Cleaning of CHF3 plasma etched SiO2/SiN/Cu via structures

K.Ueno K.Ueno, V.M.Donnelly V.M.Donnelly, Y.Tsuchiya Y.Tsuchiya, K.Ohto K.Ohto, T.Kikkawa T.Kikkawa, Kazuyoshi Ueno

研究成果: Article

元の言語English
ページ(範囲)245-250
ジャーナルProceedings of 1996 VLSI Multilevel Interconnection Conference
出版物ステータスPublished - 1996 5 1

これを引用

K.Ueno, K. U., V.M.Donnelly, V. M. D., Y.Tsuchiya, Y. T., K.Ohto, K. O., T.Kikkawa, T. K., & Ueno, K. (1996). Cleaning of CHF3 plasma etched SiO2/SiN/Cu via structures. Proceedings of 1996 VLSI Multilevel Interconnection Conference, 245-250.

Cleaning of CHF3 plasma etched SiO2/SiN/Cu via structures. / K.Ueno, K.Ueno; V.M.Donnelly, V.M.Donnelly; Y.Tsuchiya, Y.Tsuchiya; K.Ohto, K.Ohto; T.Kikkawa, T.Kikkawa; Ueno, Kazuyoshi.

:: Proceedings of 1996 VLSI Multilevel Interconnection Conference, 01.05.1996, p. 245-250.

研究成果: Article

K.Ueno, KU, V.M.Donnelly, VMD, Y.Tsuchiya, YT, K.Ohto, KO, T.Kikkawa, TK & Ueno, K 1996, 'Cleaning of CHF3 plasma etched SiO2/SiN/Cu via structures', Proceedings of 1996 VLSI Multilevel Interconnection Conference, pp. 245-250.
K.Ueno KU, V.M.Donnelly VMD, Y.Tsuchiya YT, K.Ohto KO, T.Kikkawa TK, Ueno K. Cleaning of CHF3 plasma etched SiO2/SiN/Cu via structures. Proceedings of 1996 VLSI Multilevel Interconnection Conference. 1996 5 1;245-250.
K.Ueno, K.Ueno ; V.M.Donnelly, V.M.Donnelly ; Y.Tsuchiya, Y.Tsuchiya ; K.Ohto, K.Ohto ; T.Kikkawa, T.Kikkawa ; Ueno, Kazuyoshi. / Cleaning of CHF3 plasma etched SiO2/SiN/Cu via structures. :: Proceedings of 1996 VLSI Multilevel Interconnection Conference. 1996 ; pp. 245-250.
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AU - K.Ohto, K.Ohto

AU - T.Kikkawa, T.Kikkawa

AU - Ueno, Kazuyoshi

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