Adhesive bonding for integrating laser diode and optical isolator

Hideki Yokoi, Isamu Myouenzono, Norihiko Ichishima

研究成果: Conference contribution

抜粋

Integrating a laser diode and an optical isolator with a Si guiding layer was investigated by means of adhesive bonding.

元の言語English
ホスト出版物のタイトルProceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
ページ数1
DOI
出版物ステータスPublished - 2012 8 15
イベント2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 - Tokyo, Japan
継続期間: 2012 5 222012 5 23

出版物シリーズ

名前Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012

Conference

Conference2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
Japan
Tokyo
期間12/5/2212/5/23

ASJC Scopus subject areas

  • Computer Graphics and Computer-Aided Design
  • Computer Vision and Pattern Recognition

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  • これを引用

    Yokoi, H., Myouenzono, I., & Ichishima, N. (2012). Adhesive bonding for integrating laser diode and optical isolator. : Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 [6238057] (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012). https://doi.org/10.1109/LTB-3D.2012.6238057