抄録
To evaluate electromigration (EM) reliability of solder/copper (Cu) pillar bumps, a simple and lowcost test method using a flat cable has been developed. The EM lifetime of the pillar bumps with differently plated structures or different plating chemicals were compared. The results show the different lifetime distributions depending on the different structures or plating chemicals. From the results, the developed test method is considered to be effective for evaluating the EM reliability in a process development such as optimization of plating chemicals.
本文言語 | English |
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ホスト出版物のタイトル | 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings |
出版社 | Institute of Electrical and Electronics Engineers Inc. |
ページ | 270-272 |
ページ数 | 3 |
巻 | 2017-June |
ISBN(電子版) | 9781509046591 |
DOI | |
出版ステータス | Published - 2017 6月 13 |
イベント | 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Toyama, Japan 継続期間: 2017 2月 28 → 2017 3月 2 |
Other
Other | 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 |
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国/地域 | Japan |
City | Toyama |
Period | 17/2/28 → 17/3/2 |
ASJC Scopus subject areas
- ハードウェアとアーキテクチャ
- 電子工学および電気工学