Development of crack-free plastic package - evaluation of high reliability of CSS (Chip Side Support) structure

Yumi Inoue, Tsutomu Nakazawa, Kanako Sawada, Toshio Sudo

研究成果: Paper査読

抄録

Package cracking during reflow soldering is a critical issue for the reliability of plastic encapsulated semiconductor devices. In the case of a conventional package structure, the adhesion strength at the interface between the metal die-pad and the resin drops rapidly for high temperature and humidity. This is a major cause of package cracking. So, a new packaging structure, the chip side support (CSS) structure was introduced. The reliability of the CSS structure package was evaluated by executing the adhesion strength measurement of the interface in the packages, reflow soldering test, temperature cycle test (TCT) and high humidity storage test. The results of these tests indicated that the CSS structure package was superior to conventional packages. The CSS structure package realizes a crack-free package without moisture-proof packing by dispensing with the die-pad and adopting a thinner package thickness.

本文言語English
ページ407-410
ページ数4
出版ステータスPublished - 1995 12 1
イベントProceedings of the 1995 IEEE/CPMT 18th International Electronic Manufacturing Technology - Omiya, Jpn
継続期間: 1995 12 41995 12 6

Other

OtherProceedings of the 1995 IEEE/CPMT 18th International Electronic Manufacturing Technology
CityOmiya, Jpn
Period95/12/495/12/6

ASJC Scopus subject areas

  • 産業および生産工学
  • 電子工学および電気工学

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