A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide

Mitsuru Fujita, Nobuhiro Anzai, Kazutoshi Sakamaki, Yoshiharu Kariya

研究成果: Paper査読

抄録

Buffer function of polyimide layer by drop test is discussed. The drop impact was calculated with a finite element analysis. It was found the factors of polyimide thickness and modulus have contributions to stress responses.

本文言語English
DOI
出版ステータスPublished - 2013 1 1
イベント2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013 - Kyoto, Japan
継続期間: 2013 11 112013 11 13

Conference

Conference2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013
国/地域Japan
CityKyoto
Period13/11/1113/11/13

ASJC Scopus subject areas

  • 電子工学および電気工学

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