TY - GEN
T1 - Cure Shrinkage Behavior Analysis in Ultraviolet Curable Adhesive using Finite Element Method
AU - Sato, Yuga
AU - Kariya, Yoshiharu
PY - 2019/5
Y1 - 2019/5
N2 - A method of analyzing cure shrinkage behaviors of UV curable adhesive with the use of a general purpose FEM code was proposed, and effects of influential factors on misalignment of camera lens fixing were analyzed. It was found that the interactions between the cure shrinkage of the adhesive and the differences in coating volume was highly significant.
AB - A method of analyzing cure shrinkage behaviors of UV curable adhesive with the use of a general purpose FEM code was proposed, and effects of influential factors on misalignment of camera lens fixing were analyzed. It was found that the interactions between the cure shrinkage of the adhesive and the differences in coating volume was highly significant.
UR - http://www.scopus.com/inward/record.url?scp=85068393636&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85068393636&partnerID=8YFLogxK
U2 - 10.23919/LTB-3D.2019.8735106
DO - 10.23919/LTB-3D.2019.8735106
M3 - Conference contribution
AN - SCOPUS:85068393636
T3 - Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
BT - Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
Y2 - 21 May 2019 through 25 May 2019
ER -