In this paper, we report on a study of the effects of temperature and strain rate on the low-cycle fatigue life of the Bi-Sn eutectic alloys. The fatigue life improves with increasing temperature and decreasing strain rate. This is the reverse of characteristics found in most metals. As temperature increases and strain rate decreases, grain boundary sliding becomes the dominant deformation mechanism and the fatigue ductility coefficient increases, resulting in an improvement of fatigue life. Within the parameters of this study, the dependence on temperature and strain rate can be expressed by Manson-Coffin's law modified using Z-parameters.
|ジャーナル||Journal of Japan Institute of Electronics Packaging|
|出版ステータス||Published - 2013|
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