Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables

Naoki Azuma; Misaki Owada; Takumi Abe; Tsutomu Nakada; Makoto Kubota; Kazuyoshi Ueno

doi:10.1109/EDTM.2017.8000256

Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables

Naoki Azuma, Misaki Owada, Takumi Abe, Tsutomu Nakada, Makoto Kubota, Kazuyoshi Ueno

研究成果: Conference contribution

抄録

To evaluate electromigration (EM) reliability of solder/copper (Cu) pillar bumps, a simple and lowcost test method using a flat cable has been developed. The EM lifetime of the pillar bumps with differently plated structures or different plating chemicals were compared. The results show the different lifetime distributions depending on the different structures or plating chemicals. From the results, the developed test method is considered to be effective for evaluating the EM reliability in a process development such as optimization of plating chemicals.

本文言語	English
ホスト出版物のタイトル	2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings
出版社	Institute of Electrical and Electronics Engineers Inc.
ページ	270-272
ページ数	3
巻	2017-June
ISBN（電子版）	9781509046591
DOI	https://doi.org/10.1109/EDTM.2017.8000256
出版ステータス	Published - 2017 6月 13
イベント	2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Toyama, Japan 継続期間: 2017 2月 28 → 2017 3月 2

Other

Other	2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017
国/地域	Japan
City	Toyama
Period	17/2/28 → 17/3/2

ASJC Scopus subject areas

ハードウェアとアーキテクチャ
電子工学および電気工学

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10.1109/EDTM.2017.8000256

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引用スタイル

Azuma, N., Owada, M., Abe, T., Nakada, T., Kubota, M., & Ueno, K. (2017). Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables. In 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings (Vol. 2017-June, pp. 270-272). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDTM.2017.8000256

Azuma, N, Owada, M, Abe, T, Nakada, T, Kubota, M & Ueno, K 2017, Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables. in 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings. vol. 2017-June, Institute of Electrical and Electronics Engineers Inc., pp. 270-272, 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017, Toyama, Japan, 17/2/28. https://doi.org/10.1109/EDTM.2017.8000256

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title = "Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables",

abstract = "To evaluate electromigration (EM) reliability of solder/copper (Cu) pillar bumps, a simple and lowcost test method using a flat cable has been developed. The EM lifetime of the pillar bumps with differently plated structures or different plating chemicals were compared. The results show the different lifetime distributions depending on the different structures or plating chemicals. From the results, the developed test method is considered to be effective for evaluating the EM reliability in a process development such as optimization of plating chemicals.",

keywords = "Bump, Cu pillar, EM, Reliability, Solder",

author = "Naoki Azuma and Misaki Owada and Takumi Abe and Tsutomu Nakada and Makoto Kubota and Kazuyoshi Ueno",

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doi = "10.1109/EDTM.2017.8000256",

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booktitle = "2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings",

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T1 - Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables

AU - Azuma, Naoki

AU - Owada, Misaki

AU - Abe, Takumi

AU - Nakada, Tsutomu

AU - Kubota, Makoto

AU - Ueno, Kazuyoshi

PY - 2017/6/13

Y1 - 2017/6/13

N2 - To evaluate electromigration (EM) reliability of solder/copper (Cu) pillar bumps, a simple and lowcost test method using a flat cable has been developed. The EM lifetime of the pillar bumps with differently plated structures or different plating chemicals were compared. The results show the different lifetime distributions depending on the different structures or plating chemicals. From the results, the developed test method is considered to be effective for evaluating the EM reliability in a process development such as optimization of plating chemicals.

AB - To evaluate electromigration (EM) reliability of solder/copper (Cu) pillar bumps, a simple and lowcost test method using a flat cable has been developed. The EM lifetime of the pillar bumps with differently plated structures or different plating chemicals were compared. The results show the different lifetime distributions depending on the different structures or plating chemicals. From the results, the developed test method is considered to be effective for evaluating the EM reliability in a process development such as optimization of plating chemicals.

KW - Bump

KW - Cu pillar

KW - EM

KW - Reliability

KW - Solder

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BT - 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017

Y2 - 28 February 2017 through 2 March 2017

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Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables

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