A study on broadband switching noise reduction by embedding high-density thin-film capacitor in a laminate package

Satoshi Kaneko, Yo Takahahsi, Toshio Sudo, Akihiro Kanno, Akiko Sugimmoto, Fujio Kuwako

研究成果: Conference contribution

11 被引用数 (Scopus)

抄録

Broadband noise reduction has been investigated by embedding a high-density thin-film decoupling capacitor as much as 1 μF in a laminate package. A complex programmable logic device (CPLD) was mounted on the laminate package instead of bare chip as a noise generating circuits. Then, the package was mounted on an evaluation board. Eight output buffer circuits of the CPLD were simultaneous switched. Switching noise between the power and ground pads on the package has been dramatically reduced by the existence of high- density thin-film decoupling capacitance inside the package.

本文言語English
ホスト出版物のタイトル2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings
出版社IEEE Computer Society
ページ73-76
ページ数4
ISBN(印刷版)9781424426331
DOI
出版ステータスPublished - 2008 1 1
イベント2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Seoul, Korea, Republic of
継続期間: 2008 12 102008 12 12

出版物シリーズ

名前2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings

Conference

Conference2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008
国/地域Korea, Republic of
CitySeoul
Period08/12/1008/12/12

ASJC Scopus subject areas

  • 再生可能エネルギー、持続可能性、環境
  • 管理、モニタリング、政策と法律
  • エネルギー(全般)
  • エネルギー工学および電力技術
  • 燃料技術
  • モデリングとシミュレーション
  • 制御およびシステム工学
  • 電子工学および電気工学

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