Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables

Naoki Azuma; Misaki Owada; Takumi Abe; Tsutomu Nakada; Makoto Kubota; Kazuyoshi Ueno

doi:10.1109/EDTM.2017.8000256

Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables

Naoki Azuma, Misaki Owada, Takumi Abe, Tsutomu Nakada, Makoto Kubota, Kazuyoshi Ueno

研究成果: Conference contribution

抄録

To evaluate electromigration (EM) reliability of solder/copper (Cu) pillar bumps, a simple and lowcost test method using a flat cable has been developed. The EM lifetime of the pillar bumps with differently plated structures or different plating chemicals were compared. The results show the different lifetime distributions depending on the different structures or plating chemicals. From the results, the developed test method is considered to be effective for evaluating the EM reliability in a process development such as optimization of plating chemicals.

本文言語	English
ホスト出版物のタイトル	2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings
出版社	Institute of Electrical and Electronics Engineers Inc.
ページ	270-272
ページ数	3
巻	2017-June
ISBN（電子版）	9781509046591
DOI	https://doi.org/10.1109/EDTM.2017.8000256
出版ステータス	Published - 2017 6 13
イベント	2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Toyama, Japan 継続期間: 2017 2 28 → 2017 3 2

Other

Other	2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017
Country	Japan
City	Toyama
Period	17/2/28 → 17/3/2

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

文献へのアクセス

10.1109/EDTM.2017.8000256

他のファイルとリンク

フィンガープリント「Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル

Azuma, N., Owada, M., Abe, T., Nakada, T., Kubota, M., & Ueno, K. (2017). Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables. In 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings (Vol. 2017-June, pp. 270-272). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDTM.2017.8000256

Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables. / Azuma, Naoki; Owada, Misaki; Abe, Takumi; Nakada, Tsutomu; Kubota, Makoto; Ueno, Kazuyoshi.

2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings. Vol. 2017-June Institute of Electrical and Electronics Engineers Inc., 2017. p. 270-272.

研究成果: Conference contribution

Azuma, N, Owada, M, Abe, T, Nakada, T, Kubota, M & Ueno, K 2017, Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables. in 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings. vol. 2017-June, Institute of Electrical and Electronics Engineers Inc., pp. 270-272, 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017, Toyama, Japan, 17/2/28. https://doi.org/10.1109/EDTM.2017.8000256

Azuma N, Owada M, Abe T, Nakada T, Kubota M, Ueno K. Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables. In 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings. Vol. 2017-June. Institute of Electrical and Electronics Engineers Inc. 2017. p. 270-272 https://doi.org/10.1109/EDTM.2017.8000256

Azuma, Naoki ; Owada, Misaki ; Abe, Takumi ; Nakada, Tsutomu ; Kubota, Makoto ; Ueno, Kazuyoshi. / Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables. 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings. Vol. 2017-June Institute of Electrical and Electronics Engineers Inc., 2017. pp. 270-272

@inproceedings{c2720438c927499eb56fa5914cbf1396,

title = "Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables",

abstract = "To evaluate electromigration (EM) reliability of solder/copper (Cu) pillar bumps, a simple and lowcost test method using a flat cable has been developed. The EM lifetime of the pillar bumps with differently plated structures or different plating chemicals were compared. The results show the different lifetime distributions depending on the different structures or plating chemicals. From the results, the developed test method is considered to be effective for evaluating the EM reliability in a process development such as optimization of plating chemicals.",

keywords = "Bump, Cu pillar, EM, Reliability, Solder",

author = "Naoki Azuma and Misaki Owada and Takumi Abe and Tsutomu Nakada and Makoto Kubota and Kazuyoshi Ueno",

year = "2017",

month = jun,

day = "13",

doi = "10.1109/EDTM.2017.8000256",

language = "English",

volume = "2017-June",

pages = "270--272",

booktitle = "2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 ; Conference date: 28-02-2017 Through 02-03-2017",

}

TY - GEN

T1 - Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables

AU - Azuma, Naoki

AU - Owada, Misaki

AU - Abe, Takumi

AU - Nakada, Tsutomu

AU - Kubota, Makoto

AU - Ueno, Kazuyoshi

PY - 2017/6/13

Y1 - 2017/6/13

N2 - To evaluate electromigration (EM) reliability of solder/copper (Cu) pillar bumps, a simple and lowcost test method using a flat cable has been developed. The EM lifetime of the pillar bumps with differently plated structures or different plating chemicals were compared. The results show the different lifetime distributions depending on the different structures or plating chemicals. From the results, the developed test method is considered to be effective for evaluating the EM reliability in a process development such as optimization of plating chemicals.

AB - To evaluate electromigration (EM) reliability of solder/copper (Cu) pillar bumps, a simple and lowcost test method using a flat cable has been developed. The EM lifetime of the pillar bumps with differently plated structures or different plating chemicals were compared. The results show the different lifetime distributions depending on the different structures or plating chemicals. From the results, the developed test method is considered to be effective for evaluating the EM reliability in a process development such as optimization of plating chemicals.

KW - Bump

KW - Cu pillar

KW - EM

KW - Reliability

KW - Solder

UR - http://www.scopus.com/inward/record.url?scp=85043687879&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85043687879&partnerID=8YFLogxK

U2 - 10.1109/EDTM.2017.8000256

DO - 10.1109/EDTM.2017.8000256

M3 - Conference contribution

AN - SCOPUS:85043687879

VL - 2017-June

SP - 270

EP - 272

BT - 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017

Y2 - 28 February 2017 through 2 March 2017

ER -