Effect of cyclic strain-hardening exponent on fatigue ductility exponent for Sn based alloy

Yoshihiko Kanda, Yuji Oto, Yusuke Shiigi, Yoshiharu Kariya

研究成果: Conference contribution

抜粋

The influence of cyclic strain-hardening exponents on fatigue ductility exponents for Sn-Bi solid solution alloys and Sn-Ag-Cu microsolder joints was investigated. In Sn-Bi solid solution alloys, the fatigue ductility exponent in Coffin-Manson's law was confirmed to increase with a decrease in the cyclic strain-hardening exponent. On the other hand, in the Sn-Ag-Cu miniature solder joint, the fatigue ductility exponent increases with a rise in temperature and strain holding. Thus, the fatigue ductility exponents are closely related to the cyclic strain-hardening exponent: the former increases due to the depression of the latter with a rise in temperature and increase in intermetallic compound particle size during strain holding. The results differ for the creep damage mechanism (grain boundary fracture), which is the main reason for the life depression in large-size specimens.

元の言語English
ホスト出版物のタイトルASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
ページ713-718
ページ数6
DOI
出版物ステータスPublished - 2011 12 1
イベントASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 - Portland, OR, United States
継続期間: 2011 7 62011 7 8

出版物シリーズ

名前ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
2

Conference

ConferenceASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
United States
Portland, OR
期間11/7/611/7/8

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • これを引用

    Kanda, Y., Oto, Y., Shiigi, Y., & Kariya, Y. (2011). Effect of cyclic strain-hardening exponent on fatigue ductility exponent for Sn based alloy. : ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 (pp. 713-718). (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011; 巻数 2). https://doi.org/10.1115/IPACK2011-52107