Anti-resonance peak shift due to variation of effective package inductance

Genki Kubo, Hiroki Otsuka, Ryota Kobayashi, Wataru Ichimura, Sho Kiyoshige, Masahiro Terasaki, Toshio Sudo

研究成果: Conference contribution

4 被引用数 (Scopus)

抄録

Power integrity is a serious issue in the in the modern CMOS digital systems, because power supply noise excited in core circuits induces logic instability and electromagnetic radiation. Therefore, chip-package co-design is becoming important by taking into consideration the total impedance of power distribution network (PDN) seen from the chip. Especially, parallel resonance peaks in the PDN due to the chip-package interaction induces the unwanted power supply fluctuation, and results in the degradation of signal integrity and electromagnetic interference (EMI). In this paper, peak frequency shift in the total PDN impedance in three test chips with different on-die PDN properties was observed when the package inductance was changed.

本文言語English
ホスト出版物のタイトルEDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium
ページ229-232
ページ数4
DOI
出版ステータスPublished - 2013 12 1
イベント2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013 - Nara, Japan
継続期間: 2013 12 122013 12 15

出版物シリーズ

名前EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium

Conference

Conference2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013
国/地域Japan
CityNara
Period13/12/1213/12/15

ASJC Scopus subject areas

  • 電子工学および電気工学

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