Cure Shrinkage Behavior Analysis in Ultraviolet Curable Adhesive using Finite Element Method

Yuga Sato, Yoshiharu Kariya

研究成果: Conference contribution

抜粋

A method of analyzing cure shrinkage behaviors of UV curable adhesive with the use of a general purpose FEM code was proposed, and effects of influential factors on misalignment of camera lens fixing were analyzed. It was found that the interactions between the cure shrinkage of the adhesive and the differences in coating volume was highly significant.

元の言語English
ホスト出版物のタイトルProceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
出版者Institute of Electrical and Electronics Engineers Inc.
ページ数1
ISBN(電子版)9784904743072
DOI
出版物ステータスPublished - 2019 5
イベント6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 - Kanazawa, Ishikawa, Japan
継続期間: 2019 5 212019 5 25

出版物シリーズ

名前Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019

Conference

Conference6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
Japan
Kanazawa, Ishikawa
期間19/5/2119/5/25

ASJC Scopus subject areas

  • Process Chemistry and Technology
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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  • これを引用

    Sato, Y., & Kariya, Y. (2019). Cure Shrinkage Behavior Analysis in Ultraviolet Curable Adhesive using Finite Element Method. : Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 [8735106] (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/LTB-3D.2019.8735106