A new two step metal CMP technique for a high performance multilevel interconnects featured by Al-and Cu in low - , organic film metallization

Y.Hayashi Y.Hayashi, T.Onodera T.Onodera, T.Nakajima T.Nakajima, K.Kikuta K.Kikuta, Y.Tsuchiya Y.Tsuchiya, J.Kawahara J.Kawahara, S.Takahashi S.Takahashi, K.Ueno K.Ueno, S.Chikaki S.Chikaki, Kazuyoshi Ueno

研究成果: Article査読

本文言語English
ページ(範囲)88-89
ジャーナル1996 Symposium on VLSI Technology Digest of Technical Papers
出版ステータスPublished - 1997 6 1

引用スタイル