Effect of Bismuth and Copper on the Creep Properties of Sn-3.5Ag Solder Alloy

Kentarou Atsumi, Yoshiharu Kariya, Masahisa Ostuka

研究成果: Article

元の言語English
ジャーナルDefault journal
出版物ステータスPublished - 1999 2 1

これを引用

Effect of Bismuth and Copper on the Creep Properties of Sn-3.5Ag Solder Alloy. / Atsumi, Kentarou; Kariya, Yoshiharu; Ostuka, Masahisa.

:: Default journal, 01.02.1999.

研究成果: Article

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