TY - GEN
T1 - Co-analysis of signal and power integrity of 3D stacked package using flexible printed circuits
AU - Ikemiya, Keisuke
AU - Kanazawa, Masato
AU - Sudo, Toshio
AU - Masuda, Shizuaki
AU - Hirakawa, Yasushi
AU - Wada, Kikuo
PY - 2012/12/1
Y1 - 2012/12/1
N2 - Three dimensionally stacked package using FFCSP (Flexible carrier Folded real Chip Size Package) has been developed as one solution of high-density DRAM module. FPC (Flexible printed circuit) was effectively utilized to construct the pads at the both top and bottom sides of PoP (package-on-package) structure. In such multi-tiered package structures, the power supply stability for the upper tiered package is estimated to be worse than that of the lower tiered package due to parasitic inductance. In this paper, the co-analysis model including signal integrity (SI) and power integrity (PI) has been established to evaluate the power supply and signal quality among the multi-tiered chips. In particular, the power distribution networks (PDN) and eye diagrams for multi-tiered package were discussed.
AB - Three dimensionally stacked package using FFCSP (Flexible carrier Folded real Chip Size Package) has been developed as one solution of high-density DRAM module. FPC (Flexible printed circuit) was effectively utilized to construct the pads at the both top and bottom sides of PoP (package-on-package) structure. In such multi-tiered package structures, the power supply stability for the upper tiered package is estimated to be worse than that of the lower tiered package due to parasitic inductance. In this paper, the co-analysis model including signal integrity (SI) and power integrity (PI) has been established to evaluate the power supply and signal quality among the multi-tiered chips. In particular, the power distribution networks (PDN) and eye diagrams for multi-tiered package were discussed.
UR - http://www.scopus.com/inward/record.url?scp=84872535464&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84872535464&partnerID=8YFLogxK
U2 - 10.1109/EMCEurope.2012.6396881
DO - 10.1109/EMCEurope.2012.6396881
M3 - Conference contribution
AN - SCOPUS:84872535464
SN - 9781467307185
T3 - IEEE International Symposium on Electromagnetic Compatibility
BT - EMC EUROPE 2012 - International Symposium on Electromagnetic Compatibility, Proceedings
T2 - International Symposium on Electromagnetic Compatibility, EMC EUROPE 2012
Y2 - 17 September 2012 through 21 September 2012
ER -