A thermal management system for building block computing systems

Yu Fujita, Kimiyoshi Usami, Hideharu Amano

研究成果: Conference contribution

2 引用 (Scopus)

抄録

Cube-1 is a heterogeneous multiprocessor consisting of 3D stacked chips connecting with inductive coupling through chip interface (TCI). The most important problem of Cube-1 is the thermal management. Unlike TSV which can be used for heat dissipation, stacked chips are electrically contactless in inductive coupling TCI. First, by measuring the relationship between the chip temperature and leakage monitor, we examined that the leakage monitor can be used as a temperature sensor of the chip. Then, we measured the thermal characteristics of Cube-1 by leakage moniters. The chip temperature change due to the internal power was evaluated, and it appeared that the chip temperature was not changed with this level of power consumption even if the chip was sandwiched with other chips. The heat conductance through the stacked chip was also evaluated. Evaluation results show that the heat dissipation of the chip sandwiched with other chips is almost the same as that of the chip placed top on the stack. Finally, we proposed the supply voltage control system of the stacked chip by making the best use of the chip temperature data from the leakage monitor. By using the proposed control, the energy efficiency can be improved by 5% at maximum.

元の言語English
ホスト出版物のタイトルProceedings - 2014 IEEE 8th International Symposium on Embedded Multicore/Manycore SoCs, MCSoC 2014
出版者Institute of Electrical and Electronics Engineers Inc.
ページ165-171
ページ数7
ISBN(印刷物)9781479943050
DOI
出版物ステータスPublished - 2014 11 6
イベント2014 8th IEEE International Symposium on Embedded Multicore/Manycore SoCs, MCSoC 2014 - Aizu-Wakamatsu
継続期間: 2014 9 232014 9 25

Other

Other2014 8th IEEE International Symposium on Embedded Multicore/Manycore SoCs, MCSoC 2014
Aizu-Wakamatsu
期間14/9/2314/9/25

Fingerprint

Temperature control
Heat losses
Temperature
Temperature sensors
Voltage control
Energy efficiency
Electric power utilization
Control systems
Hot Temperature

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

これを引用

Fujita, Y., Usami, K., & Amano, H. (2014). A thermal management system for building block computing systems. : Proceedings - 2014 IEEE 8th International Symposium on Embedded Multicore/Manycore SoCs, MCSoC 2014 (pp. 165-171). [6949468] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MCSoC.2014.32

A thermal management system for building block computing systems. / Fujita, Yu; Usami, Kimiyoshi; Amano, Hideharu.

Proceedings - 2014 IEEE 8th International Symposium on Embedded Multicore/Manycore SoCs, MCSoC 2014. Institute of Electrical and Electronics Engineers Inc., 2014. p. 165-171 6949468.

研究成果: Conference contribution

Fujita, Y, Usami, K & Amano, H 2014, A thermal management system for building block computing systems. : Proceedings - 2014 IEEE 8th International Symposium on Embedded Multicore/Manycore SoCs, MCSoC 2014., 6949468, Institute of Electrical and Electronics Engineers Inc., pp. 165-171, 2014 8th IEEE International Symposium on Embedded Multicore/Manycore SoCs, MCSoC 2014, Aizu-Wakamatsu, 14/9/23. https://doi.org/10.1109/MCSoC.2014.32
Fujita Y, Usami K, Amano H. A thermal management system for building block computing systems. : Proceedings - 2014 IEEE 8th International Symposium on Embedded Multicore/Manycore SoCs, MCSoC 2014. Institute of Electrical and Electronics Engineers Inc. 2014. p. 165-171. 6949468 https://doi.org/10.1109/MCSoC.2014.32
Fujita, Yu ; Usami, Kimiyoshi ; Amano, Hideharu. / A thermal management system for building block computing systems. Proceedings - 2014 IEEE 8th International Symposium on Embedded Multicore/Manycore SoCs, MCSoC 2014. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 165-171
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