Analysis of Package Cracking During Reflow Soldering Process ? The Establishment of a Cracking Estimation Equation by Using The Stress Intensity Factor -

T.Nakazawa T.Nakazawa; K.Sawada K.Sawada; T.Sudo T.Sudo; Toshio Sudo

Analysis of Package Cracking During Reflow Soldering Process ? The Establishment of a Cracking Estimation Equation by Using The Stress Intensity Factor -

T.Nakazawa T.Nakazawa, K.Sawada K.Sawada, T.Sudo T.Sudo, Toshio Sudo

機能制御システム専攻

研究成果: Article › 査読

本文言語	English
ページ（範囲）	231-236
ジャーナル	IMC
出版ステータス	Published - 1994 5月 15

引用スタイル

@article{fd400da7042544d4bd5a9f29488a5a1d,

title = "Analysis of Package Cracking During Reflow Soldering Process ? The Establishment of a Cracking Estimation Equation by Using The Stress Intensity Factor -",

author = "T.Nakazawa T.Nakazawa and K.Sawada K.Sawada and T.Sudo T.Sudo and Toshio Sudo",

year = "1994",

month = may,

day = "15",

language = "English",

pages = "231--236",

journal = "IMC",

}