A Selective SiO2 Film-Formation Technology Using Liquid-Phase Deposition for Fully Planarized Multilevel Interconnections

Tetsuya Homma, Takuya Katoh, Yoshiaki Yamada, Yukinobu Murao

研究成果: Article査読

66 被引用数 (Scopus)

抄録

A selective SiO2 film-formation technology using liquid-phase deposition (LPD) around room temperature for fully planarized multilevel interconnections is developed. The LPD technique utilizes supersaturated hydrofluosilicic acid (H2SiF6) aqueous solution as a source liquid. The LPD-SiO2 films can be selectively formed on chemical vapor deposition (CVD) SiO2 underlayers in the trenches between photoresist patterns or tungsten wiring with photoresist as mask. For polysilicon patterns with photoresist masks, the LPD-SiO2 films creep along the polysilicon and photoresist sidewalls. The selective deposition mechanism can be explained as siloxane oligomers, which are formed in the supersaturated H2SiF6 aqueous solution, have different chemical reactivity between the photoresist and substrate surface. Global planarization of trenches between tungsten wiring is achieved using the selective LPD-SiO2 deposition technique. A fully planarized double-level tungsten interconnection is realized using both selective LPD-SiO2 film deposition and selective tungsten CVD via filling. Low contact resistance of ca. 0.3Ω/unit is achieved for via holes 0.8 μm in diam.

本文言語English
ページ(範囲)2410-2414
ページ数5
ジャーナルJournal of the Electrochemical Society
140
8
DOI
出版ステータスPublished - 1993 8
外部発表はい

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 再生可能エネルギー、持続可能性、環境
  • 表面、皮膜および薄膜
  • 電気化学
  • 材料化学

フィンガープリント

「A Selective SiO<sub>2</sub> Film-Formation Technology Using Liquid-Phase Deposition for Fully Planarized Multilevel Interconnections」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル