| 元の言語 | English |
|---|---|
| ジャーナル | Asia-pacific EMC Symposium 2011 |
| 出版物ステータス | Published - 2011 5 18 |
これを引用
Sakuma, K., & Sudo, T. (2011). Chip-Package-Board Modeling for LCD Driver IC. Asia-pacific EMC Symposium 2011.
Chip-Package-Board Modeling for LCD Driver IC. / Sakuma, Koji; Sudo, Toshio.
：: Asia-pacific EMC Symposium 2011, 18.05.2011.研究成果: Article
Sakuma, K & Sudo, T 2011, 'Chip-Package-Board Modeling for LCD Driver IC', Asia-pacific EMC Symposium 2011.
Sakuma K, Sudo T. Chip-Package-Board Modeling for LCD Driver IC. Asia-pacific EMC Symposium 2011. 2011 5 18.
@article{c212c22bbea54befb40f1dc61a59b100,
title = "Chip-Package-Board Modeling for LCD Driver IC",
author = "Koji Sakuma and Toshio Sudo",
year = "2011",
month = "5",
day = "18",
language = "English",
journal = "Asia-pacific EMC Symposium 2011",
}
TY - JOUR
T1 - Chip-Package-Board Modeling for LCD Driver IC
AU - Sakuma, Koji
AU - Sudo, Toshio
PY - 2011/5/18
Y1 - 2011/5/18
M3 - Article
JO - Asia-pacific EMC Symposium 2011
JF - Asia-pacific EMC Symposium 2011
ER -