Quad flat packages with a leadframe made of copper, or alloy 42 are widely used for CMOS digital applications. To investigate the relationship between package inductance and switching noise, three types of leadframe materials, Cu, alloy 42, and Ag-plated alloy 42 were tested for frequency-dependent properties. Experiments were executed by using a CMOS noise generating chip to measure how leadframe materials influence switching noise in conjunction with output buffer characteristics. Alloy 42 showed high permeability of ferromagnetics, making it unsuitable for high-speed CMOS applications. Measured values of inductance and resistance corresponding to the frequency of the edge rate were used in modeling the leadframe packages.
|ジャーナル||Proceedings - Electronic Components and Technology Conference|
|出版ステータス||Published - 1995 1月 1|
|イベント||Proceedings of the 1995 45th Electronic Components & Technology Conference - Las Vegas, NV, USA|
継続期間: 1995 5月 21 → 1995 5月 24
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