Adhesive bonding for integrating laser diode and optical isolator

Hideki Yokoi, Isamu Myouenzono, Norihiko Ichishima

研究成果: Conference contribution

抄録

Integrating a laser diode and an optical isolator with a Si guiding layer was investigated by means of adhesive bonding.

本文言語English
ホスト出版物のタイトルProceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
ページ数1
DOI
出版ステータスPublished - 2012 8 15
イベント2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 - Tokyo, Japan
継続期間: 2012 5 222012 5 23

出版物シリーズ

名前Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012

Conference

Conference2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
CountryJapan
CityTokyo
Period12/5/2212/5/23

ASJC Scopus subject areas

  • Computer Graphics and Computer-Aided Design
  • Computer Vision and Pattern Recognition

フィンガープリント 「Adhesive bonding for integrating laser diode and optical isolator」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル