Effect of Ni addition on bending properties of Sn-Ag-Cu lead-free solder joints

Takayuki Kobayashi, Yoshiharu Kariya, Tsutomu Sasaki, Masamoto Tanaka, Kohei Tatsumi

研究成果: Conference contribution

7 被引用数 (Scopus)

抄録

Effect of Ni addition on the bending properties of Sn-Ag-Cu lead-free solder joints was investigated. Three point bending tests were conducted with a 324pin flip chip specimen at 10 Hz frequency and with 3mm substrate displacement. The test temperatures were 298K and 398K. At each temperature, Sn-1.2Ag-0.5Cu with a small amount of Ni addition, LF35 showed higher performance. The reason LF35 showed higher bending performance was discussed based on a mechanical fatigue test using a micro bulk specimen. Ni addition caused a fine subgrain of β-Sn, hence the crack propagation mechanism is changed, resulting in the improved fatigue performance of LF35.

本文言語English
ホスト出版物のタイトルProceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
ページ684-688
ページ数5
DOI
出版ステータスPublished - 2007
イベント57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV, United States
継続期間: 2007 5 292007 6 1

出版物シリーズ

名前Proceedings - Electronic Components and Technology Conference
ISSN(印刷版)0569-5503

Conference

Conference57th Electronic Components and Technology Conference 2007, ECTC '07
国/地域United States
CitySparks, NV
Period07/5/2907/6/1

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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