Contact angle measurement of wafer surfaces for integrating laser diode and optical isolator by wafer bonding

Hideki Yokoi, Tetsuya Mizumoto, Masafumi Shimizu, Takashi Waniishi, Naoki Futakuchi, Noriaki Kaida, Yoshiaki Nakano

研究成果: Article

元の言語English
ジャーナルThe Electrochemical Society
出版物ステータスPublished - 1999 10 19

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