TY - GEN
T1 - Concurrent reactive ion etching employing micromachined ionic liquid ion source array
AU - Yoshida, Ryo
AU - Hara, Motoaki
AU - Oguchi, Hiroyuki
AU - Suzuki, Tatsuya
AU - Kuwano, Hiroki
PY - 2014
Y1 - 2014
N2 - This paper describes concurrent reactive ion etching using micro ionic liquid ion source (ILIS) array. The system consists of micro needle emitters and a reservoir for the ionic liquid (IL) of 1-ethyl-3-methylimidazolium tetrafluoroborate ([EMIM]-[BF4]). The ion beam etching of a (100) silicon substrate using the fabricated ILIS array was demonstrated. As a result of mass spectroscopy during the etching, the peaks of SiF+, SiF 2+, and SiF3+ were observed. The chemical reaction between the silicon and fluorine based ions from the IL was confirmed. Also, etching rate of the silicon using the ILIS array applying 5.1 kV ion-acceleration voltage was calculated from the etched dimple on the substrate and was 1.5 times larger than that of a conventional focused Ga + ion beam applying 30 kV ion-acceleration voltage.
AB - This paper describes concurrent reactive ion etching using micro ionic liquid ion source (ILIS) array. The system consists of micro needle emitters and a reservoir for the ionic liquid (IL) of 1-ethyl-3-methylimidazolium tetrafluoroborate ([EMIM]-[BF4]). The ion beam etching of a (100) silicon substrate using the fabricated ILIS array was demonstrated. As a result of mass spectroscopy during the etching, the peaks of SiF+, SiF 2+, and SiF3+ were observed. The chemical reaction between the silicon and fluorine based ions from the IL was confirmed. Also, etching rate of the silicon using the ILIS array applying 5.1 kV ion-acceleration voltage was calculated from the etched dimple on the substrate and was 1.5 times larger than that of a conventional focused Ga + ion beam applying 30 kV ion-acceleration voltage.
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U2 - 10.1109/MEMSYS.2014.6765677
DO - 10.1109/MEMSYS.2014.6765677
M3 - Conference contribution
AN - SCOPUS:84899032601
SN - 9781479935086
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 463
EP - 466
BT - MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014
Y2 - 26 January 2014 through 30 January 2014
ER -