抄録
To evaluate electromigration (EM) reliability of solder/copper (Cu) pillar bumps, a simple and lowcost test method using a flat cable has been developed. The EM lifetime of the pillar bumps with differently plated structures or different plating chemicals were compared. The results show the different lifetime distributions depending on the different structures or plating chemicals. From the results, the developed test method is considered to be effective for evaluating the EM reliability in a process development such as optimization of plating chemicals.
| 元の言語 | English |
|---|---|
| ホスト出版物のタイトル | 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings |
| 出版者 | Institute of Electrical and Electronics Engineers Inc. |
| ページ | 270-272 |
| ページ数 | 3 |
| 巻 | 2017-June |
| ISBN（電子版） | 9781509046591 |
| DOI | |
| 出版物ステータス | Published - 2017 6 13 |
| イベント | 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Toyama, Japan 継続期間: 2017 2 28 → 2017 3 2 |
Other
| Other | 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 |
|---|---|
| 国 | Japan |
| 市 | Toyama |
| 期間 | 17/2/28 → 17/3/2 |
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ASJC Scopus subject areas
- Hardware and Architecture
- Electrical and Electronic Engineering
これを引用
Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables. / Azuma, Naoki; Owada, Misaki; Abe, Takumi; Nakada, Tsutomu; Kubota, Makoto; Ueno, Kazuyoshi.
2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings. 巻 2017-June Institute of Electrical and Electronics Engineers Inc., 2017. p. 270-272.研究成果: Conference contribution
}
TY - GEN
T1 - Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables
AU - Azuma, Naoki
AU - Owada, Misaki
AU - Abe, Takumi
AU - Nakada, Tsutomu
AU - Kubota, Makoto
AU - Ueno, Kazuyoshi
PY - 2017/6/13
Y1 - 2017/6/13
N2 - To evaluate electromigration (EM) reliability of solder/copper (Cu) pillar bumps, a simple and lowcost test method using a flat cable has been developed. The EM lifetime of the pillar bumps with differently plated structures or different plating chemicals were compared. The results show the different lifetime distributions depending on the different structures or plating chemicals. From the results, the developed test method is considered to be effective for evaluating the EM reliability in a process development such as optimization of plating chemicals.
AB - To evaluate electromigration (EM) reliability of solder/copper (Cu) pillar bumps, a simple and lowcost test method using a flat cable has been developed. The EM lifetime of the pillar bumps with differently plated structures or different plating chemicals were compared. The results show the different lifetime distributions depending on the different structures or plating chemicals. From the results, the developed test method is considered to be effective for evaluating the EM reliability in a process development such as optimization of plating chemicals.
KW - Bump
KW - Cu pillar
KW - EM
KW - Reliability
KW - Solder
UR - http://www.scopus.com/inward/record.url?scp=85043687879&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85043687879&partnerID=8YFLogxK
U2 - 10.1109/EDTM.2017.8000256
DO - 10.1109/EDTM.2017.8000256
M3 - Conference contribution
AN - SCOPUS:85043687879
VL - 2017-June
SP - 270
EP - 272
BT - 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
ER -