Effect of Fatigue Crack Network in Die-attach Joints on Thermal Resistance

Koki Ochi, Yoshinori Yokoyama, Ryuichiro Hanada, Shinichi Izuo, Kazuyasu Nishikawa, Hiroki Kanai, Yoshiki Abe, Yoshiharu Kariya

研究成果: Conference contribution

抄録

We evaluated the effect of fatigue crack networks in die-attach joints on the thermal resistance Rt and found singular rise of Rt in the final phase of fatigue crack networks formation. Structure of samples was Si/Solder/Si joints, and Sn-based lead-free solder alloys were used for the die-attach materials. We conducted thermal cycling tests and measured Rt, vertical crack density and thickness of die-attach joints before/after the tests. Then, we calculated rise of Rt due to vertical cracks and found that increase of measured Rt became twice larger than calculated one in the final phase of fatigue crack networks formation.

本文言語English
ホスト出版物のタイトルPCIM Asia 2022 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Proceedings
出版社VDE Verlag GmbH
ページ116-120
ページ数5
ISBN(電子版)9783800759125
出版ステータスPublished - 2022
イベント2022 International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Asia 2022 - Shanghai, China
継続期間: 2022 10月 262022 10月 27

出版物シリーズ

名前PCIM Asia 2022 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Proceedings

Conference

Conference2022 International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Asia 2022
国/地域China
CityShanghai
Period22/10/2622/10/27

ASJC Scopus subject areas

  • 人工知能
  • ハードウェアとアーキテクチャ
  • エネルギー工学および電力技術
  • 再生可能エネルギー、持続可能性、環境
  • 電子工学および電気工学

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