Behavior of switching noise and electromagnetic radiation in relation to package properties and on-chip decoupling capacitance

Toshio Sudo

研究成果: Conference contribution

15 引用 (Scopus)

抄録

Simultaneous switching noise (SSN) and electromagnetic radiation were intensively examined experimentally by using different test LSIs and packages. Two types of test LSIs have been designed and fabricated in 0.25 um CMOS process. One was with on-chip decoupling capacitance (ODC), and the other was without ODC. Then, two types of packages; quad flat package (QFP) and chip scale package (CSP) were used for housing them. First, SSN and radiated emission for the combination of two types of chips and two types of packages were measured by exciting output circuit and core logic circuit independently. QFP with larger package inductance showed larger power/ground fluctuation than CSP. On the other hand, QFP showed smaller emission properties than CSP. It is because package inductance worked as a filtering component. For both packages, every harmonics was reduced for the core circuit operation due to ODC, while it has been found that only even-order harmonics were dramatically decreased for the output buffer circuit operation.

元の言語English
ホスト出版物のタイトル17th International Zurich Symposium on Electromagnetic Compatibility, 2006
ページ568-573
ページ数6
2006
出版物ステータスPublished - 2006
イベント17th International Zurich Symposium on Electromagnetic Compatibility, 2006 - Singapore
継続期間: 2006 2 272006 3 3

Other

Other17th International Zurich Symposium on Electromagnetic Compatibility, 2006
Singapore
期間06/2/2706/3/3

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Chip scale packages
Electromagnetic waves
Capacitance
Inductance
Buffer circuits
Networks (circuits)
Logic circuits

ASJC Scopus subject areas

  • Engineering(all)

これを引用

Sudo, T. (2006). Behavior of switching noise and electromagnetic radiation in relation to package properties and on-chip decoupling capacitance. : 17th International Zurich Symposium on Electromagnetic Compatibility, 2006 (巻 2006, pp. 568-573). [1629688]

Behavior of switching noise and electromagnetic radiation in relation to package properties and on-chip decoupling capacitance. / Sudo, Toshio.

17th International Zurich Symposium on Electromagnetic Compatibility, 2006. 巻 2006 2006. p. 568-573 1629688.

研究成果: Conference contribution

Sudo, T 2006, Behavior of switching noise and electromagnetic radiation in relation to package properties and on-chip decoupling capacitance. : 17th International Zurich Symposium on Electromagnetic Compatibility, 2006. 巻. 2006, 1629688, pp. 568-573, 17th International Zurich Symposium on Electromagnetic Compatibility, 2006, Singapore, 06/2/27.
Sudo T. Behavior of switching noise and electromagnetic radiation in relation to package properties and on-chip decoupling capacitance. : 17th International Zurich Symposium on Electromagnetic Compatibility, 2006. 巻 2006. 2006. p. 568-573. 1629688
Sudo, Toshio. / Behavior of switching noise and electromagnetic radiation in relation to package properties and on-chip decoupling capacitance. 17th International Zurich Symposium on Electromagnetic Compatibility, 2006. 巻 2006 2006. pp. 568-573
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