抄録
The mechanical shear fatigue test has been performed to study the effect of silver content on the fatigue properties of Sn-xAg-0.5Cu (x = 1, 2, 3, and 4) for flip-chip interconnections. The strength of the solder alloy increases with increasing silver content, preventing shear plastic deformation of the solder bump. The flip-chip joints made using higher silver content solder, such as 3%Ag and 4%Ag, exhibit longer fatigue life for all conditions. The fatigue ductility of the solder decreases with an increase in the silver content. The fatigue endurance of 1%Ag solder is superior to other solders over the plastic strain range of 3%, even though the strength of the solder is the lowest in the solders tested. Based on this study, the 3Ag solder may exhibit good fatigue performance for all conditions, and the 1Ag solder is optimum for severe strain conditions.
| 元の言語 | English |
|---|---|
| ページ（範囲） | 321-328 |
| ページ数 | 8 |
| ジャーナル | Journal of Electronic Materials |
| 巻 | 33 |
| 発行部数 | 4 |
| 出版物ステータス | Published - 2004 4 |
| 外部発表 | Yes |
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ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
- Materials Science(all)
- Physics and Astronomy (miscellaneous)
これを引用
Effect of Silver Content on the Shear Fatigue Properties of Sn-Ag-Cu Flip-Chip Interconnects. / Kariya, Yoshiharu; Hosoi, Takuya; Terashima, Shinichi; Tanaka, Masamoto; Otsuka, Masahisa.
：: Journal of Electronic Materials, 巻 33, 番号 4, 04.2004, p. 321-328.研究成果: Article
}
TY - JOUR
T1 - Effect of Silver Content on the Shear Fatigue Properties of Sn-Ag-Cu Flip-Chip Interconnects
AU - Kariya, Yoshiharu
AU - Hosoi, Takuya
AU - Terashima, Shinichi
AU - Tanaka, Masamoto
AU - Otsuka, Masahisa
PY - 2004/4
Y1 - 2004/4
N2 - The mechanical shear fatigue test has been performed to study the effect of silver content on the fatigue properties of Sn-xAg-0.5Cu (x = 1, 2, 3, and 4) for flip-chip interconnections. The strength of the solder alloy increases with increasing silver content, preventing shear plastic deformation of the solder bump. The flip-chip joints made using higher silver content solder, such as 3%Ag and 4%Ag, exhibit longer fatigue life for all conditions. The fatigue ductility of the solder decreases with an increase in the silver content. The fatigue endurance of 1%Ag solder is superior to other solders over the plastic strain range of 3%, even though the strength of the solder is the lowest in the solders tested. Based on this study, the 3Ag solder may exhibit good fatigue performance for all conditions, and the 1Ag solder is optimum for severe strain conditions.
AB - The mechanical shear fatigue test has been performed to study the effect of silver content on the fatigue properties of Sn-xAg-0.5Cu (x = 1, 2, 3, and 4) for flip-chip interconnections. The strength of the solder alloy increases with increasing silver content, preventing shear plastic deformation of the solder bump. The flip-chip joints made using higher silver content solder, such as 3%Ag and 4%Ag, exhibit longer fatigue life for all conditions. The fatigue ductility of the solder decreases with an increase in the silver content. The fatigue endurance of 1%Ag solder is superior to other solders over the plastic strain range of 3%, even though the strength of the solder is the lowest in the solders tested. Based on this study, the 3Ag solder may exhibit good fatigue performance for all conditions, and the 1Ag solder is optimum for severe strain conditions.
KW - BGA joints
KW - Fatigue life
KW - Flip chip
KW - Lead-free solder
KW - Life prediction
KW - Silver content
KW - Sn-Ag-Cu
UR - http://www.scopus.com/inward/record.url?scp=2342640135&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=2342640135&partnerID=8YFLogxK
M3 - Article
AN - SCOPUS:2342640135
VL - 33
SP - 321
EP - 328
JO - Journal of Electronic Materials
JF - Journal of Electronic Materials
SN - 0361-5235
IS - 4
ER -