Contact angle measurement of wafer surfaces for integrating laser diode and optical isolator by wafer bonding

Hideki Yokoi, Tetsuya Mizumoto, Masafumi Shimizu, Takashi Waniishi, Naoki Futakuchi, Noriaki Kaida, Yoshiaki Nakano

研究成果: Article査読

本文言語English
ジャーナルThe Electrochemical Society
出版ステータスPublished - 1999 10 19

引用スタイル