Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy

Takuma Sato, Yoshiharu Kariya, Kazuma Fukui

研究成果: Conference contribution

抜粋

In this study, the effects of temperature and strain rate on low cycle fatigue life of Bi-Sn eutectic alloys have been studied. The fatigue life improves with the increasing of temperature and the decreasing of strain rate. This is a reverse phenomenon from characteristics found in general metals. As temperature increases and strain rate decreases, grin boundary sliding becomes the dominant deformation mechanism and the fatigue ductility coefficient increases, resulting in an improvement of fatigue life. To the extent of this study, dependence on temperature and strain rate can be expressed by Manson-Coffin's law modified using Z-parameters.

元の言語English
ホスト出版物のタイトルASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
DOI
出版物ステータスPublished - 2013 12 1
イベントASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 - Burlingame, CA, United States
継続期間: 2013 7 162013 7 18

出版物シリーズ

名前ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
1

Conference

ConferenceASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
United States
Burlingame, CA
期間13/7/1613/7/18

    フィンガープリント

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Computer Networks and Communications
  • Computer Science Applications
  • Hardware and Architecture
  • Information Systems
  • Electronic, Optical and Magnetic Materials

これを引用

Sato, T., Kariya, Y., & Fukui, K. (2013). Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy. : ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 (ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013; 巻数 1). https://doi.org/10.1115/IPACK2013-73193