Cure Shrinkage Behavior Analysis in Ultraviolet Curable Adhesive using Finite Element Method

Yuga Sato, Yoshiharu Kariya

研究成果: Conference contribution

抄録

A method of analyzing cure shrinkage behaviors of UV curable adhesive with the use of a general purpose FEM code was proposed, and effects of influential factors on misalignment of camera lens fixing were analyzed. It was found that the interactions between the cure shrinkage of the adhesive and the differences in coating volume was highly significant.

元の言語English
ホスト出版物のタイトルProceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
出版者Institute of Electrical and Electronics Engineers Inc.
ページ数1
ISBN(電子版)9784904743072
DOI
出版物ステータスPublished - 2019 5 1
イベント6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 - Kanazawa, Ishikawa, Japan
継続期間: 2019 5 212019 5 25

出版物シリーズ

名前Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019

Conference

Conference6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
Japan
Kanazawa, Ishikawa
期間19/5/2119/5/25

Fingerprint

Adhesives
Camera lenses
Finite element method
Coatings

ASJC Scopus subject areas

  • Process Chemistry and Technology
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

これを引用

Sato, Y., & Kariya, Y. (2019). Cure Shrinkage Behavior Analysis in Ultraviolet Curable Adhesive using Finite Element Method. : Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 [8735106] (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/LTB-3D.2019.8735106

Cure Shrinkage Behavior Analysis in Ultraviolet Curable Adhesive using Finite Element Method. / Sato, Yuga; Kariya, Yoshiharu.

Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 2019. 8735106 (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Sato, Y & Kariya, Y 2019, Cure Shrinkage Behavior Analysis in Ultraviolet Curable Adhesive using Finite Element Method. : Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019., 8735106, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019, Institute of Electrical and Electronics Engineers Inc., 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019, Kanazawa, Ishikawa, Japan, 19/5/21. https://doi.org/10.23919/LTB-3D.2019.8735106
Sato Y, Kariya Y. Cure Shrinkage Behavior Analysis in Ultraviolet Curable Adhesive using Finite Element Method. : Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc. 2019. 8735106. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019). https://doi.org/10.23919/LTB-3D.2019.8735106
Sato, Yuga ; Kariya, Yoshiharu. / Cure Shrinkage Behavior Analysis in Ultraviolet Curable Adhesive using Finite Element Method. Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 2019. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).
@inproceedings{0f26a7e303234efbbeaeada648787c10,
title = "Cure Shrinkage Behavior Analysis in Ultraviolet Curable Adhesive using Finite Element Method",
abstract = "A method of analyzing cure shrinkage behaviors of UV curable adhesive with the use of a general purpose FEM code was proposed, and effects of influential factors on misalignment of camera lens fixing were analyzed. It was found that the interactions between the cure shrinkage of the adhesive and the differences in coating volume was highly significant.",
author = "Yuga Sato and Yoshiharu Kariya",
year = "2019",
month = "5",
day = "1",
doi = "10.23919/LTB-3D.2019.8735106",
language = "English",
series = "Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019",

}

TY - GEN

T1 - Cure Shrinkage Behavior Analysis in Ultraviolet Curable Adhesive using Finite Element Method

AU - Sato, Yuga

AU - Kariya, Yoshiharu

PY - 2019/5/1

Y1 - 2019/5/1

N2 - A method of analyzing cure shrinkage behaviors of UV curable adhesive with the use of a general purpose FEM code was proposed, and effects of influential factors on misalignment of camera lens fixing were analyzed. It was found that the interactions between the cure shrinkage of the adhesive and the differences in coating volume was highly significant.

AB - A method of analyzing cure shrinkage behaviors of UV curable adhesive with the use of a general purpose FEM code was proposed, and effects of influential factors on misalignment of camera lens fixing were analyzed. It was found that the interactions between the cure shrinkage of the adhesive and the differences in coating volume was highly significant.

UR - http://www.scopus.com/inward/record.url?scp=85068393636&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85068393636&partnerID=8YFLogxK

U2 - 10.23919/LTB-3D.2019.8735106

DO - 10.23919/LTB-3D.2019.8735106

M3 - Conference contribution

AN - SCOPUS:85068393636

T3 - Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019

BT - Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019

PB - Institute of Electrical and Electronics Engineers Inc.

ER -