Electrical design and characterization of Si interposer for system-in-package (SiP)

Shinobu Kato, Tomoyuki Tango, Kiyohisa Hasegawa, Ramesh K. Bhandari, Atsushi Sakai, Hiroshi Segawa, Takashi Kariya, Toshio Sudo

研究成果: Conference contribution

8 引用 (Scopus)

抜粋

Si interposer technology has the potential to enable highbandwidth and low-power image processing devices of the future, because a very high density system with an ultra-fine pitch (≤5um) wiring can be fabricated. However, the ultrafine pitch wiring may adversely affect the electrical performance of devices. This paper discusses the signal propagation properties of ultra-fine coplanar interconnects on Si interposers. A design chart of the interconnects, obtained from the viewpoint of maximum line length versus target operating frequency, is presented.

元の言語English
ホスト出版物のタイトル2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009
ページ1648-1653
ページ数6
DOI
出版物ステータスPublished - 2009
イベント2009 59th Electronic Components and Technology Conference, ECTC 2009 - San Diego, CA, United States
継続期間: 2009 5 262009 5 29

出版物シリーズ

名前Proceedings - Electronic Components and Technology Conference
ISSN(印刷物)0569-5503

Conference

Conference2009 59th Electronic Components and Technology Conference, ECTC 2009
United States
San Diego, CA
期間09/5/2609/5/29

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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  • これを引用

    Kato, S., Tango, T., Hasegawa, K., Bhandari, R. K., Sakai, A., Segawa, H., Kariya, T., & Sudo, T. (2009). Electrical design and characterization of Si interposer for system-in-package (SiP). : 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009 (pp. 1648-1653). [5074236] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2009.5074236