Kariya, Yoshiharu

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KW - Finite Element Analysis

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文献にアクセス

10.1109/ICSJ.2013.6756126