Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy

Takuma Sato, Yoshiharu Kariya, Kazuma Fukui

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

In this study, the effects of temperature and strain rate on low cycle fatigue life of Bi-Sn eutectic alloys have been studied. The fatigue life improves with the increasing of temperature and the decreasing of strain rate. This is a reverse phenomenon from characteristics found in general metals. As temperature increases and strain rate decreases, grin boundary sliding becomes the dominant deformation mechanism and the fatigue ductility coefficient increases, resulting in an improvement of fatigue life. To the extent of this study, dependence on temperature and strain rate can be expressed by Manson-Coffin's law modified using Z-parameters.

本文言語English
ホスト出版物のタイトルASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
DOI
出版ステータスPublished - 2013 12 1
イベントASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 - Burlingame, CA, United States
継続期間: 2013 7 162013 7 18

出版物シリーズ

名前ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
1

Conference

ConferenceASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
国/地域United States
CityBurlingame, CA
Period13/7/1613/7/18

ASJC Scopus subject areas

  • 電子工学および電気工学
  • コンピュータ ネットワークおよび通信
  • コンピュータ サイエンスの応用
  • ハードウェアとアーキテクチャ
  • 情報システム
  • 電子材料、光学材料、および磁性材料

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