Chip-Package-Board Modeling for LCD Driver IC

Koji Sakuma, Toshio Sudo

研究成果: Article

元の言語English
ジャーナルAsia-pacific EMC Symposium 2011
出版物ステータスPublished - 2011 5 18

これを引用

Chip-Package-Board Modeling for LCD Driver IC. / Sakuma, Koji; Sudo, Toshio.

:: Asia-pacific EMC Symposium 2011, 18.05.2011.

研究成果: Article

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