Design of electrostatic adhesion device using the flexible electrodes

Akifumi Takada, Shingo Nakamura, Yoko Yamanishi, Shinji Hashimura, Sumito Nagasawa, Takanobu Kogure, Shingo Maeda

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

This paper presents a fabrication method of electrostatic adhesion device using flexible electrodes. When an electric charge is stored in the bipolar plate of a capacitor, an electrostatic force acts. We perform adhesion to a wall surface using this electrostatic force. Using the electrostatic force, electrostatic adhesion force is controlled by the electricity. The flexible electrodes are created by spraying a solution containing dispersed carbon black onto a silicon rubber. Flexibility of the device can avoid damage to its own and adapt to a variety of wall surface shapes. In experiments, two kinds of device surface structures were created. One is just flat and the other is pillar arrays. The pillar arrays structure was adopted from the viewpoint of biomimetic. Electrostatic adhesion force of these structures was measured with shear and tensile testing machines.

本文言語English
ホスト出版物のタイトル2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014
出版社Institute of Electrical and Electronics Engineers Inc.
ISBN(印刷版)9781479966790
DOI
出版ステータスPublished - 2015 1 9
イベント2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014 - Nagoya, Japan
継続期間: 2014 11 102014 11 12

Other

Other2014 International Symposium on Micro-NanoMechatronics and Human Science, MHS 2014
国/地域Japan
CityNagoya
Period14/11/1014/11/12

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 機械工学

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