Characterization and reduction of simultaneous switching noise for a multilayer package

Naohiko Hirano, Masayuki Miura, Yoichi Hiruta, Toshio Sudo

研究成果: Conference contribution

15 被引用数 (Scopus)

抄録

This paper reports a test chip and an experimental method for characterizing the simultaneous switching noise (SSN) and the noise dependency on the ground pin assignment of a multilayer package. The SSN measurement was executed for various ground pin assignments. The measured results demonstrated that an extra electric current path of the displaced ground pin assignment enhanced the ground bounce due to increasing the effective inductance of package. A balanced pin assignment of the ground pins which suppressed the extra current path in the ground plane had a 20% reduction effect for SSN compared with conventional pin assignments. The extra current path of the ground plane was also verified by an electromagnetic field simulation. The modeling procedure was established for the noise estimation using the inductance value estimated by the field simulation. The circuit simulation resulted in a good agreement with the measured results, and the noise simulation method was applicable for the noise estimation at earlier stage of the package design.

本文言語English
ホスト出版物のタイトルProceedings - Electronic Components and Technology Conference
出版社Publ by IEEE
ページ949-956
ページ数8
ISBN(印刷版)0780309154
出版ステータスPublished - 1994 1 1
イベントProceedings of the 1994 IEEE 44th Electronic Components & Technology Conference - Washington, DC, USA
継続期間: 1994 5 11994 5 4

出版物シリーズ

名前Proceedings - Electronic Components and Technology Conference
ISSN(印刷版)0569-5503

Other

OtherProceedings of the 1994 IEEE 44th Electronic Components & Technology Conference
CityWashington, DC, USA
Period94/5/194/5/4

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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