Effect of Aging on Tensile Properties of Low-Melting Lead-Free Solders Evaluated by Micro Size Specimen

Ikuo Shohji, Tsutomu Osawa, Takashige Matsuki, Kiyokazu Yasuda, Tadashi Takemoto, Yoshiharu Kariya

研究成果 › 査読

本文言語	English
ページ（範囲）	99-102
ジャーナル	Smart Processing Technology, High Temperature Society of Japan
出版ステータス	Published - 2008 3月 1

引用スタイル

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title = "Effect of Aging on Tensile Properties of Low-Melting Lead-Free Solders Evaluated by Micro Size Specimen",

author = "Ikuo Shohji and Tsutomu Osawa and Takashige Matsuki and Kiyokazu Yasuda and Tadashi Takemoto and Yoshiharu Kariya",

year = "2008",

month = mar,

day = "1",

language = "English",

pages = "99--102",

journal = "Smart Processing Technology, High Temperature Society of Japan",

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TY - JOUR

T1 - Effect of Aging on Tensile Properties of Low-Melting Lead-Free Solders Evaluated by Micro Size Specimen

AU - Shohji, Ikuo

AU - Osawa, Tsutomu

AU - Matsuki, Takashige

AU - Yasuda, Kiyokazu

AU - Takemoto, Tadashi

AU - Kariya, Yoshiharu

PY - 2008/3/1

Y1 - 2008/3/1

M3 - Article

SP - 99

EP - 102

JO - Smart Processing Technology, High Temperature Society of Japan

JF - Smart Processing Technology, High Temperature Society of Japan

ER -