Building block multi-chip systems using inductive coupling through chip interface

Hideharu Amano, Tadahiro Kuroda, Hiroshi Nakamura, Kimiyoshi Usami, Masaaki Kondo, Hiroki Matsutani, Mitaro Namiki

研究成果: Conference contribution

抄録

A building block computing system is consisting of multiple chips connecting with inductive coupling wireless through chip interconnect. Like building Lego blocks, various types of systems can be built by stacking different types of chips. In order to develop such systems, several techniques are investigated in the project: that is, inductive coupling wireless through chip interface, low power circuit technologies, autonomous interconnection network architectures, thermal dissipation and building block operating system. Here, the overview of the project and a prototype system are introduced.

元の言語English
ホスト出版物のタイトルProceedings - International SoC Design Conference 2017, ISOCC 2017
出版者Institute of Electrical and Electronics Engineers Inc.
ページ152-154
ページ数3
ISBN(電子版)9781538622858
DOI
出版物ステータスPublished - 2018 5 29
外部発表Yes
イベント14th International SoC Design Conference, ISOCC 2017 - Seoul, Korea, Republic of
継続期間: 2017 11 52017 11 8

Other

Other14th International SoC Design Conference, ISOCC 2017
Korea, Republic of
Seoul
期間17/11/517/11/8

Fingerprint

Computer operating systems
Network architecture
Interfaces (computer)
Networks (circuits)
Hot Temperature

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

これを引用

Amano, H., Kuroda, T., Nakamura, H., Usami, K., Kondo, M., Matsutani, H., & Namiki, M. (2018). Building block multi-chip systems using inductive coupling through chip interface. : Proceedings - International SoC Design Conference 2017, ISOCC 2017 (pp. 152-154). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISOCC.2017.8368842

Building block multi-chip systems using inductive coupling through chip interface. / Amano, Hideharu; Kuroda, Tadahiro; Nakamura, Hiroshi; Usami, Kimiyoshi; Kondo, Masaaki; Matsutani, Hiroki; Namiki, Mitaro.

Proceedings - International SoC Design Conference 2017, ISOCC 2017. Institute of Electrical and Electronics Engineers Inc., 2018. p. 152-154.

研究成果: Conference contribution

Amano, H, Kuroda, T, Nakamura, H, Usami, K, Kondo, M, Matsutani, H & Namiki, M 2018, Building block multi-chip systems using inductive coupling through chip interface. : Proceedings - International SoC Design Conference 2017, ISOCC 2017. Institute of Electrical and Electronics Engineers Inc., pp. 152-154, 14th International SoC Design Conference, ISOCC 2017, Seoul, Korea, Republic of, 17/11/5. https://doi.org/10.1109/ISOCC.2017.8368842
Amano H, Kuroda T, Nakamura H, Usami K, Kondo M, Matsutani H その他. Building block multi-chip systems using inductive coupling through chip interface. : Proceedings - International SoC Design Conference 2017, ISOCC 2017. Institute of Electrical and Electronics Engineers Inc. 2018. p. 152-154 https://doi.org/10.1109/ISOCC.2017.8368842
Amano, Hideharu ; Kuroda, Tadahiro ; Nakamura, Hiroshi ; Usami, Kimiyoshi ; Kondo, Masaaki ; Matsutani, Hiroki ; Namiki, Mitaro. / Building block multi-chip systems using inductive coupling through chip interface. Proceedings - International SoC Design Conference 2017, ISOCC 2017. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 152-154
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