A thermal dissipation characteristics of integrated in-wheel motor using SiC power module

Shota Iizuka, Kan Akatsu

研究成果: Conference contribution

1 引用 (Scopus)

抜粋

In-wheel motor is one of the expected electric vehicle technologies which has superiority in the vehicle control aspects. However, the integrated in-wheel motor in which the inverter is integrated with the motor makes thermal problems because of the reduction of cooling area. This paper analyses a cooling system of the inverter integrated in-wheel motor and considers the operating conditions of the integrated SiC power module. This paper also shows the effectiveness of the cooling system using the motor case as the heat sink of the inverter and it can keep the temperature under maximum junction temperature of SiC power devices.

元の言語English
ホスト出版物のタイトル2017 IEEE 3rd International Future Energy Electronics Conference and ECCE Asia, IFEEC - ECCE Asia 2017
出版者Institute of Electrical and Electronics Engineers Inc.
ページ1251-1255
ページ数5
ISBN(電子版)9781509051571
DOI
出版物ステータスPublished - 2017 7 25
イベント3rd IEEE International Future Energy Electronics Conference and ECCE Asia, IFEEC - ECCE Asia 2017 - Kaohsiung, Taiwan, Province of China
継続期間: 2017 6 32017 6 7

出版物シリーズ

名前2017 IEEE 3rd International Future Energy Electronics Conference and ECCE Asia, IFEEC - ECCE Asia 2017

Other

Other3rd IEEE International Future Energy Electronics Conference and ECCE Asia, IFEEC - ECCE Asia 2017
Taiwan, Province of China
Kaohsiung
期間17/6/317/6/7

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering
  • Control and Optimization

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  • これを引用

    Iizuka, S., & Akatsu, K. (2017). A thermal dissipation characteristics of integrated in-wheel motor using SiC power module. : 2017 IEEE 3rd International Future Energy Electronics Conference and ECCE Asia, IFEEC - ECCE Asia 2017 (pp. 1251-1255). [7992222] (2017 IEEE 3rd International Future Energy Electronics Conference and ECCE Asia, IFEEC - ECCE Asia 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IFEEC.2017.7992222