Effect of citric acid and EDTA addition on Cu-In alloy electrochemical deposition

Takahiro Ishizaki, Nagahiro Saito, Akio Fuwa

研究成果: Article

1 引用 (Scopus)

抜粋

The standard electrode potential for Cu is 0.34 V and that of In is -0.34 V, which means that their deposition potentials are far apart, making the co-deposition difficult from a simple solution containing Cu and In ions. In order to bring these deposition potentials closer, a complex forming reagent of citric or EDTA is added to the CuSO4-In2(SO4)3 solution. The effect of these reagents was examined by linear sweep voltammetric measurement. An electrochemical deposition experiment of Cu-In alloy was conducted where effect citric acid or EDTA addition, current density and Cu concentration were examined.

元の言語English
ページ(範囲)867-870
ページ数4
ジャーナルMaterials Transactions, JIM
40
発行部数9
DOI
出版物ステータスPublished - 1999 1 1

ASJC Scopus subject areas

  • Engineering(all)

フィンガープリント Effect of citric acid and EDTA addition on Cu-In alloy electrochemical deposition' の研究トピックを掘り下げます。これらはともに一意のフィンガープリントを構成します。

  • これを引用