Degradation of electromigration lifetime of Cu/Low-k interconnects by postannealing

Yumi Kakuhara, Kazuyoshi Ueno

研究成果: Article

1 引用 (Scopus)

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The total thermal budget of the wafer fabrication process for structures with multilevel Cu/low-k interconnects has been increasing, and itseffect on the electromigration (EM) reliability of the lower-level interconnects has become a concern. The annealing of packaged samples including two-level interconnects for EM tests was shown here to be an effective method of evaluating the effect of the thermal budget on interconnects. EM lifetime was reduced by postannealing at the maximum process temperature (350 °C), and its failure mode was a slitlike void generated at the interface between the via and the Cu line. It was shown that the degradation mechanism was related to the contact between the via and the Cu line and that postannealing may affect the stress at this contact by changing the stress in the dielectric interlayer film.

元の言語English
記事番号046507
ジャーナルJapanese Journal of Applied Physics
48
発行部数4
DOI
出版物ステータスPublished - 2009 4 1

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ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

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