Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables

Naoki Azuma, Misaki Owada, Takumi Abe, Tsutomu Nakada, Makoto Kubota, Kazuyoshi Ueno

研究成果: Conference contribution

抜粋

To evaluate electromigration (EM) reliability of solder/copper (Cu) pillar bumps, a simple and lowcost test method using a flat cable has been developed. The EM lifetime of the pillar bumps with differently plated structures or different plating chemicals were compared. The results show the different lifetime distributions depending on the different structures or plating chemicals. From the results, the developed test method is considered to be effective for evaluating the EM reliability in a process development such as optimization of plating chemicals.

元の言語English
ホスト出版物のタイトル2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings
出版者Institute of Electrical and Electronics Engineers Inc.
ページ270-272
ページ数3
2017-June
ISBN(電子版)9781509046591
DOI
出版物ステータスPublished - 2017 6 13
イベント2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Toyama, Japan
継続期間: 2017 2 282017 3 2

Other

Other2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017
Japan
Toyama
期間17/2/2817/3/2

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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  • これを引用

    Azuma, N., Owada, M., Abe, T., Nakada, T., Kubota, M., & Ueno, K. (2017). Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables. : 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings (巻 2017-June, pp. 270-272). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDTM.2017.8000256