本文言語 | English |
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ページ(範囲) | 88-89 |
ジャーナル | 1996 Symposium on VLSI Technology Digest of Technical Papers |
出版ステータス | Published - 1997 6月 1 |
A new two step metal CMP technique for a high performance multilevel interconnects featured by Al-and Cu in low - , organic film metallization
Y.Hayashi Y.Hayashi, T.Onodera T.Onodera, T.Nakajima T.Nakajima, K.Kikuta K.Kikuta, Y.Tsuchiya Y.Tsuchiya, J.Kawahara J.Kawahara, S.Takahashi S.Takahashi, K.Ueno K.Ueno, S.Chikaki S.Chikaki, Kazuyoshi Ueno
研究成果: Article › 査読