Current Soldering Technology and Reliability Issue in Lead-Free Solder for Electronic Assembly

Yoshiharu Kariya, Masahisa Otsuka

研究成果: Article

2 引用 (Scopus)
元の言語English
ページ(範囲)108-112
ページ数5
ジャーナルYosetsu Gakkai Shi/Journal of the Japan Welding Society
69
発行部数2
DOI
出版物ステータスPublished - 2000 1 1
外部発表Yes

ASJC Scopus subject areas

  • Mechanics of Materials
  • Mechanical Engineering
  • Surfaces, Coatings and Films
  • Metals and Alloys

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