Effect of bismuth on the isothermal fatigue properties of Sn-3.5mass%Ag solder alloy

Physics & Astronomy

• fatigue life 99%
• solders 83%
• bismuth 73%
• ductility 31%
• eutectics 30%
• cycles 21%
• lead alloys 14%
• eutectic alloys 13%
• tensile tests 10%
• tensile strength 10%
• tin 9%
• hardening 9%
• solid solutions 8%
• plastics 8%
• room temperature 5%

Engineering & Materials Science

• Bismuth 100%
• Soldering alloys 73%
• Fatigue of materials 51%
• Eutectics 44%
• Ductility 28%
• Tin 12%
• Solid solutions 12%
• Hardening 9%
• Lead 9%
• Plastic deformation 9%
• Tensile strength 8%
• Temperature 4%

Chemical Compounds

• Solder 92%
• Eutectics 60%
• Ductility 52%
• Alloy 52%
• Strain 20%
• Reduction 13%
• Tensile Strength 12%
• Solid Solution 12%
• Ambient Reaction Temperature 8%