Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables

Naoki Azuma, Misaki Owada, Takumi Abe, Tsutomu Nakada, Makoto Kubota, Kazuyoshi Ueno

研究成果: Conference contribution

抄録

To evaluate electromigration (EM) reliability of solder/copper (Cu) pillar bumps, a simple and lowcost test method using a flat cable has been developed. The EM lifetime of the pillar bumps with differently plated structures or different plating chemicals were compared. The results show the different lifetime distributions depending on the different structures or plating chemicals. From the results, the developed test method is considered to be effective for evaluating the EM reliability in a process development such as optimization of plating chemicals.

本文言語English
ホスト出版物のタイトル2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings
出版社Institute of Electrical and Electronics Engineers Inc.
ページ270-272
ページ数3
2017-June
ISBN(電子版)9781509046591
DOI
出版ステータスPublished - 2017 6 13
イベント2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Toyama, Japan
継続期間: 2017 2 282017 3 2

Other

Other2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017
CountryJapan
CityToyama
Period17/2/2817/3/2

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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