Application of novel ultrasonic cleaning equipment using waveguide mode for single-wafer cleaning process

Kazunari Suzuki, Yasuhiro Imazeki, Ki Han, Shoichi Okano, Junichiro Soejima, Yoshikazu Koike

研究成果: Conference contribution

抄録

The influence of pattern defect on semiconductor devices by ultrasonic cavitation has been reported. The authors demonstrated single-wafer cleaning using the weveguide-type ultrasonic equipment. The cavitation bubble collapse can be suppressed and the sufficient particle removal efficiency (PRE) can be obtained in the comparison with the conventional batch-wafer ultrasonic equipment. Generation of the cavitation bubble collapse was observed using photo-resist film coated on wafer.

本文言語English
ホスト出版物のタイトルAdvanced Metallization Conference 2010
ページ298-299
ページ数2
出版ステータスPublished - 2010 12 1
イベントAdvanced Metallization Conference 2010 - Albany, NY, United States
継続期間: 2010 10 52010 10 7

出版物シリーズ

名前Advanced Metallization Conference (AMC)
ISSN(印刷版)1540-1766

Conference

ConferenceAdvanced Metallization Conference 2010
国/地域United States
CityAlbany, NY
Period10/10/510/10/7

ASJC Scopus subject areas

  • 材料科学(全般)
  • 産業および生産工学

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