TY - JOUR
T1 - Current induced grain growth of electroplated copper film
AU - Razak, Liyana
AU - Yamaguchi, Takamasa
AU - Akahori, Seishi
AU - Hashimoto, Hideki
AU - Ueno, Kazuyoshi
PY - 2012/5
Y1 - 2012/5
N2 - To study the potential of electric current stress in enhancing the grain growth of electroplated copper (Cu) films, the behavior of Cu grain growth at different additive concentrations with current stress applied was investigated. It was found that the lower poly(ethylene glycol) (PEG) concentration alone slightly enhanced the grain growth, but the higher sulfopropyl sulfonate (SPS) concentration was favored in assisting larger grain growth in the current induced grain growth. The effect of current density and temperature on the current induced grain growth have also been studied, and it was found that current stress with a high current density and at a high temperature promotes a larger grain size and anisotropic grain growth along the current direction.
AB - To study the potential of electric current stress in enhancing the grain growth of electroplated copper (Cu) films, the behavior of Cu grain growth at different additive concentrations with current stress applied was investigated. It was found that the lower poly(ethylene glycol) (PEG) concentration alone slightly enhanced the grain growth, but the higher sulfopropyl sulfonate (SPS) concentration was favored in assisting larger grain growth in the current induced grain growth. The effect of current density and temperature on the current induced grain growth have also been studied, and it was found that current stress with a high current density and at a high temperature promotes a larger grain size and anisotropic grain growth along the current direction.
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U2 - 10.1143/JJAP.51.05EA04
DO - 10.1143/JJAP.51.05EA04
M3 - Article
AN - SCOPUS:84861503496
VL - 51
JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
SN - 0021-4922
IS - 5 PART 2
M1 - 05EA04
ER -