A Remarkable Thermal Resistance Reduction in a Tape Carrier Package on a Printed Circuit Board,

C.Takubo C.Takubo; H.Tazawa H.Tazawa; A.Yoshida A.Yoshida; S.Hirata S.Hirata; Y.Hiruta Y.Hiruta; T.Sudo T.Sudo; Toshio Sudo

A Remarkable Thermal Resistance Reduction in a Tape Carrier Package on a Printed Circuit Board,

C.Takubo C.Takubo, H.Tazawa H.Tazawa, A.Yoshida A.Yoshida, S.Hirata S.Hirata, Y.Hiruta Y.Hiruta, T.Sudo T.Sudo, Toshio Sudo

機能制御システム専攻

研究成果: Article › 査読

本文言語	English
ジャーナル	IEPS
出版ステータス	Published - 1993 11月 1

引用スタイル

@article{fe20584c4e114b21824f0595de42ba7f,

title = "A Remarkable Thermal Resistance Reduction in a Tape Carrier Package on a Printed Circuit Board,",

author = "C.Takubo C.Takubo and H.Tazawa H.Tazawa and A.Yoshida A.Yoshida and S.Hirata S.Hirata and Y.Hiruta Y.Hiruta and T.Sudo T.Sudo and Toshio Sudo",

year = "1993",

month = nov,

day = "1",

language = "English",

journal = "IEPS",

}