A process for copper film deposition by pyrolysis of organic copper materials

Engineering & Materials Science

• Pyrolysis 100%
• Copper 86%
• Atoms 41%
• Air 21%
• Metallorganic chemical vapor deposition 20%
• Lattice constants 19%
• Diffraction patterns 18%
• Fluorine 18%
• Diffraction 14%
• Crystals 13%
• X ray diffraction 13%
• Impurities 12%
• Nitrogen 12%
• Oxygen 10%
• Temperature 10%
• Carbon 10%
• Substrates 9%
• Liquids 8%

Chemical Compounds

• Pyrolysis 73%
• Liquid Film 51%
• Metallorganic Chemical Vapour Deposition 21%
• Lattice Constant 14%
• Grain Size 12%
• Fluorine Atom 11%
• Nitrogen 8%
• Liquid 7%
• X-Ray Diffraction 6%
• Dioxygen 6%
• Carbon Atom 6%