A Novel CoWP Cap Integration for Porous Low-k/Cu Interconnects with NH3 Plasma Treatment and Low-k Top (LKT) Dielectric Structure

N. Kawahara; M. Tagami; B. Withers; Y. Kakuhara; H. Imura; K. Ohto; T. Taiji; K. Arita; T. Kurokawa; M. Nagase; T. Maruyama; N. Oda; Y. Hayashi; J. Jacobs; M.Sakurai M.Sakurai; M. Sekine; K. Ueno

A Novel CoWP Cap Integration for Porous Low-k/Cu Interconnects with NH3 Plasma Treatment and Low-k Top (LKT) Dielectric Structure

N. Kawahara, M. Tagami, B. Withers, Y. Kakuhara, H. Imura, K. Ohto, T. Taiji, K. Arita, T. Kurokawa, M. Nagase, T. Maruyama, N. Oda, Y. Hayashi, J. Jacobs, M.Sakurai M.Sakurai, M. Sekine, K. Ueno

機能制御システム専攻

研究成果: Article › 査読

5 被引用数 (Scopus)

本文言語	English
ページ（範囲）	152-154
ジャーナル	Proc. 2006 Int. Interconnect Tech. Conf.
出版ステータス	Published - 2006 6 6

引用スタイル

Kawahara, N., Tagami, M., Withers, B., Kakuhara, Y., Imura, H., Ohto, K., Taiji, T., Arita, K., Kurokawa, T., Nagase, M., Maruyama, T., Oda, N., Hayashi, Y., Jacobs, J., M.Sakurai, M. S., Sekine, M., & Ueno, K. (2006). A Novel CoWP Cap Integration for Porous Low-k/Cu Interconnects with NH3 Plasma Treatment and Low-k Top (LKT) Dielectric Structure. Proc. 2006 Int. Interconnect Tech. Conf., 152-154.

A Novel CoWP Cap Integration for Porous Low-k/Cu Interconnects with NH3 Plasma Treatment and Low-k Top (LKT) Dielectric Structure. / Kawahara, N.; Tagami, M.; Withers, B.; Kakuhara, Y.; Imura, H.; Ohto, K.; Taiji, T.; Arita, K.; Kurokawa, T.; Nagase, M.; Maruyama, T.; Oda, N.; Hayashi, Y.; Jacobs, J.; M.Sakurai, M.Sakurai; Sekine, M.; Ueno, K.

In: Proc. 2006 Int. Interconnect Tech. Conf., 06.06.2006, p. 152-154.

研究成果: Article › 査読

Kawahara, N, Tagami, M, Withers, B, Kakuhara, Y, Imura, H, Ohto, K, Taiji, T, Arita, K, Kurokawa, T, Nagase, M, Maruyama, T, Oda, N, Hayashi, Y, Jacobs, J, M.Sakurai, MS, Sekine, M & Ueno, K 2006, 'A Novel CoWP Cap Integration for Porous Low-k/Cu Interconnects with NH3 Plasma Treatment and Low-k Top (LKT) Dielectric Structure', Proc. 2006 Int. Interconnect Tech. Conf., pp. 152-154.

Kawahara, N. ; Tagami, M. ; Withers, B. ; Kakuhara, Y. ; Imura, H. ; Ohto, K. ; Taiji, T. ; Arita, K. ; Kurokawa, T. ; Nagase, M. ; Maruyama, T. ; Oda, N. ; Hayashi, Y. ; Jacobs, J. ; M.Sakurai, M.Sakurai ; Sekine, M. ; Ueno, K. / A Novel CoWP Cap Integration for Porous Low-k/Cu Interconnects with NH3 Plasma Treatment and Low-k Top (LKT) Dielectric Structure. In: Proc. 2006 Int. Interconnect Tech. Conf. 2006 ; pp. 152-154.

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AU - Kawahara, N.

AU - Tagami, M.

AU - Withers, B.

AU - Kakuhara, Y.

AU - Imura, H.

AU - Ohto, K.

AU - Taiji, T.

AU - Arita, K.

AU - Kurokawa, T.

AU - Nagase, M.

AU - Maruyama, T.

AU - Oda, N.

AU - Hayashi, Y.

AU - Jacobs, J.

AU - M.Sakurai, M.Sakurai

AU - Sekine, M.

AU - Ueno, K.

PY - 2006/6/6

Y1 - 2006/6/6

M3 - Article

SP - 152

EP - 154

JO - Proc. 2006 Int. Interconnect Tech. Conf.

JF - Proc. 2006 Int. Interconnect Tech. Conf.

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