Effect of joint size on low-cycle fatigue properties of Sn-Ag-Cu solder joint

Yoshiharu Kariya, Kana Sato, Shota Asari, Yoshihiko Kanda

研究成果: Conference contribution

7 被引用数 (Scopus)

抄録

The influence of the joint size on low cycle fatigue characteristic of Sn-Ag-Cu has been investigated by a miniature joint specimen fabricated using micro solder balls. The influence of the size on crack initiation life is not remarkable, while the life which reaches complete failure reduces greatly when the ball size is decreased less than 150μm. The reduction in life is due to that the crack propagation stage does not appear and complete failure occurs simultaneously with the crack initiation in the ball size less than 150μm. The failure in the smallest size is induced by formation of subgrain boundary formation that occurs in whole area of the joint.

本文言語English
ホスト出版物のタイトル2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
DOI
出版ステータスPublished - 2010 8 9
イベント2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010 - Las Vegas, NV, United States
継続期間: 2010 6 22010 6 5

出版物シリーズ

名前2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010

Conference

Conference2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
国/地域United States
CityLas Vegas, NV
Period10/6/210/6/5

ASJC Scopus subject areas

  • 制御およびシステム工学
  • 電子工学および電気工学

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