Direct bonding between laser wafers and magneto-optic waveguides

Hideki Yokoi, Tetsuya Mizumoto, Koichi Maru, Yoshiyuki Naito

研究成果: Paper査読

抄録

Wafer direct bonding is an attractive technique for the integration of different materials. In a previous study, the bonding between InP and several kinds of garnets which are essential to an optical isolator was demonstrated. When the optical isolator is integrated with the laser wafer as shown in Fig. 1, the surface of garnet wafer where a rib waveguide is formed is to be bonded with an etch stop layer for the vertical alignment. This paper reports the direct bonding between GaInAsP etch stop layer and Gd3Ga5O12 (GGG) which is used as a substrate for magneto-optic crystal growth. The bonding is also described between InP and the garnet rib waveguide.

本文言語English
ページ数1
出版ステータスPublished - 1996 1 1
外部発表はい
イベントProceedings of the 1996 Conference on Lasers and Electro-Optics Europe, CLEO/Europe - Hamburg, Ger
継続期間: 1996 9 81996 9 13

Other

OtherProceedings of the 1996 Conference on Lasers and Electro-Optics Europe, CLEO/Europe
CityHamburg, Ger
Period96/9/896/9/13

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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